Semiconductor retrofit lamp having connecting elements arranged on two sides

US9863628B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9863628-B2
Application numberUS-201314399164-A
CountryUS
Kind codeB2
Filing dateApr 29, 2013
Priority dateMay 8, 2012
Publication dateJan 9, 2018
Grant dateJan 9, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Various embodiments may relate to a semiconductor retrofit bulb, in particular a retrofit festoon bulb, having connecting elements that are arranged on two sides. The semiconductor retrofit bulb may include at least a tubular cooling body having at least one outer face support surface, wherein there is arranged on the support surface at least one semiconductor light source, in particular a light diode, a driver housing that is introduced into a hollow space of the tubular cooling body. At least one flow channel is provided between the driver housing and the cooling body.

First claim

Opening claim text (preview).

The invention claimed is: 1. A semiconductor retrofit bulb having connecting elements that are arranged on two sides, the semiconductor retrofit bulb comprising: a tubular cooling body having at least one outer face support surface, wherein there is arranged on the support surface at least one semiconductor light source; and a driver housing that is introduced into a hollow space of the cooling body such that the driver housing is radially within an annulus defined by the cooling body, wherein at least one flow channel is provided between the driver housing and the cooling body, the at least one flow channel being fluidly communicable with air outside of the semiconductor retrofit bulb, wherein the driver housing comprises, at end sides thereof, the connecting elements that protrude at least in part axially outside of the cooling body, and the connecting elements encase a contact element, wherein each part of the connecting elements is formed integrally with a part of the driver housing, and the part of the driver housing is surrounded by the cooling body. 2. The semiconductor retrofit bulb as claimed in claim 1 , wherein the driver housing is held in a press fit manner by the cooling body by way of connecting pieces. 3. The semiconductor retrofit bulb as claimed in claim 2 , wherein the driver housing comprises multiple parts and is held together by means of the press fit manner. 4. The semiconductor retrofit bulb as claimed in claim 3 , wherein at least one of the connecting elements comprises an electrically conductive contact element, that is inserted between two parts of the driver housing. 5. The semiconductor retrofit bulb as claimed in claim 2 , wherein the cooling body comprises an open circular profile having inwardly curved free ends and at least some of the connecting pieces engage in the inwardly curved free ends. 6. The semiconductor retrofit bulb as claimed in claim 1 , wherein the driver housing is inserted into the cooling body. 7. The semiconductor retrofit bulb as claimed in claim 1 , wherein the driver housing comprises a base form that has a rectangular profile. 8. The semiconductor retrofit bulb as claimed in claim 1 , wherein the cooling body comprises, at an end side, a receiving recess configured to introduce a cable duct that protrudes from the driver housing. 9. The semiconductor retrofit bulb as claimed in claim 1 , wherein the support surface comprises a strip-shaped base form and is equipped with semiconductor light sources that are arranged in a row. 10. The semiconductor retrofit bulb as claimed in claim 1 , wherein the support surface is covered by a diffusor. 11. The semiconductor retrofit bulb as claimed in claim 10 , wherein a carrier that is equipped with at least one semiconductor light source lies on the support surface and the diffusor pushes the carrier onto the support surface. 12. The semiconductor retrofit bulb as claimed in claim 1 , wherein the cooling body is a bent sheet metal part or a metal extrusion molded part. 13. The semiconductor retrofit bulb as claimed in claim 1 , wherein the semiconductor retrofit bulb is a retrofit festoon bulb. 14. The semiconductor retrofit bulb as claimed in claim 1 , wherein the driver housing includes: an upper part of the driver housing; and a lower part of the driver housing, and the upper part of the driver housing and the lower part of the driver housing protrude at least in part axially outside of the cooling body. 15. A method for producing a semiconductor retrofit bulb, the method comprising: providing a tubular cooling body that is equipped with at least with one semiconductor light source; and inserting a driver housing, at end sides thereof, connecting elements, into a hollow space of the cooling body such that the driver housing in radially within an annulus defined by the cooling body, the connecting elements protruding at least in part axially outside of the cooling body, said cooling body holding the driver housing in a press fit manner so that at least one flow channel is provided between the driver housing and the cooling body, the at least one flow channel being fluidly communicable with air outside of the semiconductor retrofit bulb, wherein the connecting elements encase a contact element, wherein each part of the connecting elements is formed integrally with a part of the driver housing, and the part of the driver housing is surrounded by the cooling body. 16. The method as claimed in claim 15 , wherein the driver housing comprises multiple parts and prior to said inserting the driver housing the following are performed: inserting a driver into one part of the driver housing; and loosely covering the one part of the driver housing with another part of the driver housing; and said inserting the driver housing comprises: inserting the loosely covered driver housing into the hollow space of the cooling body, said cooling body holding the driver housing in a press fit manner. 17. A semiconductor retrofit bulb, comprising: a tubular cooling body with an outer face, wherein the outer face comprises a support surface onto which a semiconductor light source is arranged; and a driver housing arranged in a hollow space of the tubular cooling body such that the driver housing is radially within an annulus defined by the cooling body, wherein the driver housing comprises a first part and at least one second part, where in the driver housing comprises, at end sides thereof, connecting elements that protrude outside of the cooling body in an axial direction, and wherein the connecting elements encase a contact element, wherein each part of the connecting elements is formed integrally with a part of the driver housing, and the part of the driver housing is surrounded by the cooling body. 18. The semiconductor retrofit bulb according to claim 17 , wherein the driver housing comprises connecting pieces that extend along a radial direction, wherein the cooling body comprises inwardly curved free ends, and wherein at least some of the connecting pieces engage in the inwardly curved free ends. 19. The semiconductor retrofit bulb according to claim 17 , wherein the semiconductor light source is housed in a recess in the cooling body such that the cooling body frames the semiconductor light source on two sides thereof.

Assignees

Inventors

Classifications

  • Light-emitting diodes [LED] · CPC title

  • characterised by passive heat-dissipating elements, e.g. heat-sinks · CPC title

  • of means for protecting lighting devices from damage, e.g. housings · CPC title

  • comprising a linear array of point-like light-generating elements · CPC title

  • Arrangement or mounting of circuit elements integrated in the light source · CPC title

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What does patent US9863628B2 cover?
Various embodiments may relate to a semiconductor retrofit bulb, in particular a retrofit festoon bulb, having connecting elements that are arranged on two sides. The semiconductor retrofit bulb may include at least a tubular cooling body having at least one outer face support surface, wherein there is arranged on the support surface at least one semiconductor light source, in particular a ligh…
Who is the assignee on this patent?
Osram Gmbh, Ledvance Gmbh
What technology area does this patent fall under?
Primary CPC classification F21V29/83. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Jan 09 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).