Semiconductor memory card, printed circuit board for memory card and method of fabricating the same

Patent metadata

Field	Value
Publication number	US-9867288-B2
Application number	US-201314386637-A
Country	US
Kind code	B2
Filing date	Mar 20, 2013
Priority date	Mar 20, 2012
Publication date	Jan 9, 2018
Grant date	Jan 9, 2018

Abstract

A printed circuit board for a memory card includes an insulating layer; a mounting part on a first surface of the insulating layer, the mounting part being electrically connected to a memory device; and a terminal part on a second surface of the insulating layer, the terminal part being electrically connected to an external electronic appliance, wherein a same metal layer having a same property is formed on exposed surfaces of the mounting part and the terminal part.

First claim

The invention claimed is:

1. A printed circuit board for a memory card, the printed circuit board comprising:
an insulating layer;
a mounting part on a first surface of the insulating layer, the mounting part being electrically connected to a memory device through a wire;
a terminal part on a second surface of the insulating layer, the terminal part being electrically connected to an external electronic appliance;
a first metal layer on the mounting part; and
a second metal layer on the terminal part,
wherein a bonding property, a glossiness and a wear resistance of the first metal layer are same as a bonding property, a glossiness and a wear resistance of the second metal layer,
wherein each of the first metal layer and the second metal layer comprises:
a nickel metal layer formed on the mounting part and formed of nickel;
a palladium metal layer formed on the nickel metal layer and formed of palladium; and
a gold metal layer formed on the palladium metal layer,
wherein the gold metal layer has a thickness in a range of 0.1 μm to 0.2 μm,
wherein the nickel metal layer has a glossiness of 1.8 or more,
wherein the nickel metal layer includes:
a first part disposed on top surfaces of the mounting part and the terminal part, and having a first thickness; and
a second part disposed on side surface of the mounting part and the terminal part, and having a second thickness,
wherein a ratio of the first thickness to the second thickness is lower than 1.07, and greater than 1.0
wherein the gold metal layer comprises a gold alloy layer comprising gold and at least one of silver, copper, palladium, zinc, cobalt and an inorganic material, and
wherein the palladium metal layer comprises a palladium alloy layer comprising palladium and at least one of cobalt, zinc and an inorganic material.

2. The printed circuit board of claim 1 , wherein the nickel metal layer has a thickness in a range of 5 μm to 8 μm, and the palladium metal layer has a thickness in a range of in a range of 0.1 μm to 0.2 μm.

3. A memory card comprising:
a printed circuit board comprising an insulating layer;
a memory device mounted on a predetermined region of a first surface of the printed circuit board;
a first pattern electrically connected to the memory device through a wire; and
a second pattern formed on a second surface of the printed circuit board and electrically connected to an external electronic appliance;
a first metal layer on the first pattern; and
a second metal layer on the second pattern,
wherein a bonding property, a glossiness and a wear resistance of the first metal layer are same as a bonding property, a glossiness and a wear resistance of the second metal layer,
wherein each of the first metal layer and the second metal layer comprises:
a nickel metal layer on the first pattern and the second pattern;
a palladium metal layer formed on the nickel metal layer and formed of palladium; and
a gold metal layer formed on the palladium metal layer,
wherein the nickel metal layer has a thickness in a range of 5 μm to 8 μm,
wherein the palladium metal layer has a thickness in a range of in a range of 0.1 μm to 0.2 μm,
wherein the gold metal layer has a thickness in a range of 0.1 μm to 0.2 μm,
wherein the nickel metal layer has a glossiness of 1.8 or more,
wherein the nickel metal layer includes:
a first part disposed on top surfaces of the first pattern and the second pattern, and having a first thickness; and
a second part disposed on side surface of the first pattern and the second pattern, and having a second thickness,
wherein a ratio of the first thickness to the second thickness is lower than 1.07, and greater than 1.0
wherein the gold metal layer comprises a gold alloy layer comprising gold and at least one of silver, copper, palladium, zinc, cobalt and an inorganic material, and
wherein the palladium metal layer comprises a palladium alloy layer comprising palladium and at least one of cobalt, zinc and an inorganic material.

Assignees

• Lg Innotek Co Ltd

Inventors

• Lim Seol Hee

Classifications

• H10W72/5522

  comprising gold [Au] · CPC title

• H05K1/181

  associated with surface mounted components · CPC title

• H05K3/244

  Finish plating of conductors, especially of copper conductors, e.g. for pads or lands (selective plating methods H05K3/243; finish plating of conductors made by printing techniques H05K3/246; solder as finish H05K3/3465) · CPC title

• C25D5/022

  using masking means · CPC title

• H05K2201/10159

  Memory · CPC title