Compositions for solution process, electronic devices fabricated using the same, and fabrication methods thereof
US-2015372148-A1 · Dec 24, 2015 · US
US9865461B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9865461-B2 |
| Application number | US-201414899435-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 6, 2014 |
| Priority date | Jun 18, 2013 |
| Publication date | Jan 9, 2018 |
| Grant date | Jan 9, 2018 |
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The present invention relates to a liquid-phase process for producing structured silicon- and/or germanium-containing coatings by the application to a substrate of at least one coating composition, the partial activation of the resulting coating on the coated substrate, and oxidation of non-activated coating on the substrate, to the coats produced by the process and to their use.
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The invention claimed is: 1. A liquid-phase process for producing a structured silicon- and/or germanium-containing coating, comprising: a) applying at least one coating composition to a substrate, to obtain a coated substrate, b) partially activating the resulting coating on the coated substrate, and c) oxidizing a non-activated coating on the substrate, wherein the coating composition has at least two precursors, of which at least one is a hydridosilane oligomer and at least one is a hydridosilane of the generic formula Si n H 2n+2 with n=3 to 10, wherein the hydridosilane oligomer is obtainable by thermal reaction of a composition comprising at least one non-cyclic hydridosilane having not more than 20 silicon atoms in the absence of a catalyst at temperatures of less than 235° C.; wherein the partially activating of the resulting coating in b) refers to a transformation of the deposited precursors of the resulting coating into an amorphous or a crystalline semiconductor coating. 2. The process according to claim 1 , wherein the coating composition comprises at least one solvent and at least one silicon- and/or germanium-containing precursor which is solid or liquid under SATP conditions at 25° C. and 1.013 bar. 3. The process according to claim 1 , wherein one precursor has the generic formula M n X c with M=Si and/or Ge, X=H, F, Cl, Br, I, C 1 -C 10 alkyl, C 1 -C 10 alkenyl, C 5 -C 20 aryl, n≧4 and 2n≦c≦2n+2. 4. The process according to claim 2 , wherein the at least one silicon- and/or germanium-containing precursor is a silicon- and/or germanium-containing nanoparticle. 5. The process according to claim 1 , wherein the hydridosilane of the formula Si n H 2n+2 is branched. 6. The process according to claim 5 , wherein the hydridosilane is isotetrasilane, 2-silyltetrasilane, neopentasilane or a mixture of nonasilane isomers. 7. The process according to claim 1 , wherein the hydridosilane oligomer has a weight-average molecular weight of 200 to 10,000 g/mol. 8. The process according to claim 1 , wherein the hydridosilane oligomer has been obtained by oligomerization of non-cyclic hydridosilanes. 9. The process according to claim 1 , wherein the coating composition is applied in structured form to the substrate. 10. The process according to claim 9 , wherein at least two different coating compositions are applied in structured form, simultaneously or successively and also with or without overlap, to different regions of a substrate. 11. The process according to claim 1 , wherein the oxidizing takes place in an oxygen-containing atmosphere at a temperature≦300° C. 12. The process according to claim 1 , wherein the oxidizing is carried out with an oxidizing agent selected from the group consisting of ozone, carbon dioxide, hydrogen peroxide (H 2 O 2 ), steam (H 2 O), a mono- or polyhydric alcohol, a ketone, a carboxylic acid, a carbonic ester and mixtures comprising trichloroacetic acid and oxygen, and also HCl and oxygen.
Silicon, silicon germanium or germanium · CPC title
using solutions · CPC title
Electricity · mapped topic
Electricity · mapped topic
inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds · CPC title
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