Cross-linkable compositions based on organosilicon compounds and thus produced molded bodies

Patent metadata

Field	Value
Publication number	US-9862642-B2
Application number	US-201414915085-A
Country	US
Kind code	B2
Filing date	Aug 11, 2014
Priority date	Aug 28, 2013
Publication date	Jan 9, 2018
Grant date	Jan 9, 2018

Abstract

Artificial stone which exhibits minimal visual change when exposed to weathering, UV light, and heat, is prepared by shaping and curing a crosslinkable composition based on crosslinkable organopolysiloxanes as a binder, at least 85% by weight of a filler component, the filler component containing at least 20% by weight of coarse grain mineral filler having grain sizes of 0.2 mm to 10 mm.

First claim

The invention claimed is:

1. A crosslinkable composition (M) comprising:
(A) crosslinkable organosilicon compounds, and
(B) a filler component,
(C) optionally, catalysts,
(D) optionally, initiators,
(E) optionally, accelerators,
(F) optionally, inhibitors, and
(G) optionally, further constituents other than (A) through (F), with the proviso that the content of the filler component (B) is at least 85% by weight, and the filler component (B) contains all fillers employed in the crosslinkable component, and contains at least 20% by weight, based on the total amount of (B), of coarse-grained fillers with grain sizes of from 0.2 mm to 10 mm, wherein the cross-linkable composition contains from 900 to 2400 parts by weight of the filler component (B) per 100 parts of cross-linkable organosilicon compounds (A), and wherein following crosslinking, the composition exhibits a Shore D hardness of 75 or greater.

2. The crosslinkable composition of claim 1 , wherein the crosslinkable composition is a condensation crosslinkable composition, wherein crosslinkable groups are selected from the group consisting of silicon-bonded hydroxyl groups, silicon-bonded alkoxy groups, and mixtures thereof.

3. The crosslinkable composition of claim 1 , wherein the organosilicon compounds (A) are organosilicon compounds crosslinkable by addition reaction.

4. The crosslinkable composition of claim 3 , wherein the organosilicon compounds (A) are organosilicon compounds crosslinkable by a hydrosilylation addition reaction.

5. A method for producing a crosslinkable composition of claim 1 , comprising mixing the individual components in any desired sequence.

6. A method for producing molded bodies based on organosilicon compounds, comprising shaping and curing a crosslinkable compositions produced by the method of claim 5 .

7. The method of claim 6 , wherein the crosslinkable compositions are shaped by means of mechanical pressure, wherein excess air in the composition is optionally removed partially or completely during shaping by application of an atmospheric low pressure to the mold, and further densification is optionally achieved during and/or after shaping by vibration of the mold, and the compositions are cured during and/or after shaping by increasing the temperature.

8. A molded body, produced by crosslinking a composition of claim 1 .

9. The molded body of claim 8 , wherein the molded body is an artificial stone.

10. The crosslinkable composition of claim 1 , wherein at least one crosslinkable organosilicon compound is a crosslinkable silicone resin.

11. The crosslinkable composition of claim 10 , wherein the crosslinkable silicone resin bears silicon-bonded hydroxyl and/or alkoxy groups.

12. The crosslinkable composition of claim 10 , wherein the crosslinkable silicone resin bears silicon-bonded alkenyl groups.

13. The crosslinkable composition of claim 10 , wherein the crosslinkable silicone resin bears silicon-bonded hydrogen.

14. A crosslinkable composition (M) comprising:
(A) crosslinkable organosilicon compounds, and
(B) a filler component,
(C) optionally, catalysts,
(D) optionally, initiators,
(E) optionally, accelerators,
(F) optionally, inhibitors, and
(G) optionally, further constituents other than (A) through (F), with the proviso that the content of the filler component (B) is at least 85% by weight, and the filler component (B) contains all fillers employed in the crosslinkable component, and contains at least 20% by weight, based on the total amount of (B), of coarse-grained fillers with grain sizes of from 0.2 mm to 10 mm, and wherein the cross-linkable composition contains from 900 to 2400 parts by weight of the filler component (B) per 100 parts of cross-linkable organosilicon compounds (A), wherein the crosslinkable compositions are addition crosslinking compositions wherein crosslinking is initiated by an organic peroxide.

15. The molded body of claim 14 , which exhibits a hardness of at least 60 Shore D following crosslinking.

16. The molded body of claim 14 , which exhibits a hardness of at least 75 Shore D following crosslinking.

17. A method for producing a molded body based on organosilicon compounds, comprising shaping and curing a crosslinkable composition (M) comprising:
(A) crosslinkable organosilicon compounds, and
(B) a filler component,
(C) optionally, catalysts,
(D) optionally, initiators,
(E) optionally, accelerators,
(F) optionally, inhibitors, and
(G) optionally, further constituents other than (A) through (F), with the proviso that the content of the filler component (B) is at least 85% by weight, and the filler component (B) contains all fillers employed in the crosslinkable component, and contains at least 20% by weight, based on the total amount of (B), of coarse-grained fillers with grain sizes of from 0.2 mm to 10 mm, and wherein the cross-linkable composition contains from 900 to 2400 parts by weight of the filler component (B) per 100 parts of cross-linkable organosilicon compounds (A), wherein excess air in the composition is removed partially or completely during shaping by application of an atmospheric low pressure to the mold, and/or further densification is achieved during and/or after shaping by vibration of the mold, and the compositions are cured during and/or after shaping by increasing the temperature.

18. The crosslinkable composition of claim 17 , which exhibits a Shore D hardness of at least 60 following crosslinking.

19. The crosslinkable composition of claim 17 , which exhibits a Shore D hardness of at least 75 following crosslinking.

20. A crosslinkable composition (M) consisting of:
(A) crosslinkable organosilicon compounds, and
(B) a filler component,
(C) optionally, catalysts,
(D) optionally, initiators,
(E) optionally, accelerators,
(F) optionally, inhibitors, and
(G) optionally, further constituents other than (A) through (F), with the proviso that the content of the filler component (B) is at least 85% by weight, and the filler component (B) contains all fillers employed in the crosslinkable component, and contains at least 20% by weight, based on the total amount of (B), of coarse-grained fillers with grain sizes of from 0.2 mm to 10 mm, wherein the cross-linkable composition contains from 900 to 2400 parts by weight of the filler component (B) per 100 parts of cross-linkable organosilicon compounds (A), wherein component (G) is selected from the group consisting of pigments, fragrances, oxidation inhibitors, agents for influencing electrical properties, flame proofing agents, functional silanes, silicates, water, and mixtures thereof.

Assignees

• Wacker Chemie Ag

Inventors

• Ostendorf Detlev
• Scheim Uwe
• Schildbach Daniel

Classifications

• C08L83/04 Primary

  Polysiloxanes · CPC title

• C08K3/013

  Fillers, pigments or reinforcing additives · CPC title

• C08K2201/005

  Additives being defined by their particle size in general · CPC title

• C04B26/32 Primary

  containing silicon · CPC title

• C08K3/0033

  Chemistry & Metallurgy · mapped topic