Feedthrough connector for hermetically sealed electronic devices
US-2015257293-A1 · Sep 10, 2015 · US
US9870806B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9870806-B2 |
| Application number | US-201715406204-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 13, 2017 |
| Priority date | Mar 24, 2016 |
| Publication date | Jan 16, 2018 |
| Grant date | Jan 16, 2018 |
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Embodiments disclosed herein generally relate to hermetic electrical connectors used in hard disk drives. The hermetic electrical connector includes a barrier structure having a first plurality of connecting pads disposed on a first surface of the barrier structure and a second plurality of connecting pads disposed on a second surface of the barrier structure opposite the first surface. A plurality of conductors is disposed within the barrier structure, and each conductor is coupled to a connecting pad of the first plurality of connecting pads and a corresponding connecting pad of the second plurality of connecting pads. The barrier structure further includes a dielectric material between the first and second surfaces, and one or more layers embedded in the dielectric material. The addition of the layers helps choke the helium gas flow, thus improving sealing of the electrical connector while maintaining high-speed electrical transmission.
Opening claim text (preview).
What is claimed is: 1. A hermetic electrical connector, comprising: an external connector; an internal connector; and a barrier structure disposed between the external connector and the internal connector, wherein the barrier structure comprises: a dielectric material; one or more ground layers embedded in the dielectric material; and one or more gas choke layers embedded in the dielectric material. 2. The hermetic electrical connector of claim 1 , wherein the barrier structure is centrally-located within the hermetic electrical connector. 3. The hermetic electrical connector of claim 1 , wherein the one or more gas choke layers comprises aluminum, copper, ceramic, quartz, borosilicate glass, aluminosilicate glass, neoprene, butyl rubber, or nitrile rubber (Buna-N). 4. The hermetic electrical connector of claim 1 , wherein the one or more gas choke layers comprise two layers. 5. The hermetic electrical connector of claim 1 , wherein the one or more gas choke layers comprise one layer. 6. The hermetic electrical connector of claim 1 , wherein an opening of the plurality of openings has a diameter of about at least 600 microns. 7. The hermetic electrical connector of claim 1 , wherein the barrier structure further comprises a first plurality of connecting pads disposed on a first surface of the barrier structure and a second plurality of connecting pads disposed on a second surface of the barrier structure. 8. The hermetic electrical connector of claim 7 , wherein the one or more ground layers do not overlap with the first plurality of connecting pads and with the second plurality of connecting pads. 9. The hermetic electrical connector of claim 7 , wherein the one or more gas choke layers overlap with the first plurality of connecting pads and with the second plurality of connecting pads. 10. A hermetic electrical connector, comprising: means for externally connecting to a device; means for internally connecting to the device; and means for providing a barrier/connection between the means for externally connecting to the device and the means for internally connecting to the device, the barrier/connection providing means comprising a dielectric material multilayer structure and one or more gas choke layers embedded in the dielectric material multilayer structure. 11. The hermetic electrical connector of claim 10 , wherein the one or more gas choke layers is made of a material selected from the group consisting of aluminum, copper, ceramic, quartz, borosilicate glass, aluminosilicate glass, neoprene, butyl rubber, or nitrile rubber (Buna-N). 12. The hermetic electrical connector of claim 10 , wherein the one or more gas choke layers of the barrier/connection providing means includes a plurality of openings. 13. The hermetic electrical connector of claim 12 , wherein the barrier/connection providing means includes a conductor that is concentric with a corresponding opening of the plurality of openings. 14. The hermetic electrical connector of claim 10 , wherein the externally connecting means and the internally connecting means are offset. 15. A hard disk drive, comprising: one or more magnetic media; one or more sliders; one or more magnetic head assemblies; and a hermetic electrical connector, comprising: an external connector; an internal connector; and a barrier structure disposed between the external connector and the internal connector, wherein the barrier structure comprises: one or more layers embedded in dielectric material, wherein the one or more layers each includes a plurality of opening; a first plurality of connecting pads disposed on a first surface of the barrier structure; and a second plurality of connecting pads disposed on a second surface of the barrier structure, wherein the first plurality of connecting pads are offset from the second plurality of connect pads. 16. The hard disk drive of claim 15 , wherein a layer of the one or more layers comprises aluminum, copper, ceramic, quartz, borosilicate glass, aluminosilicate glass, neoprene, butyl rubber, or nitrile rubber (Buna-N). 17. The hard disk drive of claim 15 , wherein the barrier structure is centrally-located within the hermetic electrical connector. 18. The hard disk drive of claim 15 , wherein the one or more layers comprise two layers. 19. The hard disk drive of claim 15 , wherein the one or more layers comprise one layer. 20. The hard disk drive of claim 15 , wherein an opening of the plurality of openings has a diameter of about at least 600 microns.
Arrangements for providing electrical connections, e.g. connectors, cables, switches · CPC title
using rotating discs · CPC title
Sealing between contact members and housing, e.g. sealing insert · CPC title
Reducing influence of physical parameters, e.g. temperature change, moisture, dust · CPC title
characterised by the form or material of the contacting members (H01R4/01 takes precedence) · CPC title
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