Circuit board and electronic apparatus

Patent metadata

Field	Value
Publication number	US-9867274-B2
Application number	US-201514804748-A
Country	US
Kind code	B2
Filing date	Jul 21, 2015
Priority date	Aug 13, 2014
Publication date	Jan 9, 2018
Grant date	Jan 9, 2018

Abstract

A circuit board includes a plate member capable of holding a printed circuit board, the printed circuit board including an electronic component, and a cooling member provided on the electronic component, the printed circuit board and the electronic component being positioned between the plate member and the cooling member; and a circuit provided to the plate member and allowed to be electrically connected with the printed circuit board.

First claim

What is claimed is:

1. A circuit board comprising:
a plate member configured to hold a printed circuit board on which an electronic component is directly mounted, and a cooling member provided above the electronic component and including a conductive plate or a conductive foil provided between a first member and a second member and a hole through which a fastening member that fastens the cooling member and the plate member together is allowed to extend from the first member to the second member, the printed circuit board including layered wiring layers provided above the first member and the second member, the printed circuit board and the electronic component being positioned between the plate member and the cooling member; and
a circuit provided to the plate member and allowed to be electrically coupled with the printed circuit board,
wherein the conductive plate or the conductive foil is thicker than each of the layered wiring layers.

2. The circuit board according to claim 1 , wherein a terminal that allows the printed circuit board and the circuit to be coupled to each other is provided on a surface of the plate member.

3. The circuit board according to claim 2 , wherein the terminal is elastically deformable.

4. The circuit board according to claim 1 , wherein the printed circuit board includes a large-diameter via and a small-diameter via having a smaller diameter than the large-diameter via which penetrate the layered conductive plates or the layered conductive foils.

5. The circuit board according to claim 4 , wherein the circuit includes a via coupled to the large-diameter via through a terminal provided between the plate member and the printed circuit board.

6. An electronic apparatus comprising:
a printed circuit board on which an electronic component is directly mounted;
a cooling member provided above the electronic component; and
a circuit board including
a plate member that holds the printed circuit board and the electronic component and includes a conductive plate or a conductive foil provided between a first member and a second member and a hole through which a fastening member that fastens the cooling member and the plate member together is allowed to extend from the first member to the second member, the printed circuit board including layered wiring layers provided above the first member and the second member, the printed circuit board and the electronic component being positioned between the plate member and the cooling member, and
a circuit provided to the plate member and that is electrically coupled with the printed circuit board,

wherein the conductive plate or the conductive foil is thicker than each of the layered wiring layers.

7. The electronic apparatus according to claim 6 , wherein a terminal that couples the printed circuit board and the circuit to each other is provided above a surface of the plate member.

8. The electronic apparatus according to claim 7 , wherein the terminal is elastically deformable.

9. The electronic apparatus according to claim 6 , wherein the printed circuit board includes a large-diameter via and a small-diameter via having a smaller diameter than the large-diameter via which penetrate the layered conductive plates or the layered conductive foils.

10. The electronic apparatus according to claim 9 , wherein the circuit includes a via coupled to the large-diameter via through a terminal provided between the plate member and the printed circuit board.

Assignees

• Fujitsu Ltd

Inventors

• Taguchi Jun

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H05K2201/10409

  Screws · CPC title

• H05K2201/09754

  Connector integrally incorporated in the printed circuit board [PCB] or in housing · CPC title

• H05K1/0203 Primary

  Cooling of mounted components (H05K1/0272 takes precedence) · CPC title

• H05K2201/042

  Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other · CPC title