Radio frequency label for packaging security

Patent metadata

Field	Value
Publication number	US-9870686-B2
Application number	US-201514980696-A
Country	US
Kind code	B2
Filing date	Dec 28, 2015
Priority date	Dec 28, 2015
Publication date	Jan 16, 2018
Grant date	Jan 16, 2018

Abstract

A system, method, and device for improving the functioning of security tags for use with merchandise are provided. A security tag device, to be used in conjunction with a tag monitoring device, may be provided with a product. The product may be conductive or may have metallic packaging. The security tag may include a planar dielectric substrate having a first side and an opposing side. An electronic article surveillance (EAS) circuit may be placed on the first side of the planar dielectric substrate. A ferrite sheet having a first side and an opposing side may be coupled to the opposing side of the planar dielectric substrate. A metal backing sheet may be coupled to the opposing side of the ferrite sheet. The planar dielectric substrate may be centered or offset on the ferrite sheet and the ferrite sheet may be centered or offset on the metal backing sheet.

First claim

That which is claimed:

1. A security tag device for placement on a product or product packaging to be monitored, the product or the product packaging having metallic portions, the security tag device comprising:
a planar dielectric substrate having a first side and an opposing side, wherein an electronic article surveillance (EAS) circuit is placed on the first side of the planar dielectric substrate, the EAS circuit being a resonant circuit that resonates in response to exposure to an electromagnetic field having a predetermined frequency, the EAS circuit comprising an inductor coil and a capacitor coupled to the inductor coil;
a ferrite sheet having a first side and an opposing side, wherein the first side of the ferrite sheet is coupled to the opposing side of the planar dielectric substrate; and
a metal backing sheet having a first side and an opposing side, wherein the first side of the metal backing sheet is coupled to the opposing side of the ferrite sheet.

2. The security tag device of claim 1 , wherein the opposing side of the metal backing sheet is placed in contact with the product or product packaging.

3. The security tag device of claim 1 , further comprising:
a dielectric adhesive placed between the opposing side of the planar dielectric substrate and the first side of the ferrite sheet; and
a dielectric adhesive placed between the opposing side of the ferrite sheet and the first side of the metal backing sheet.

4. The security tag device of claim 1 , wherein the planar dielectric substrate is centered on the ferrite sheet, wherein the ferrite sheet is centered on the metal backing sheet, wherein the metal backing sheet has an area equal to or larger than an area of the ferrite sheet, and wherein the area of the ferrite sheet is larger than an area of the planar dielectric substrate.

5. The security tag device of claim 1 , wherein an edge of the planar dielectric substrate is located near a first edge of the ferrite sheet, wherein the first edge of the ferrite sheet is located near an edge of the metal backing sheet, wherein the metal backing sheet has an area equal to or larger than an area of the ferrite sheet, and wherein the area of the ferrite sheet is larger than an area of the planar dielectric substrate.

6. The security tag device of claim 1 , wherein a corner of the ferrite sheet is located near a first corner of the metal backing sheet, wherein a corner of the planar dielectric substrate is located near a corner opposite the first corner of the metal backing sheet, wherein the metal backing sheet is larger than an area of the ferrite sheet and an area of the planar dielectric substrate, wherein at least a portion of the planar dielectric substrate overlays the metal backing sheet but does not overlay the ferrite sheet.

7. The security tag device of claim 1 , wherein the ferrite sheet comprises at least one of a thickness between 0.06 millimeters and 0.30 millimeters and a permeability value greater than air.

8. A method for assembling a security tag for placement on a product or product packaging to be monitored, the product or the product packaging having metallic portions, the method comprising:
placing an electronic article surveillance (EAS) circuit on a first side of a planar dielectric substrate, the EAS circuit being a resonant circuit that resonates in response to exposure to an electromagnetic field having a predetermined frequency, the EAS circuit comprising an inductor coil and a capacitor coupled to the inductor coil;
coupling a first side of a ferrite sheet to an opposing side of the planar dielectric substrate; and
coupling a first side of a metal backing sheet to an opposing side of the ferrite sheet.

