Phosphonium compound, epoxy resin composition including the same and semiconductor device prepared from the same

Patent metadata

Field	Value
Publication number	US-9868751-B2
Application number	US-201514918916-A
Country	US
Kind code	B2
Filing date	Oct 21, 2015
Priority date	Oct 22, 2014
Publication date	Jan 16, 2018
Grant date	Jan 16, 2018

Abstract

A phosphonium compound, an epoxy resin composition, a method of preparing a phosphonium compound, and a semiconductor device encapsulated with the epoxy resin composition, the compound being represented by Formula 1:

First claim

What is claimed is:

1. A phosphonium compound represented by one of the following Formulae 1a to 1o:

2. A method of preparing the phosphonium compound as claimed in claim 1 , the method comprising reacting a phosphonium cation-containing compound with an anilide anion-containing compound.

3. An epoxy resin composition, comprising:
an epoxy resin,
a curing agent,
inorganic filler, and
a curing catalyst, wherein the curing catalyst includes the phosphonium compound as claimed in claim 1 .

4. The epoxy resin composition as claimed in claim 3 , wherein the epoxy resin includes at least one of bisphenol A epoxy resin, bisphenol F epoxy resin, phenol novolac epoxy resin, tert-butyl catechol epoxy resin, naphthalene epoxy resin, glycidyl amine epoxy resin, cresol novolac epoxy resin, biphenyl epoxy resin, linear aliphatic epoxy resin, cycloaliphatic epoxy resin, heterocyclic epoxy resin, spiro ring-containing epoxy resin, cyclohexane dimethanol epoxy resin, trimethylol epoxy resin, and halogenated epoxy resin.

5. The epoxy resin composition as claimed in claim 3 , wherein the curing agent includes a phenol resin.

6. The epoxy resin composition as claimed in claim 3 , wherein the curing agent includes at least one of phenolaralkyl phenol resin, phenol novolac phenol resin, xyloc phenol resin, cresol novolac phenol resin, naphthol phenol resin, terpene phenol resin, multifunctional phenol resin, dicyclopentadiene-based phenol resin, novolac phenol resin synthesized from bisphenol A and resol, a polyhydric phenol compound, an acid anhydride, and an aromatic amine.

7. The epoxy resin composition as claimed in claim 3 , wherein the curing catalyst is present in the composition in an amount of 0.01 wt % to 5 wt %, based on a total weight of the epoxy resin composition.

8. The epoxy resin composition as claimed in claim 3 , wherein the phosphonium compound is present in the curing catalyst in an amount of 10 wt % to 100 wt %, based on a total weight of the curing catalyst.

9. The epoxy resin composition as claimed in claim 3 , wherein the epoxy resin composition has a storage stability of 80% or more, as calculated by the Equation 2:
Storage stability=( F 1 −F 0) F 0×100,

wherein F1 is a flow length in inches of the epoxy resin composition measured after storing the composition at 25° C./50% RH for 72 hours using a transfer molding press at 175° C. and 70 kgf/cm 2 in accordance with EMMI-1-66, and F0 is an initial flow length in inches of the epoxy resin composition.

10. The epoxy resin composition as claimed in claim 3 , wherein the epoxy resin composition has a curing shrinkage rate of less than 0.4%, as calculated by the Equation 1:
Curing shrinkage=| C−D|/C× 100,
wherein C is a length of a specimen obtained by subjecting an epoxy resin composition to a transfer molding at 175° C. under a load of 70kgf/cm 2 , and D is a length of the specimen after post-curing the specimen at 170° C. to 180° C. for 4 hours and cooling.

11. A semiconductor device encapsulated with the epoxy resin composition as claimed in claim 3 .

12. The epoxy resin composition as claimed in claim 3 , further comprising a silicone oil modified with a functional group.

13. The epoxy resin composition as claimed in claim 12 , wherein the modified silicone oil is at least one selected from the group of silicone oil having an epoxy functional group, silicone oil having an amine functional group, silicone oil having a carboxyl functional group, and a combination thereof.

14. The epoxy resin composition as claimed in claim 12 , wherein the modified silicone oil is included in the composition in an amount of 0.05 wt % to 1.5 wt %, based on a total weight of the epoxy resin composition.

15. A phosphonium compound represented by one of the following Formulae 2a to 2j:

16. A method of preparing the phosphonium compound as claimed in claim 15 , the method comprising reacting a phosphonium cation-containing compound with an anilide anion-containing compound.

17. An epoxy resin composition, comprising:
an epoxy resin,
a curing agent,
inorganic filler, and
a curing catalyst, wherein the curing catalyst includes the phosphonium compound as claimed in claim 15 .

18. A semiconductor device encapsulated with the epoxy resin composition as claimed in claim 17 .

19. The epoxy resin composition as claimed in claim 17 , further comprising a silicone oil modified with a functional group.

20. The epoxy resin composition as claimed in claim 19 , wherein the modified silicone oil is at least one selected from the group of silicone oil having an epoxy functional group, silicone oil having an amine functional group, silicone oil having a carboxyl functional group, and a combination thereof.

21. The epoxy resin composition as claimed in claim 19 , wherein the modified silicone oil is included in the composition in an amount of 0.05 wt % to 1.5 wt %, based on a total weight of the epoxy resin composition.

Assignees

• Samsung Sdi Co Ltd

Inventors

• Kim Min Gyum
• Kwon Ki Hyeok
• Lee Dong Hwan
• Chung Joo Young
• Cheon Jin Min
• Choi Jin Woo

Classifications

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/114

  by a substrate and the encapsulations · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title