Composition for forming conductive pattern, method for forming conductive pattern using same, and resin structure having conductive pattern

Patent metadata

Field	Value
Publication number	US-9872386-B2
Application number	US-201515503637-A
Country	US
Kind code	B2
Filing date	Sep 1, 2015
Priority date	Sep 11, 2014
Publication date	Jan 16, 2018
Grant date	Jan 16, 2018

Abstract

The present invention relates to a composition for forming a conductive pattern which allows micro conductive patterns to be formed on various polymeric resin products or resin layers by a very simplified process, a method for forming a conductive pattern using the composition, and a resin structure having the conductive pattern. The composition for forming a conductive pattern comprises: a polymeric resin; and a nonconductive metallic compound including a first metal, a second metal and a third metal, wherein the nonconductive metallic compound has a three-dimensional structure including a plurality of first layers (edge-shared octahedral layers) having a structure in which octahedrons comprising two metals from among the first metal, the second metal and the third metal which share the edges thereof with one another are two-dimensionally connected to one other, and a second layer which includes a metal of a different type from the first layer and is arranged between adjacent first layers, and wherein a metallic core including the first metal, the second metal or the third metal or an ion thereof is formed from the nonconductive metallic compound by electromagnetic radiation.

First claim

The invention claimed is:

1. A composition for forming a conductive pattern by electromagnetic irradiation, comprising:
a polymer resin; and
a non-conductive metal compound comprising a first metal, a second metal, and a third metal, the non-conductive metal compound having a three-dimensional structure comprising a plurality of first layers that comprises two metals of the first metal, the second metal, and the third metal and has edge-shared octahedrons two-dimensionally connected to each other, and a second layer that comprises a metal different from that of the first layer and is arranged between the neighboring first layers, wherein a metal core including the first metal, second metal, or third metal, or an ion thereof is formed from the non-conductive metal compound by electromagnetic irradiation.

2. The composition for forming the conductive pattern by electromagnetic irradiation of claim 1 , wherein the metals comprised in the second layer of the non-conductive metal compound connect the two-dimensional structures to each other by connecting vertices of the octahedrons to each other between the neighboring first layers.

3. The composition for forming the conductive pattern by electromagnetic irradiation of claim 1 , wherein the non-conductive metal compound has a space group of R 3 m or P6 3 /mmc.

4. The composition for forming the conductive pattern by electromagnetic irradiation of claim 1 , wherein the non-conductive metal compound comprises a compound represented by the following Chemical Formula 1:
A 3 (BC 2 )X 6   [Chemical Formula 1]

wherein A, B and C represent each independently the first metal, the second metal, and the third metal, A is one or more metals selected from the group consisting of Cu, Ag and Au, B is one or more metals selected from the group consisting of Ni, Co and Fe, C is V, and X is oxygen, nitrogen, or sulfur.

5. The composition for forming the conductive pattern by electromagnetic irradiation of claim 1 , wherein the non-conductive metal compound comprises one or more compounds selected from the group consisting of Cu 3 (NiV 2 )O 6 , Ag 3 (NiV 2 )O 6 , Au 3 (NiV 2 )O 6 , Cu 3 (CoV 2 )O 6 , Cu 3 (FeV 2 )O 6 , Ag 3 (CoV 2 )O 6 , Ag 3 (FeV 2 )O 6 , Au 3 (CoV 2 )O 6 and Au 3 (FeV 2 )O 6 .

6. The composition for forming the conductive pattern by electromagnetic irradiation of claim 1 , wherein the polymer resin comprises a thermosetting resin or a thermoplastic resin.

7. The composition for forming the conductive pattern by electromagnetic irradiation of claim 1 , wherein the non-conductive metal compound is comprised in an amount of 1% by weight to 10% by weight, based on the total composition.

8. The composition for forming the conductive pattern by electromagnetic irradiation of claim 1 , further comprising one or more additives selected from the group consisting of a heat stabilizer, a UV stabilizer, a flame retardant, a lubricant, an antioxidant, an inorganic filler, a color additive, an impact modifier, and a functional modifier.

9. A method of forming a conductive pattern by direct electromagnetic irradiation, the method comprising:
molding the composition for forming the conductive pattern of claim 1 to a resin product or applying it to another product to form a resin layer;
irradiating an electromagnetic wave to a predetermined region of the resin product or the resin layer to generate a metal core comprising the first metal, second metal, or third metal or the ion thereof from the non-conductive metal compound; and
chemically reducing or plating the region generating the metal core to form a conductive metal layer.

10. The method of forming the conductive pattern by direct electromagnetic irradiation of claim 9 , wherein in the generating of the metal core, a laser electromagnetic wave having a wavelength ranging from 200 nm to 11,000 nm is irradiated at an average power of 3 W to 20 W.

11. The method of forming the conductive pattern by direct electromagnetic irradiation of claim 9 , wherein the conductive metal layer is formed on the adhesion-activated surface by chemical reduction of the first metal, second metal or third metal ions in the metal core, or by electroless plating thereof.

12. The method of forming the conductive pattern by direct electromagnetic irradiation of claim 9 , wherein in the reducing or plating, a predetermined region on which the metal core is generated is treated with an acidic or basic solution comprising a reducing agent.

13. The method of forming the conductive pattern by direct electromagnetic irradiation of claim 12 , wherein the reducing agent comprises one or more selected from the group consisting of formaldehyde, hypophosphite, dimethylamino borane (DMAB), diethylamino borane (DEAB), and hydrazine.

14. A resin structure having a conductive pattern, comprising:
a polymer resin substrate;
a non-conductive metal compound that comprises a first metal, a second metal, and a third metal, and is dispersed in the polymer resin substrate, the non-conductive metal compound having a three-dimensional structure comprising a plurality of first layers that comprises two metals of the first metal, the second metal, and the third metal and has edge-shared octahedrons two-dimensionally connected to each other, and a second layer that comprises a metal different from that of the first layer and is arranged between the neighboring first layers;
an adhesion-activated surface having a metal core comprising the first metal, second metal or third metal, or the ion thereof which is exposed on the surface of the predetermined region of the polymer resin substrate; and
a conductive metal layer formed on the adhesion-activated surface.

15. The resin structure having the conductive pattern of claim 14 , wherein the predetermined region where the adhesion-activated surface and the conductive metal layer are formed corresponds to the region of the polymer resin substrate to which an electromagnetic wave is irradiated.

Assignees

• Lg Chemical Ltd

Inventors

• Park Chee-Sung
• Park Cheol-Hee
• Lee Ha Na
• Jeong Han Nah
• Kim Jae Hyun
• Jun Shin Hee
• Seong Eun Kyu
• Lee Su Jeong

Classifications

• C23C18/2013

  by mechanical pretreatment, e.g. grinding, sanding · CPC title

• C08J2369/00

  Characterised by the use of polycarbonates; Derivatives of polycarbonates · CPC title

• C08J7/123

  Treatment by wave energy or particle radiation (C08J7/18 takes precedence) · CPC title

• C08K2003/2248

  of copper · CPC title

• H05K3/105

  by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam · CPC title