Edge seal for lower electrode assembly

Patent metadata

Field	Value
Publication number	US-9869392-B2
Application number	US-201213528194-A
Country	US
Kind code	B2
Filing date	Jun 20, 2012
Priority date	Oct 20, 2011
Publication date	Jan 16, 2018
Grant date	Jan 16, 2018

Abstract

A lower electrode assembly useful for supporting a semiconductor substrate in a plasma processing chamber includes a temperature controlled lower base plate, an upper plate, a mounting groove surrounding a bond layer and an edge seal comprising an elastomeric band having an outer concave surface in an uncompressed state, the band mounted in the groove such that upper and lower ends of the band are axially compressed and a maximum outward bulging of the band is no greater than a predetermined distance.

First claim

What is claimed is:

1. A lower electrode assembly useful for supporting a semiconductor substrate in a plasma processing chamber comprising:
a temperature controlled lower base plate, an upper plate, and a mounting groove surrounding a bond layer located between the temperature controlled lower base plate and the upper plate in the lower electrode assembly; and
an edge seal comprising an annular elastomeric band having upper and lower flat annular surfaces, an outer concave surface in an uncompressed state corresponding to a radial outer surface of the elastomeric band, the band mounted in the groove such that the upper and lower flat annular surfaces of the band are axially compressed between the upper plate and the lower base plate to cause the outer concave surface to bulge outward in a direction that is (i) perpendicular to a direction of axial compression and (ii) radially outward relative to the mounting groove, and a maximum outward bulging of the outer concave surface of the elastomeric band is no greater than a predetermined distance;
wherein the elastomeric band is compressed at least 1% and outward bulging of the elastomeric band is less than a maximum outer diameter of the elastomeric band in an uncompressed state.

2. The electrode assembly of claim 1 , wherein the concave surface is a single curved surface, a single inclined surface oriented such that the band is widest at an upper end thereof and narrowest at a lower end thereof or a pair of converging inclined surfaces oriented such that the band is widest at upper and lower ends thereof and narrowest at a middle thereof.

3. The electrode assembly of claim 1 , wherein the outer surface of the band includes a cylindrical surface of uniform diameter at an upper end of the band extending less than 1/10 of a height of the band.

4. The electrode assembly of claim 1 , wherein the band has a height of 0.05 to 0.15 inch, a width of 0.025 to 0.040 inch, and inner diameter of 11.3 to 11.4 inches and each edge of the band is rounded with a radius of 0.001 to 0.010 inch.

5. The electrode assembly of claim 1 , wherein the lower annular surface is smaller in width than the upper annular surface, a cylindrical inner surface of uniform diameter extends between the upper and lower annular surfaces, an outer cylindrical surface of uniform diameter extends about 0.01 inch from the upper annular surface and a curved surface of uniform radius extends between the outer cylindrical surface and the lower annular surface.

6. The electrode assembly of claim 1 , wherein the upper plate comprises a ceramic material having at least one electrostatic clamping electrode embedded therein.

7. The electrode assembly of claim 1 , wherein the lower plate is an aluminum base plate having fluid channels therein through which coolant is circulated for maintaining the base plate at a constant temperature.

8. The electrode assembly of claim 1 , wherein the predetermined distance is no greater than 0.004 inch and the band is axially compressed about 5%.

9. The electrode assembly of claim 1 , wherein the lower electrode assembly further comprises a heater plate comprising a metal or ceramic plate having one or more spatially distributed heaters and the bond layer comprises a first bond layer attaching the lower plate to the heater plate and a second bond layer attaching the heater plate to the upper plate, the mounting groove formed by an outer surface of the heater plate and opposed surfaces of the upper and lower plates.

10. The electrode assembly of claim 1 , wherein the band includes a cylindrical inner surface of uniform diameter, the upper and lower flat annular surfaces have equal width, an outer curved surface extends between the upper and lower surfaces, and each edge of the band is rounded.

11. A plasma etch chamber wherein the electrode assembly of claim 1 is mounted in an interior thereof and the upper plate of the electrode assembly includes an electrostatic chuck (ESC).

12. The lower electrode assembly of claim 1 , wherein the outer concave surface of the edge seal has a radius of curvature between about 0.02 to 0.8 inch.

13. The lower electrode assembly of claim 1 , wherein the elastomeric band has a metallic content less than 5000 parts per billion for each and every metal element comprised therein.

Assignees

• Schaefer David
• Chhatre Ambarish
• Gaff Keith William
• Lee Sung
• Lai Brooke Mesler
• Lam Res Corp

Inventors

• Schaefer David
• Chhatre Ambarish
• Gaff Keith William
• Lee Sung
• Lai Brooke Mesler

Classifications

• H10P72/722

  Details of electrostatic chucks · CPC title

• H10P72/72

  using electrostatic chucks · CPC title

• H01J37/32715

  Workpiece holder · CPC title

• H01J37/3255

  Material · CPC title

• H01J37/32495

  Means for protecting the vessel against plasma · CPC title