Multipole PCB with small robotically installed rod segments

Patent metadata

Field	Value
Publication number	US-9870906-B1
Application number	US-201615242291-A
Country	US
Kind code	B1
Filing date	Aug 19, 2016
Priority date	Aug 19, 2016
Publication date	Jan 16, 2018
Grant date	Jan 16, 2018

Abstract

A radio frequency multipole assembly includes first and second printed circuit boards. Each printed circuit board includes a substrate, at least two rows of conductive pads, and a plurality of tiles affixed to the conductive pads to form at least two radio frequency rods of a radio frequency multipole. The first and second printed circuit boards are arranged with the radio frequency rods towards each other and aligned to for the radio frequency multipole.

First claim

What is claimed is:

1. An radio frequency multipole assembly comprising:
first and second printed circuit boards, each printed circuit board comprising:
a substrate;
at least two rows of conductive pads; and
a plurality of tiles affixed to the conductive pads to form at least two radio frequency rods of a radio frequency multipole;

wherein the first and second printed circuit boards are arranged with the radio frequency rods towards each other and aligned to for the radio frequency multipole.

2. The radio frequency multipole assembly of claim 1 wherein the radio frequency multipole is an ion guide, a quadrupole mass filter, a collision cell, or an ion trap.

3. The radio frequency multipole assembly of claim 1 wherein each of the rows of conductive pads are arranged in a straight line, an arc, a sigmoidal curve, or any combination thereof.

4. The radio frequency multipole assembly of claim 1 wherein the tiles include a conductive metal substantially free of non-conductive oxides.

5. The radio frequency multipole assembly of claim 4 wherein the metal includes stainless steel, titanium, nickel, or any combination thereof.

6. The radio frequency multipole assembly of claim 1 wherein the tiles include a core of deformable material and a surface layer of conductive material.

7. The radio frequency multipole assembly of claim 6 wherein the tiles are formed by cutting the core from an extrusion, by stamping the core, or any combination thereof and plating the core with the surface layer of conductive material.

8. The radio frequency multipole assembly of claim 6 wherein the extrudable material includes a polymer, a deformable metal, or any combination thereof.

9. The radio frequency multipole assembly of claim 8 wherein the deformable metal includes copper, brass, or aluminum.

10. The radio frequency multipole assembly of claim 6 wherein the conductive material includes a metal substantially free of non-conductive oxides.

11. The radio frequency multipole assembly of claim 10 wherein the metal substantially free of non-conductive oxides includes gold or nickel.

12. The radio frequency multipole assembly of claim 1 wherein the tiles have a trapezoidal cross section, a rectangular cross section, a cross section with a curved edge, or any combination thereof.

13. The radio frequency multipole assembly of claim 12 wherein the curved edge includes a hyperbolic curved edge, a quadrant arc edge, or an arcuate curved edge.

14. The radio frequency multipole assembly of claim 1 wherein the tiles have a contact surface for contacting the conductive pad, the contact surface having a triangular shape or a quadrilateral shape.

15. The radio frequency multipole assembly of claim 14 wherein the quadrilateral shape includes a rectangular shape, a trapezoidal shape, or a parallelogram shape.

16. The radio frequency multipole assembly of claim 1 wherein the tiles substantially identical.

17. The radio frequency multipole assembly of claim 1 wherein each radio frequency rod includes at least 2 tiles.

18. The radio frequency multipole assembly of claim 17 wherein each radio frequency rod includes at least 5 tiles.

19. The radio frequency multipole assembly of claim 18 wherein each radio frequency rod includes at least 10 tiles.

20. The radio frequency multipole assembly of claim 19 wherein each radio frequency rod includes at least 20 tiles.

Assignees

• Thermo Finnigan Llc
• Thermo Fisher Scient (Bremen) Gmbh

Inventors

• Quarmby Scott T
• Hauschild Jan-Peter
• Hitchcock James M

Classifications

• H01J49/4225

  Multipole linear ion traps, e.g. quadrupoles, hexapoles · CPC title

• H01J49/063 Primary

  Multipole ion guides, e.g. quadrupoles, hexapoles · CPC title

• H01J49/4215

  Quadrupole mass filters (H01J49/4225 takes precedence) · CPC title

• H05K1/181

  associated with surface mounted components · CPC title

• H05K1/0243

  Printed circuits associated with mounted high frequency components · CPC title