Electrical contact assembly for printed circuit boards

Patent metadata

Field	Value
Publication number	US-9865953-B2
Application number	US-201715646234-A
Country	US
Kind code	B2
Filing date	Jul 11, 2017
Priority date	Mar 4, 2016
Publication date	Jan 9, 2018
Grant date	Jan 9, 2018

Abstract

A socket housing and contact assembly process includes forming the solder ball contact region after initial installation of a set of contacts into the housing. The contact regions of the set of contacts pass through corresponding contact cavities to extend beyond the housing and the contact regions are formed over at equal angles for solder ball placement.

First claim

What is claimed is:

1. An assembly process comprising:
inserting a socket pin into a socket housing, the socket pin having a contact region, the socket housing having a rectangular contact cavity that receive the contact region, the contact region passing through the rectangular contact cavity and extending beyond the socket housing;
bending the socket pin such that the contact region is configured to receive a solder ball including:
securing the socket housing,
striking the contact region in a first direction, and
striking the contact region in a second direction such that the contact region is bent more than 90 degrees from an original orientation; and

attaching the solder ball to the contact region;
wherein:
the contact region is bounded by an end of the socket pin and a stress concentration feature, and
the socket pin bends at the stress concentration feature.

2. The assembly process of claim 1 , wherein striking the contact region the second direction causes the socket pin to contact a standoff of the socket housing.

3. The assembly process of claim 1 , wherein the socket pin is a central processing unit (CPU) socket pin.

4. The assembly process of claim 3 , wherein the socket pin is a land grid array (LGA) socket pin.

5. The assembly process of claim 1 , wherein the stress concentration feature has a smaller width than the contact region.

6. The assembly process of claim 1 , wherein the stress concentration feature is a scoreline.

7. The assembly process of claim 1 , wherein:
the socket housing includes a standoff located on the side of the socket housing where the contact region of the socket pin extends out and located on the side of the rectangular contact cavity where the socket pin is bent.

Assignees

• IBM

Inventors

• Fan Na
• Hu Jun
• Huang Sen Xiong
• Shi Yongdong
• Yin Xiyuan

Classifications

• H05K2201/1078

  Leads having locally deformed portion, e.g. for retention · CPC title

• H01R43/205

  with a panel or printed circuit board · CPC title

• H05K1/184

  associated with components inserted in holes through the PCBs and wherein terminals of the components are connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes · CPC title

• H01R12/716

  Coupling device provided on the PCB · CPC title

• H05K2201/10803

  Tapered leads, i.e. leads having changing width or diameter · CPC title