Device for high density connections

Patent metadata

Field	Value
Publication number	US-9870035-B2
Application number	US-201514788866-A
Country	US
Kind code	B2
Filing date	Jul 1, 2015
Priority date	Jul 1, 2015
Publication date	Jan 16, 2018
Grant date	Jan 16, 2018

Abstract

A device is described. The device includes a daughterboard having a first distinct side and a second distinct side. A first connector on the first distinct side is attached to a first baseboard. A second connector on the second distinct side is attached to a second baseboard. A method for attaching a daughterboard to a second device is described. Connectors are included on opposing distinct sides of the daughterboard. The second device includes baseboards mechanically secured in parallel by lead screw actuators. As part of the method, the lead screw actuators are actuated so as to move the baseboards away from each other. A first connector is attached to one of the baseboards. The lead screw actuators are again actuated so as to move the baseboards toward each other until a second connector is brought into attachment with the other of the baseboards.

First claim

What is claimed is:

1. A device comprising:
a daughterboard including a first distinct side and a second distinct side;
a first electrical connector on the first distinct side, the first electrical connector attached to a first baseboard, wherein the first baseboard comprises a first processor communicatively coupled with a first memory; and
a second electrical connector on the second distinct side, the second electrical connector attached to a second baseboard, wherein the second baseboard comprises a second processor communicatively coupled with a second memory.

2. The device of claim 1 , wherein the daughterboard further includes a third distinct side and a fourth distinct side.

3. The device of claim 1 , wherein the first connector is in alignment with the first baseboard, and wherein the second connector is in alignment with the second baseboard.

4. The device of claim 3 , wherein the first baseboard is communicatively coupled with the second baseboard.

5. The device of claim 1 , wherein the first baseboard comprises a first card slot for attaching the first connector, and wherein the second baseboard comprises a second card slot for attaching the second connector.

6. The device of claim 5 , wherein the first baseboard comprises a third card slot attached to the first baseboard in parallel to the first card slot, and wherein the second baseboard comprises a fourth card slot attached to the second baseboard in parallel to the second card slot.

7. The device of claim 5 , wherein the first card slot and second card slot are dual in-line memory modules (DIMMs).

8. The device of claim 5 , wherein the first card slot is attached to the first connector via a first circuit, and wherein the second card slot is attached to the second connector via a second circuit.

9. The device of claim 3 , wherein the first distinct side and the second distinct side are opposite sides of the daughterboard, and wherein the first baseboard and the second baseboard are positioned opposite each other relative to the daughterboard.

10. The device of claim 9 , wherein the daughterboard further includes a third connector located on a third distinct side, the third distinct side connecting the first distinct side and the second distinct side, and wherein a third baseboard is positioned in alignment with the third connector.

11. The device of claim 9 , wherein the first baseboard and the second baseboard are mechanically secured to each other by one or more linear actuators.

12. The device of claim 11 , wherein the one or more linear actuators are lead screw actuators.

13. The device of claim 1 , further comprising:
a second daughterboard including a third distinct side and a fourth distinct side;
a third connector on the third distinct side, the third connector attached to the first baseboard; and
a fourth connector on the fourth distinct side, the fourth connector attached to the second baseboard,
wherein the first daughterboard and second daughterboard are positioned parallel to each other between the first baseboard and the second baseboard.

14. The device of claim 1 , wherein the daughterboard comprises at least one processor communicatively coupled with a memory.

15. The device of claim 1 , wherein the device is a blade server, wherein the first baseboard and the second baseboard each provide non-core computing services to the daughterboard, and wherein the daughterboard is enclosed within the blade server.

16. A method for attaching a daughterboard to a device, the daughterboard including a first electrical connector on a first distinct side of the daughterboard and a second electrical connector on a second distinct side of the daughterboard opposite the first distinct side, the device including a first baseboard mechanically secured in parallel with a second baseboard by one or more lead screw actuators, the first baseboard comprising a first processor communicatively coupled with a first memory, the second baseboard comprising a second processor communicatively coupled with a second memory, the method comprising:
actuating the one or more lead screw actuators to move the first baseboard away from the second baseboard;
attaching the first electrical connector to a first card slot of the first baseboard; and
actuating the one or more lead screw actuators to move the first baseboard toward the second baseboard until the second electrical connector is brought into attachment with a second card slot of the second baseboard.

17. The method of claim 16 , wherein the device is a blade server, wherein the first baseboard and the second baseboard each provide non-core computing services to the daughterboard, and wherein the daughterboard is enclosed within the blade server.

Assignees

• IBM

Inventors

• Birke Robert
• Chen Yiyu L
• Schmatz Martin L

Classifications

• H05K7/1487

  Blade assemblies, e.g. blade cases or inner arrangements within a blade · CPC title

• G06F1/186 Primary

  Securing of expansion boards in correspondence to slots provided at the computer enclosure · CPC title

• H05K7/1444

  Complex or three-dimensional-arrangements; Stepped or dual mother boards · CPC title