Nanostructured copper-selenide with high thermoelectric figure-of-merit and process for the preparation thereof

US9865791B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9865791-B2
Application numberUS-201415021661-A
CountryUS
Kind codeB2
Filing dateMar 12, 2014
Priority dateSep 12, 2013
Publication dateJan 9, 2018
Grant dateJan 9, 2018

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  1. Title

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  2. Abstract

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  5. First independent claim

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Abstract

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Disclosed is a nanostructured p-type copper-selenide as a cost-effective thermoelectric material with a high thermoelectric figure-of-merit. The nanostructured copper-selenide is a cost-effective p-type thermoelectric material having a high figure-of-merit of 2 at 973 K and is synthesized employing high energy ball milling process followed by reaction sintering under pressure at high heating rates using spark plasma sintering of the resulting nanopowders. The sintered copper-selenide shows a density of 99.9% of theoretical density and retains the nanoscale features introduced during ball milling leading to a thermoelectric figure of merit of 2 at 973 K.

First claim

Opening claim text (preview).

We claim: 1. A nanostructured copper-selenide having a formula of Cu X Se X-1 , wherein X has an atomic ratio in the range of 1.99 to 2.01, and wherein the copper-selenide is a p-type thermoelectric material with a high thermoelectric figure-of-merit of 2 at 973K. 2. The nanostructured copper-selenide of claim 1 , wherein the nanostructured copper-selenide has an average crystallite size in the range of 5 nm to 30 nm. 3. A process for the synthesis of the nanostructured copper-selenide of claim 1 comprising the steps of: i. mixing copper (Cu) and selenium (Se) powders in an atomic ratio ranging between 1.97 to 2.03 to obtain a mixture; ii. milling the mixture as obtained in step (i) by using balls in a high energy ball mill with a 2 to 4 weight percent process control reagent at a speed of 300 to 400 rpm for a period in the range of 40 to 70 hours to obtain a Cu and Se nanopowder; iii. compacting the Cu and Se nanopowder as obtained in step (ii) on a hydraulic press at a pressure of 0.3 to 0.5 MPa to obtain a compacted pellet; iv. consolidating the compacted pellet as obtained in step (iii) using a spark plasma sintering process in a vacuum for a period in the range of 3 to 5 minutes followed by cooling and releasing the pressure to obtain nanostructured copper-selenide. 4. The process of claim 3 , wherein a ball to powder weight ratio in the range of 15:1 to 20:1 is used in the high energy ball mill of step (ii). 5. The process of claim 3 , wherein the Cu and Se nanopowder is compacted in a 12.7 mm inner diameter high strength graphite die. 6. The process of claim 3 , wherein the 2 to 4 weight percent process control reagent is stearic acid. 7. The process of claim 3 , wherein the spark plasma sintering process is carried out at a pressure of 50 to 80 MPa. 8. The process of claim 3 , wherein the spark plasma sintering process is carried out at a temperature in the range of 800 to 900 K with a heating rate of 300 to 450 K/min in a vacuum of 3 to 8 Pa in a high-strength graphite die. 9. The process of claim 3 , wherein the milling is carried out in an inert atmosphere of argon gas.

Assignees

Inventors

Classifications

  • C01B19/007Primary

    Tellurides or selenides of metals (C01B19/002 takes precedence) · CPC title

  • obtained by SEM · CPC title

  • Electricity · mapped topic

  • by peak-intensities or a ratio thereof only · CPC title

  • H01L35/16Primary

    Electricity · mapped topic

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What does patent US9865791B2 cover?
Disclosed is a nanostructured p-type copper-selenide as a cost-effective thermoelectric material with a high thermoelectric figure-of-merit. The nanostructured copper-selenide is a cost-effective p-type thermoelectric material having a high figure-of-merit of 2 at 973 K and is synthesized employing high energy ball milling process followed by reaction sintering under pressure at high heating ra…
Who is the assignee on this patent?
Council Scient Ind Res
What technology area does this patent fall under?
Primary CPC classification C01B19/007. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Jan 09 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).