Organic light emitting device comprising flexible substrate and method for preparing thereof

Patent metadata

Field	Value
Publication number	US-9871228-B2
Application number	US-201314647758-A
Country	US
Kind code	B2
Filing date	Nov 15, 2013
Priority date	Nov 30, 2012
Publication date	Jan 16, 2018
Grant date	Jan 16, 2018

Abstract

The present application relates to an organic light emitting device including a flexible substrate, and a preparing method thereof, and the method includes: 1) forming a polyimide layer on a carrier substrate; 2) forming a plastic substrate on the carrier substrate and the polyimide layer; 3) forming an organic light emitting device on the plastic substrate; and 4) separating the carrier substrate.

First claim

The invention claimed is:

1. A method for preparing a flexible organic light emitting device, comprising:
1) forming and patterning a polyimide layer on a carrier substrate;
2) surface treating the carrier substrate and the polyimide layer;
3) forming a plastic substrate on a surface treated polyimide layer to have a wider area than that of the surface treated polyimide layer;
4) forming an organic light emitting device on the plastic substrate; and
5) separating the carrier substrate,
wherein the polyimide layer is a photosensitive polyimide layer, and
wherein the plastic substrate of step 3) is in contact with both a surface treated carrier substrate and the surface treated polyimide layer.

2. The method of claim 1 , wherein the polyimide layer of step 1) is formed on a region of the carrier substrate on which the organic light emitting device is formed.

3. The method of claim 1 , wherein the polyimide layer of step 1) is formed by coating and hardening a polyamic acid composition.

4. The method of claim 1 , wherein the surface treatment uses a silane coupling agent surface treatment method, a corona surface treatment method, or a plasma surface treatment method on the carrier substrate and the polyimide layer.

5. The method of claim 1 , wherein the carrier substrate is a glass substrate, a metal substrate, or a plastic substrate.

6. The method of claim 1 , wherein a thickness of the carrier substrate is from 0.5 to 0.7 mm.

7. The method of claim 1 , wherein step 3) is performed by a process of laminating the plastic substrate on the carrier substrate and the polyimide layer.

8. The method of claim 1 , wherein the plastic substrate is selected from the group consisting of polyethylene terephthalate (PET), polyester, polycarbonate (PC), polyimide (PI), polyethylene naphthalate (PEN), polyether ether ketone (PEEK), polyarylate (PAR), polycyclicolefin (PCO), polynorbornene, polyethersulphone (PES), and cycloolefin polymer (COP).

9. The method of claim 1 , wherein the plastic substrate includes a polyimide film, and step 3) is performed by a process of a coating polyamic acid composition on the surface treated carrier substrate and the surface treated polyimide layer and hardening the polyamic acid composition to form a polyimide film.

10. The method of claim 1 , wherein the plastic substrate of step 3) has the same area as that of the carrier substrate.

11. The method of claim 1 , further comprising:
encapsulating the organic light emitting device after step 4).

12. The method of claim 1 , wherein a method of separating the carrier substrate of step 5) uses a knife or laser.

13. The method of claim 1 , further comprising:
removing the surface treated polyimide layer simultaneously with or after step 5).

14. A flexible organic light emitting device manufactured by the method for preparing the organic light emitting device, comprising:
1) forming and patterning a polyimide layer on a carrier substrate;
2) surface treating the carrier substrate and the polyimide layer;
3) forming a plastic substrate on a surface treated polyimide layer to have a wider area than that of the surface treated polyimide layer;
4) forming an organic light emitting device on the plastic substrate; and
5) separating the carrier substrate,
wherein the polyimide layer is a photosensitive polyimide layer, and
wherein the plastic substrate of step 3) is in contact with both a surface treated carrier substrate and the surface treated polyimide layer.

15. The flexible organic light emitting device of claim 14 , further comprising:
a silane coupling agent on at least one portion between the polyimide layer and the plastic substrate.

16. The flexible organic light emitting device of claim 14 , further comprising:
a light extraction layer between the plastic substrate and the organic light emitting device.

17. The flexible organic light emitting device of claim 16 , further comprising:
a planarization layer on the light extraction layer.

18. The flexible organic light emitting device of claim 14 , comprising:
a plastic substrate; and
an organic light emitting device formed on the plastic substrate,
wherein a silane coupling agent is included in at least one portion of a lower surface of the plastic substrate.

19. The flexible organic light emitting device of claim 18 , further comprising:
a light extraction layer between the plastic substrate and the organic light emitting device.

20. The flexible organic light emitting device of claim 19 , further comprising:
a planarization layer on the light extraction layer.

21. A display device comprising the flexible organic light emitting device of claim 14 .

22. A lighting device comprising the flexible organic light emitting device of claim 14 .

Assignees

• Lg Display Co Ltd

Inventors

• Lee Jung Hyoung
• Choi Junrye
• Kim Jihee

Classifications

• B32B17/064

  Operations & Transport · mapped topic

• H01L51/0097

  Electricity · mapped topic

• H01L2251/558

  Electricity · mapped topic

• H01L51/0024

  Electricity · mapped topic

• B32B7/06

  permitting easy separation · CPC title