Thermo-compression head, soldering system, and LED tube lamp

Patent metadata

Field	Value
Publication number	US-9869431-B2
Application number	US-201615299096-A
Country	US
Kind code	B2
Filing date	Oct 20, 2016
Priority date	Sep 28, 2014
Publication date	Jan 16, 2018
Grant date	Jan 16, 2018

Abstract

A thermo-compression head, a soldering system, and a LED tube lamp are disclosed. The thermo-compression head includes a bonding plane, a restraining plane, one or more concave guiding tank, and one or more concave molding tank. The bonding plane is for touching a second object. The restraining plane is adjacent to the bonding plane for touching a first object soldered to the second object. The concave guiding tank is formed on the bonding plane. An end of the concave guiding tank is opened near an edge of the bonding plane while an opposite end of the concave guiding tank is closed. The concave molding tank is formed on the restraining plane and positioned beside the concave guiding tank. The concave molding tank communicates with the concave guiding tank via the open end of the concave guiding tank.

First claim

What is claimed is:

1. A thermo-compression head for heating a solder and bonding at least one first soldering pad on a first object and at least one second soldering pad on a second object, the first object overlaying a part of the second object, the at least one second soldering pad being between the first object and the second object, the at least one first soldering pad being aligned with the at least one second soldering pad, wherein the thermo-compression head comprises:
a bonding plane for touching the second object;
a restraining plane adjacent to the bonding plane for touching the first object;
at least one concave guiding tank formed on the bonding plane, and wherein an end of the at least one concave guiding tank is opened near an edge of the bonding plane while an opposite end of the at least one concave guiding tank is closed; and
at least one concave molding tank formed on the restraining plane and positioned beside the at least one concave guiding tank, and wherein the at least one concave molding tank communicates with the at least one concave guiding tank via the open end of the at least one concave guiding tank.

2. The thermo-compression head according to claim 1 , wherein the at least one concave molding tank is more depressed than the at least one concave guiding tank.

3. The thermo-compression head according to claim 1 , wherein the restraining plane is lower than the bonding plane to form a difference of height of the bonding plane and the restraining plane.

4. The thermo-compression head according to claim 3 , wherein the difference of the height of the bonding plane and the restraining plane is substantially equal to a thickness of the first object.

5. The thermo-compression head according to claim 1 , wherein an end of the at least one concave molding tank is opened near an edge of the restraining plane to communicate with the at least one concave guiding tank while an opposite end of the at least one concave molding tank is opened near an opposite edge of the restraining plane.

6. The thermo-compression head according to claim 1 , wherein the restraining plane has a strip-like structure or a grid-like structure on a surface for pressing the first object.

7. The thermo-compression head according to claim 1 , wherein the bonding plane has a surface being flat, concave, or convex for touching the second object.

8. The thermo-compression head according to claim 1 , wherein the first object is an LED light strip, the second object is a power supply, the at least one first soldering pad is on a side of the LED light strip away from the power supply, and the at least one first soldering pad is formed with a through hole and is able to be connected to the at least one second soldering pad via the through hole.

9. The thermo-compression head according to claim 1 , further comprising a rotary linkage mechanism, wherein the bonding plane and the restraining plane are connected to the rotary linkage mechanism.

10. The thermo-compression head according to claim 9 , further comprising a pressure sensor, wherein the pressure sensor detects the pressure applied to the bonding plane or the restraining plane.

11. A soldering system for heating a solder and bonding at least one first soldering pad on a first object and at least one second soldering pad on a second object, the first object overlaying a part of the second object, the at least one second soldering pad being between the first object and the second object, the at least one first soldering pad being aligned with the at least one second soldering pad, wherein the soldering system comprises:
a soldering vehicle comprising:
a rotary platform for holding the first object and the second object; and
a vehicle holder bearing the rotary platform, wherein the rotary platform is able to rotate with respect to the vehicle holder; and

a thermo-compression head positioned corresponding to the rotary platform, the thermo-compression head comprising:
a bonding plane for touching the second object;
a restraining plane adjacent to the bonding plane for touching the first object;
at least one concave guiding tank formed on the bonding plane, wherein an end of the at least one concave guiding tank is opened near an edge of the bonding plane while an opposite end of the at least one concave guiding tank is closed; and
at least one concave molding tank formed on the restraining plane and positioned beside the at least one concave guiding tank, wherein the at least one concave molding tank communicates with the at least one concave guiding tank via the open end of the at least one concave guiding tank.

12. The soldering system according to claim 11 , wherein the bonding plane has a surface being flat, concave, or convex for touching the second object.

13. The soldering system according to claim 11 , wherein the bonding plane is for heating a solder.

14. The soldering system according to claim 11 , wherein the first object is an LED light strip, the second object is a power supply, the at least one first soldering pad is on a side of the LED light strip away from the power supply, and the at least one first soldering pad is formed with a through hole and is able to be connected to the at least one second soldering pad via the through hole.

15. An LED tube lamp manufactured by a soldering system for heating a solder and bonding at least one first soldering pad on a first object and at least one second soldering pad on a second object, the first object overlaying a part of the second object, the at least one second soldering pad being between the first object and the second object, the at least one first soldering pad being aligned with the at least one second soldering pad, wherein the soldering system comprises:
a soldering vehicle comprising:
a rotary platform for holding the first object and the second object; and
a vehicle holder bearing the rotary platform, wherein the rotary platform is able to rotate with respect to the vehicle holder; and

a thermo-compression head positioned corresponding to the rotary platform, the thermo-compression head comprising:
a bonding plane for touching the second object;
a restraining plane adjacent to the bonding plane for touching the first object;
at least one concave guiding tank formed on the bonding plane, wherein an end of the at least one concave guiding tank is opened near an edge of the bonding plane while an opposite end of the at least one concave guiding tank is closed; and
at least one concave molding tank formed on the restraining plane and positioned beside the at least one concave guiding tank, wherein the at least one concave molding tank communicates with the at least one concave guiding tank via the open end of the at least one concave guiding tank.

16. The LED tube lamp according to claim 15 , comprising:
a lamp tube;
two end caps respectively at two opposite ends of the lamp tube;
a power supply in one or separately both of the end caps; and
an LED light strip in the lamp tube, the LED light strip being provided with a plurality of LED light sources mounted thereon, the LED light sources being electrically connected to the power supply via the LED light strip;
wherein the first object is the LED light strip, the second object is the power supply, the LED light strip overlays a part of the power supply, the LED light strip comprises the at least one first soldering pad, the power supply comprises the at least one second soldering pad, the at least one second soldering pad is between the LED light strip and the power supply, the at least one first soldering pad is aligned w

Assignees

• Jiaxing Super Lighting Electric Appliance Co Ltd
• Jiaxing Super Lighting Electric Appliance Co Ltd

Inventors

• Jiang Tao
• Yang Xiaosu
• Wang Bao
• Ota Nobutaka
• Sun Xiao
• Hu Changwei
• Yao Guohai
• Chen Shauliang
• Wang Dingkai
• Jiang Wenjang

Classifications

• F21V7/28

  characterised by coatings · CPC title

• H05B45/37

  Converter circuits · CPC title

• H05B45/50

  responsive to malfunctions or undesirable behaviour of LEDs; responsive to LED life; Protective circuits · CPC title

• B23K1/0016

  Soldering of electronic components · CPC title

• F21Y2115/10

  Light-emitting diodes [LED] · CPC title