Electroconductive-film-forming composition and method for producing electroconductive film

Patent metadata

Field	Value
Publication number	US-9868864-B2
Application number	US-201615002464-A
Country	US
Kind code	B2
Filing date	Jan 21, 2016
Priority date	Jul 29, 2013
Publication date	Jan 16, 2018
Grant date	Jan 16, 2018

Abstract

An electroconductive-film-forming composition capable of forming an electroconductive film having excellent conductivity and few voids and a method for producing an electroconductive film using the same. The electroconductive-film-forming composition contains copper particles having an average particle diameter of 1 nm to 10 μm, copper oxide particles having an average particle diameter of 1 nm to 500 nm, a reducing agent having a hydroxy group, a metal catalyst including metals other than copper, and a solvent, in which the content of the copper oxide particles is 50% by mass to 300% by mass with respect to the content of the copper particles, the content of the reducing agent is 100 mol % to 800 mol % with respect to the content of the copper oxide particles, and the content of the metal catalyst is 10% by mass or less with respect to the content of the copper oxide particles.

First claim

What is claimed is:

1. An electroconductive-film-forming composition comprising:
copper particles having an average particle diameter of 1 nm to 10 μm;
copper oxide particles having an average particle diameter of 1 nm to 500 nm;
a reducing agent having a hydroxy group;
a metal catalyst including metals other than copper; and
a solvent,
wherein the content of the copper oxide particles is 50% by mass to 300% by mass with respect to the content of the copper particles,
the content of the reducing agent is 200 mol % to 700 mol % with respect to the content of the copper oxide particles, and
the content of the metal catalyst is 10% by mass or less with respect to the content of the copper oxide particles.

2. The electroconductive-film-forming composition according to claim 1 ,
wherein the reducing agent is a compound having two or more hydroxy groups in a molecule.

3. The electroconductive-film-forming composition according to claim 2 ,
wherein the boiling point of the reducing agent is 250° C. or lower and the reducing agent is a compound represented by Formula (1) or (2) below:

wherein, in Formulae (1) and (2), R 1 , R 2 and R 3 each independently represent a hydrogen atom, an alkyl group, an alkoxy group, a hydroxyalkyl group, or an alkoxyalkyl group, and R 1 , R 2 and R 3 do not contain an aldehyde group or a carbonyl group.

4. The electroconductive-film-forming composition according to claim 3 ,
wherein the metal catalyst is a metal catalyst including at least one metal selected from the group consisting of palladium, platinum, nickel, and silver.

5. The electroconductive-film-forming composition according to claim 3 ,
wherein the metal catalyst is a salt compound.

6. The electroconductive-film-forming composition according to claim 3 ,
wherein the solubility parameter (SP value) of the solvent is 10 (cal/cm 3 ) 1/2 to 20 (cal/cm 3 ) 1/2 .

7. The electroconductive-film-forming composition according to claim 3 , further comprising:
a resin.

8. The electroconductive-film-forming composition according to claim 2 ,
wherein the metal catalyst is a metal catalyst including at least one metal selected from the group consisting of palladium, platinum, nickel, and silver.

9. The electroconductive-film-forming composition according to claim 2 ,
wherein the metal catalyst is a salt compound.

10. The electroconductive-film-forming composition according to claim 2 ,
wherein the solubility parameter (SP value) of the solvent is 10 (cal/cm 3 ) 1/2 to 20 (cal/cm 3 ) 1/2 .

11. The electroconductive-film-forming composition according to claim 2 , further comprising:
a resin.

12. The electroconductive-film-forming composition according to claim 1 ,
wherein the metal catalyst is a metal catalyst including at least one metal selected from the group consisting of palladium, platinum, nickel, and silver.

13. The electroconductive-film-forming composition according to claim 12 ,
wherein the metal catalyst is a salt compound.

14. The electroconductive-film-forming composition according to claim 12 ,
wherein the solubility parameter (SP value) of the solvent is 10 (cal/cm 3 ) 1/2 to 20 (cal/cm 3 ) 1/2 .

15. The electroconductive-film-forming composition according to claim 1 ,
wherein the metal catalyst is a salt compound.

16. The electroconductive-film-forming composition according to claim 1 ,
wherein the solubility parameter (SP value) of the solvent is 10 (cal/cm 3 ) 1/2 to 20 (cal/cm 3 ) 1/2 .

17. The electroconductive-film-forming composition according to claim 1 , further comprising:
a resin.

18. The electroconductive-film-forming composition according to claim 17 ,
wherein the resin is a thermosetting resin.

19. A method for producing an electroconductive film comprising:
a coating film forming step of forming a coating film by applying the electroconductive-film-forming composition according to claim 1 to a substrate; and
a heat treatment step of forming an electroconductive film by subjecting the coating film to a heat treatment.

20. The method for producing an electroconductive film according to claim 19 ,
wherein the temperature of the heat treatment is 200° C. or lower.

Assignees

• Fujifilm Corp

Inventors

• Tsuyama Hiroaki
• Watanabe Toru
• Hayata Yuuichi

Classifications

• C22C29/12

  based on oxides · CPC title

• H05K2203/1157

  Using means for chemical reduction · CPC title

• C09D7/63

  organic · CPC title

• C23C18/08

  characterised by the deposition of metallic material · CPC title

• H05K1/097

  Inks comprising nanoparticles and specially adapted for being sintered at low temperature (H05K1/095 takes precedence) · CPC title