9. The method of claim 8 , further comprising:
placing the planar dielectric substrate in the center of the ferrite sheet; and
placing the ferrite sheet in the center of the metal backing sheet,
wherein the metal backing sheet has an area equal to or larger than an area of the ferrite sheet, and
wherein the area of the ferrite sheet is larger than an area of the planar dielectric substrate.

10. The method of claim 8 , wherein an opposing side of the metal backing sheet is placed in contact with the product or product packaging.

11. The method of claim 8 , wherein the coupling comprises:
placing a dielectric adhesive between the opposing side of the planar dielectric substrate and first side of the ferrite sheet; and
placing a dielectric adhesive between the opposing side of the ferrite sheet and the first side of the metal backing sheet.

12. The method of claim 8 , further comprising:
placing an edge of the planar dielectric substrate near an edge of the ferrite sheet; and
placing the edge of the ferrite sheet near an edge of the metal backing sheet,
wherein the metal backing sheet has an area equal to or larger than an area of the ferrite sheet, and
wherein the area of the ferrite sheet is larger than an area of the planar dielectric substrate.

13. The method of claim 8 , further comprising:
placing a corner of the ferrite sheet near a first corner of the metal backing sheet; and
placing a corner of the planar dielectric substrate near a corner opposite the first corner of the metal backing sheet,
wherein the metal backing sheet has an area equal to or larger than an area of the ferrite sheet, and
wherein the area of the ferrite sheet is larger than an area of the planar dielectric substrate.

14. The method of claim 8 , wherein the ferrite sheet comprises at least one of a thickness between 0.06 millimeters and 0.30 millimeters and a permeability value greater than air.

15. A security system comprising:
security tag device sized and configured for placement on a product having metallic packaging,
wherein the security tag device comprises:
a planar dielectric substrate having a first side and an opposing side, wherein an electronic article surveillance (EAS) circuit is placed on the first side of the planar dielectric substrate, the EAS circuit being a resonant circuit that resonates in response to exposure to an electromagnetic field having a predetermined frequency, the EAS circuit comprising an inductor coil and a capacitor coupled to the inductor coil;
a ferrite sheet, wherein a first side of the ferrite sheet is attached to an opposing side of the planar dielectric substrate; and
a metal backing sheet, wherein a first side of the metal backing sheet is attached to an opposing side of the ferrite sheet; and

a tag monitoring device configured to interface with the security tag device.

16. The security system of claim 15 , wherein the planar dielectric substrate is centered on the ferrite sheet, wherein the ferrite sheet is centered on the metal backing sheet,
wherein the metal backing sheet has an area equal to or larger than an area of the ferrite sheet, and wherein the area of the ferrite sheet is larger than an area of the planar dielectric substrate.

17. The security system of claim 15 , wherein the opposing side of the metal backing sheet is placed in contact with the product.

18. The security system of claim 15 , further comprising:
a dielectric adhesive placed between the opposing side of the planar dielectric substrate and the first side of the ferrite sheet; and
a dielectric adhesive placed between the opposing side of the ferrite sheet and the first side of the metal backing sheet.

19. The security system of claim 15 , wherein the ferrite sheet has a permeability value greater than air and has a thickness between 0.06 millimeters and 0.30 millime

Assignees

• Checkpoint Systems Inc
• Checkpoint Systems Inc

Inventors

• Zeng Kefeng
• Mingle John B
• West George
• Nguyen Trang

Classifications

• G08B13/2434 Primary

  Tag housing and attachment details · CPC title

• G08B13/244

  Tag manufacturing, e.g. continuous manufacturing processes · CPC title

• G08B13/2442

  Tag materials and material properties thereof, e.g. magnetic material details · CPC title