Silver-containing film and method for producing same
US-2024279816-A1 · Aug 22, 2024 · US
Contact connection structure for removing oxide buildup
US9871311B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9871311-B2 |
| Application number | US-201615290007-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 11, 2016 |
| Priority date | Apr 24, 2014 |
| Publication date | Jan 16, 2018 |
| Grant date | Jan 16, 2018 |
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- Title
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- Abstract
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- Assignees and inventors
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- First independent claim
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Abstract
Official abstract text for this publication.
A contact connection structure includes: a first contact portion including an indent portion spherically protruding, the first contact portion including a plating layer formed on a surface of the first contact portion; and a second contact portion including a plating layer formed on a surface of the second contact portion. The indent portion of the first contact portion is slidable on a contact surface of the second contact portion. The indent portion of the first contact portion at a terminal insertion completed position is in contact with the second contact portion. The contact surface of the second contact portion includes an oxide-film shaving portion having an annular arc portion curved along a circumference portion of the indent portion.
First claim
Opening claim text (preview).
What is claimed is: 1. A contact connection structure comprising: a first contact portion including an indent portion spherically protruding toward a second contact portion, the first contact portion including a plating layer formed on an outer surface of the first contact portion including the indent portion; and the second contact portion including a plating layer formed on a surface of the second contact portion, wherein the indent portion of the first contact portion and a contact surface of the second contact portion are slidable on each other, the contact surface of the second contact portion includes an oxide-film shaving portion having an annular arc portion that makes contact along a circumference portion of the indent portion, and the indent portion of the first contact portion is in contact with the oxide-film shaving portion of the second contact portion at a terminal insertion completed position. 2. The contact connection structure according to claim 1 , wherein the oxide-film shaving portion has a protruding shape with a leading end of the oxide-film shaving portion having an acute angle. 3. The contact connection structure according to claim 1 , wherein the oxide-film shaving portion comprises an annular groove portion having an edge portion as the annular arc portion. 4. The contact connection structure according to claim 1 , wherein the outer surface of the first contact portion including the indent portion comprises a base material upon which the plating layer is formed, an outer surface of the base material provided with an unevenness formed thereon to inhibit movement of the plating layer. 5. The contact connection structure according to claim 4 , wherein the unevenness is regularly arranged lengthwise and crosswise. 6. The contact connection structure according to claim 4 , wherein the unevenness is randomly arranged.
Assignees
Inventors
Classifications
co-operating with sockets having a circular transverse section · CPC title
Resiliently-mounted rigid sockets · CPC title
conductive elastomers · CPC title
Pins or blades for co-operation with sockets · CPC title
for elastomeric connecting elements · CPC title
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US9871311B2 cover?
- A contact connection structure includes: a first contact portion including an indent portion spherically protruding, the first contact portion including a plating layer formed on a surface of the first contact portion; and a second contact portion including a plating layer formed on a surface of the second contact portion. The indent portion of the first contact portion is slidable on a contact…
- Who is the assignee on this patent?
- Yazaki Corp
- What technology area does this patent fall under?
- Primary CPC classification H01R13/03. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jan 16 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).