Thermally-conductive polycarbonate resin composition and molded product formed therefrom

Patent metadata

Field	Value
Publication number	US-9862870-B2
Application number	US-201314912963-A
Country	US
Kind code	B2
Filing date	Dec 2, 2013
Priority date	Aug 23, 2013
Publication date	Jan 9, 2018
Grant date	Jan 9, 2018

Abstract

The present invention relates to a thermally conductive polycarbonate resin composition comprising (A) a polycarbonate resin, (B) a thermally conductive filler, (C) a modified polyolefin-based copolymer and (D) a low-molecular-weight polyolefin-based resin, thereby simultaneously exhibiting high impact strength, improving thermal conductivity and mechanical properties such as tensile strength and elongation, and having an excellent extrusion molding property.

First claim

The invention claimed is:

1. A thermally conductive polycarbonate resin composition, comprising: (A) a polycarbonate resin, (B) thermally conductive fillers, (C) 0.1 parts by weight to 5 parts by weight of a modified polyolefin copolymer, and (D) 0.1 parts by weight to 5 parts by weight of a low molecular weight polyolefin resin having a weight average molecular weight of 1,000 g/mol to 10,000 g/mol, wherein the amounts of (C) modified polyolefin copolymer and (D) low molecular weight polyolefin resin are based on 100 parts by weight of a base resin comprising 20 wt % to 40 wt % of the polycarbonate resin (A) and 60 wt % to 80 wt % of the thermally conductive fillers (B),
wherein the thermally conductive fillers (B) are spherical fillers having an average particle diameter of 30 μm to 80 μm.

2. The thermally conductive polycarbonate resin composition according to claim 1 , wherein the modified polyolefin copolymer contains at least one functional group selected from among a maleic anhydride group, an amine group, and an epoxy group.

3. The thermally conductive polycarbonate resin composition according to claim 1 , wherein the low molecular weight polyolefin resin is prepared by pyrolysis or chemolysis of a high molecular weight polyolefin, wherein the high molecular weight polyolefin has a higher molecular weight than the low molecular weight polyolefin prepared by pyrolysis or chemolysis thereof.

4. The thermally conductive polycarbonate resin composition according to claim 1 , wherein the thermally conductive fillers (B) are selected from the group consisting of magnesium oxide, boron nitride, aluminum oxide, and mixtures thereof.

5. The thermally conductive polycarbonate resin composition according to claim 1 , further comprising: additives selected from the group consisting of antimicrobials, heat stabilizers, antioxidants, release agents, photo-stabilizers, inorganic additives, surfactants, coupling agents, plasticizers, compatibilizers, lubricants, antistatic agents, colorants, pigments, dyes, flame retardants, auxiliary flame retardants, anti-dripping agents, weathering agents, UV absorbers, UV blocking agents, and mixtures thereof.

6. A molded article comprising the thermally conductive polycarbonate resin composition according to claim 1 .

7. The molded article according to claim 6 , wherein the molded article has an impact strength (kgf·cm/cm) of 6 to 15 and a melt index (250° C./10 kg, g/10 min) of 20 to 35.

8. The thermally conductive polycarbonate resin composition according to claim 1 , wherein the thermally conductive fillers (B) comprise magnesium oxide.

9. The thermally conductive polycarbonate resin composition according to claim 8 , wherein the magnesium oxide has an average particle diameter of 40 μm to 60 μm.

10. The thermally conductive polycarbonate resin composition according to claim 1 , wherein a molded article made using the thermally conductive polycarbonate resin has an impact strength (kgf·cm/cm) of 6 to 15, a melt index (250° C./10 kg, g/10 min) of 20 to 35, and a thermal conductivity of 0.97 to 0.98 W/mK as measured on a specimen having a size of 1×1×1 mm3 by the laser flash method in accordance with ASTM E 1461.

11. The thermally conductive polycarbonate resin composition according to claim 1 , wherein the modified polyolefin copolymer (C) comprises a polyolefin backbone comprising at least one of polyethylene, polypropylene, and an ethylene-propylene copolymer and 0.2 wt % to 5 wt % of least one of a maleic anhydride group, an amine group, and an epoxy group grafted to the polyolefin backbone.

12. The molded article according to claim 7 , wherein the molded article has a thermal conductivity of 0.97 to 0.98 W/mK as measured on a specimen having a size of 1×1×1 mm3 by the laser flash method in accordance with ASTM E 1461.

Assignees

• Samsung Sdi Co Ltd
• Lotte Advanced Mat Co Ltd

Inventors

• Kim Nam Hyun
• Shin Chan Gyun
• Jeon Byung Kuk
• Lim Jong Cheol

Classifications

• C08K3/38

  Boron-containing compounds · CPC title

• C08K2201/001

  Conductive additives · CPC title

• C08L23/26

  modified by chemical after-treatment (saponified copolymers C08L23/0861; unsaturated acid salts C08L23/0876) · CPC title

• C09K5/14 Primary

  Solid materials, e.g. powdery or granular · CPC title

• C08L69/00 Primary

  Compositions of polycarbonates; Compositions of derivatives of polycarbonates · CPC title