Printed capacitors

Patent metadata

Field	Value
Publication number	US-9865600-B2
Application number	US-201615225964-A
Country	US
Kind code	B2
Filing date	Aug 2, 2016
Priority date	Jun 18, 2014
Publication date	Jan 9, 2018
Grant date	Jan 9, 2018

Abstract

A device comprises a destination substrate; a multilayer structure on the destination substrate, wherein the multilayer structure comprises a plurality of printed capacitors stacked on top of each other with an offset between each capacitor along at least one edge of the capacitors; and wherein each printed capacitor includes a plurality of electrically connected capacitors. Each printed capacitor of the plurality of printed capacitors can be a horizontal or a vertical capacitor. Each printed capacitor can include a plurality of capacitor layers, each capacitor layer including a plurality of electrically connected capacitors.

First claim

What is claimed:

1. A device comprising:
a destination substrate;
a multilayer structure on the destination substrate, wherein the multilayer structure comprises a plurality of printed capacitors stacked on top of each other with an offset between each capacitor along at least one edge of the capacitors; and
wherein each printed capacitor includes a plurality of electrically connected capacitors.

2. The device of claim 1 , wherein one or more of the capacitors of the plurality of electrically connected capacitors are stacked-plate capacitors.

3. The device of claim 1 , wherein one or more of the capacitors of the plurality of electrically connected capacitors are trench capacitors.

4. The device of claim 1 , wherein two or more of the capacitors of the plurality of electrically connected capacitors are electrically connected in parallel.

5. The device of claim 1 , wherein two or more of the capacitors of the plurality of electrically connected capacitors are electrically connected in series.

6. The device of claim 1 , wherein each printed capacitor includes a plurality of capacitor layers, each capacitor layer including a plurality of electrically connected capacitors.

7. A wafer of printable capacitors, the wafer comprising:
a source substrate;
a first sacrificial layer on a process side of the source substrate;
a first set of printable capacitors on the first sacrificial layer;
a second sacrificial layer on the first set of printable capacitors;
a second set of printable capacitors on the second sacrificial layer; and
wherein each printed capacitor includes a plurality of electrically connected capacitors.

8. The device of claim 7 , wherein one or more of the capacitors of the plurality of electrically connected capacitors are stacked-plate capacitors.

9. The device of claim 7 , wherein one or more of the capacitors of the plurality of electrically connected capacitors are trench capacitors.

10. The device of claim 7 , wherein two or more of the capacitors of the plurality of electrically connected capacitors are electrically connected in parallel.

11. The device of claim 7 , wherein two or more of the capacitors of the plurality of electrically connected capacitors are electrically connected in series.

12. The device of claim 7 , wherein each printed capacitor includes a plurality of capacitor layers, each capacitor layer including a plurality of electrically connected capacitors.

13. A method for assembling a plurality of capacitors on a receiving surface of a substrate, the method comprising:
contacting a first capacitor of the plurality of capacitors with a transfer device having a contact surface, thereby temporarily binding the capacitor to the contact surface such that the contact surface has the capacitor temporarily disposed thereon;
contacting the first capacitor disposed on the contact surface of the transfer device with the receiving surface of the substrate;
separating the contact surface of the transfer device and the capacitor, wherein the capacitor is transferred onto the receiving surface, thereby assembling the capacitor on the receiving surface of the substrate;
contacting a second capacitor of the plurality of capacitors with the transfer device, thereby binding the second capacitor to the contact surface such that the contact surface has the second capacitor disposed thereon;
contacting the second capacitor disposed on the contact surface of the transfer device with a surface of the first capacitor assembled on the receiving surface of the substrate; and
separating the contact surface of the transfer device and the second capacitor, wherein the second capacitor is transferred onto the capacitor assembled on the receiving surface of the substrate, thereby assembling the second capacitor on the capacitor assembled on the receiving surface of the substrate; and
wherein each first and second printed capacitor includes a plurality of electrically connected capacitors.

14. The device of claim 13 , wherein one or more of the capacitors of the plurality of electrically connected capacitors are stacked-plate capacitors.

15. The device of claim 13 , wherein one or more of the capacitors of the plurality of electrically connected capacitors are trench capacitors.

16. The device of claim 13 , wherein two or more of the capacitors of the plurality of electrically connected capacitors are electrically connected in parallel.

17. The device of claim 13 , wherein two or more of the capacitors of the plurality of electrically connected capacitors are electrically connected in series.

18. The device of claim 13 , wherein each printed capacitor includes a plurality of capacitor layers, each capacitor layer including a plurality of electrically connected capacitors.

Assignees

• X Celeprint Ltd

Inventors

• Bower Christopher
• Meitl Matthew
• Cok Ronald S

Classifications

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W44/248

  for antennas · CPC title

• H10W90/732

  between stacked chips · CPC title

• H10P72/7434

  used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate · CPC title

• H10P72/7428

  used to support diced chips prior to mounting · CPC title