Manufacturing method of semiconductor apparatus, semiconductor apparatus, and endoscope

Patent metadata

Field	Value
Publication number	US-9866738-B2
Application number	US-201514793111-A
Country	US
Kind code	B2
Filing date	Jul 7, 2015
Priority date	Jan 11, 2013
Publication date	Jan 9, 2018
Grant date	Jan 9, 2018

Abstract

A manufacturing method of an image pickup apparatus includes a step of manufacturing an image pickup device chip, a step of manufacturing a wiring board having first terminals and second terminals disposed on both sides of a first primary surface with a central flexible portion intervened in between, a step of joining a heat conductive block to a second primary surface of the wiring board, a step of joining the image pickup device chip to the first terminals of the wiring board, a step of performing solder joining of core wires of a cable to the second terminals of the wiring board by conducting heat generated by a heat tool through the heat conductive block, a step of bending the wiring board, and a step of performing housing inside a frame member, and sealing with sealing resin.

First claim

What is claimed is:

1. A manufacturing method of a semiconductor apparatus, comprising:
a step of manufacturing a semiconductor device chip having a semiconductor device unit on an obverse surface and junction terminals on a reverse surface, the junction terminals being connected with the semiconductor device unit via through wirings;
a step of manufacturing a wiring board having a rectangular shape and a width smaller than a width of the semiconductor device chip, the wiring board having first terminals and second terminals on a first primary surface, the first terminals disposed on a first end of the first primary surface and the second terminals being disposed on a second end of the first primary surface with a flexible portion intervened in between;
a step of joining a first junction surface of a heat conductive block to a second primary surface of the wiring board in a second terminal opposing region which is opposite to a region in which the second terminals are disposed on the first primary surface of the wiring board in a planar state, the heat conductive block being made of a material having thermal conductivity not lower than 20 Wm −1 K −1 ;
a step of joining the junction terminals of the semiconductor device chip to the first terminals of the wiring board in the planar state;
a step of performing solder joining of core wires of a signal cable to the second terminals of the wiring board by conducting heat generated by a heat tool, which is heated to have a soldering temperature, through the heat conductive block;
a step of bending the wiring board at the flexible portion such that a second junction surface of the heat conductive block which is opposite to the first junction surface comes in contact with the second primary surface of the wiring board, and arranging the wiring board within a projected plane of the semiconductor device chip; and
a step of housing the semiconductor device chip, the wiring board, the heat conductive block, and the signal cable, which are integrated, inside a frame member made of metal, and sealing the semiconductor device chip, the wiring board, the heat conductive block and the signal cable with sealing resin.

2. The manufacturing method of a semiconductor apparatus according to claim 1 , wherein the heat conductive block is housed inside the frame member such that a side surface of the heat conductive block is in contact with the frame member.

3. The manufacturing method of a semiconductor apparatus according to claim 1 , further comprising a step of joining a part of a heat radiation member in a belt shape to the second primary surface of the wiring board in a first terminal opposing region which is opposite to a region in which the first terminals are disposed on the first primary surface of the wiring board, the heat radiation member being made of a material having thermal conductivity not lower than 20 Wm −1 K −1 , before the step of performing the solder joining of the core wires.

4. The manufacturing method of a semiconductor apparatus according to claim 1 , wherein the semiconductor apparatus is an image pickup apparatus having the semiconductor device unit as an image pickup unit.

5. A semiconductor apparatus, comprising:
a semiconductor device chip having a semiconductor device unit on an obverse surface and junction terminals on a reverse surface, the junction terminals being connected with the semiconductor device unit via through wirings;
a signal cable having core wires electrically connected with the semiconductor device unit;
a wiring board having a rectangular shape and a width smaller than a width of the semiconductor device chip, the wiring board having first terminals joined to the junction terminals and second terminals on a first primary surface, the first terminals disposed on a first end of the first primary surface and the second terminals and second terminals being disposed on a second end of the first primary surface with a flexible portion intervened in between, the second terminals being joined to the core wires of the signal cable by soldering, the wiring board being bent at the flexible portion to be in a state where the first primary surface and the second primary surface are parallel;
a heat conductive block sandwiched by the second primary surface of the wiring board that is bent, and made of a material having thermal conductivity not lower than 20 Wm −1 K −1 ; and
a frame member in which the semiconductor device chip, the wiring board, the heat conductive block and the signal cable are housed, the frame member being made of metal and an inside of the frame member being sealed with sealing resin.

6. The semiconductor apparatus according to claim 5 , wherein the heat conductive block has convex portions at positions opposite to the second terminals on the first junction surface in contact with the wiring board.

7. The semiconductor apparatus according to claim 5 , wherein a side surface of the heat conductive block is in contact with the frame member.

8. The semiconductor apparatus according to claim 5 , further comprising a heat radiation member in a belt shape, a part of the heat radiation member being sandwiched by the heat conductive block and the wiring board, an extending portion of the heat radiation member being joined to the frame member, and the heat radiation member being made of a material having thermal conductivity not lower than 20 Wm −1 K −1 .

9. The semiconductor apparatus according to claim 5 , wherein the semiconductor apparatus is an image pickup apparatus having the semiconductor device unit as an image pickup unit.

10. An endoscope comprising an image pickup apparatus at a distal end portion of an insertion portion, the image pickup apparatus comprising:
an image pickup device chip having an image pickup unit on an obverse surface and junction terminals on a reverse surface, the junction terminals being connected with the image pickup unit via through wirings;
a signal cable having core wires electrically connected with the image pickup unit;
a wiring board having a rectangular shape and a width smaller than a width of the image pickup device chip, the wiring board having first terminals joined to the junction terminals and second terminals on a first primary surface, the first terminals disposed on a first end of the first primary surface and second terminals being disposed on a second end of the first primary surface with a flexible portion intervened in between, the second terminals being joined to the core wires of the signal cable by soldering, the wiring board being bent at the flexible portion to be in a state where the first primary surface and the second primary surface are parallel;
a heat conductive block sandwiched by the second primary surface of the wiring board that is bent, and made of a material having thermal conductivity not lower than 20 Wm −1 K −1 ; and
a frame member in which the image pickup device chip, the wiring board, the heat conductive block and the signal cable are housed, the frame member being made of metal and an inside of the frame member being sealed with sealing resin.

Assignees

• Olympus Corp

Inventors

• Kojima Kazuaki

Classifications

• H04N23/57 Primary

  Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices · CPC title

• H04N23/54

  Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils · CPC title

• H04N5/369

  Electricity · mapped topic

• H05K1/181

  associated with surface mounted components · CPC title

• H04N5/2253

  Electricity · mapped topic