Silica composition
US-9528010-B2 · Dec 27, 2016 · US
US9862838B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9862838-B2 |
| Application number | US-201615350454-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 14, 2016 |
| Priority date | Dec 15, 2015 |
| Publication date | Jan 9, 2018 |
| Grant date | Jan 9, 2018 |
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A method for preparing an organic-inorganic hybrid porous insulation coating composition includes steps of: adding sepiolite nanoparticles that have been surface-treated with silane or dimethyl ammonium chloride to a thermal-resistant resin solution; and stirring the thermal-resistant resolution solution containing the sepiolite nanoparticles at 3600 rpm or more for 30 minutes or more. The thermal-resistant resin solution includes at least one thermal-resistant resin selected from the group consisting of polyamide-imide, polyester, polyester-imide and polyamic acid.
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What is claimed is: 1. A method for preparing an organic-inorganic hybrid porous insulation coating composition comprising steps of: adding sepiolite nanoparticles that have been surface-treated with silane or dimethyl ammonium chloride to a thermal-resistant resin solution; and stirring the thermal-resistant resolution solution containing the sepiolite nanoparticles at 3600 rpm or more for 30 minutes or more, wherein the thermal-resistant resin solution includes at least one thermal-resistant resin selected from the group consisting of polyamide-imide, polyester, polyester-imide and polyamic acid, and the sepiolite nanoparticles are added in a content of 0.1 to 5 wt %, based on a total weight of a solid included in the solution. 2. The method of claim 1 , wherein the sepiolite nanoparticle has a specific surface area of 230 to 380 m 2 /g. 3. The method of claim 1 , wherein the sepiolite nanoparticle has a size of 50 to 500 nm. 4. The method of claim 1 , wherein the thermal-resistant resin solution includes the thermal-resistant resin in a content of 15 to 45 wt %, based on a total weight of the thermal-resistant resin solution. 5. The method of claim 1 , wherein the thermal-resistant resin solution includes at least one organic solvent selected from the group consisting of N-methylpyrrolidone (NMP), dimethyl formamide (DMF), dimethylacetamide (DMAc), cellusolves, glycols, and ketones.
Compounds of silicon {(C09C1/0009, C09C1/0015, C09C1/0078 take precedence)} · CPC title
Ingredients treated with inorganic substances · CPC title
Chemistry & Metallurgy · mapped topic
Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced {(electrically insulating plastics, resins or waxes H01B3/30)}; Filling pastes · CPC title
Coating compositions based on polyamides obtained by reactions forming a carboxylic amide link in the main chain (based on polyhydrazides C09D179/06; based on polyamide-imides C09D179/08); Coating compositions based on derivatives of such polymers · CPC title
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