Substrate-based additive fabrication process and apparatus

US9862146B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9862146-B2
Application numberUS-201214126675-A
CountryUS
Kind codeB2
Filing dateJun 15, 2012
Priority dateJun 15, 2011
Publication dateJan 9, 2018
Grant dateJan 9, 2018

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A method and apparatus for additive fabrication which provides a substrate which helps the newly hardened resin layer to separate from the substrate while providing a substrate of appropriate strength and durability. In an embodiment, the substrate is a multi-layer substrate comprising a transport layer and a structural layer, the transport layer comprising a polyolefin or a fluoropolymer, and the structural layer comprising a semi-crystal line thermoplastic polymer.

First claim

Opening claim text (preview).

What is claimed is: 1. A process for additive fabrication comprising: (1) providing a flexible multi-layer substrate comprising a transport layer and a structural layer, the transport layer comprising a polyolefin or a fluoropolymer, and the structural layer comprising a semi-crystalline thermoplastic polymer; (2) coating a layer of radiation curable resin on the transport layer of the flexible multilayer substrate; (3) contacting the layer of radiation curable resin with a previously cured layer; (4) exposing the layer of radiation curable resin to actinic radiation, provided by a source of actinic radiation, thereby forming a cured layer which adheres to the previously cured layer; (5) separating the cured layer and the flexible multi-layer substrate; and (6) repeating steps 2-5 a sufficient number of times in order to build up a three-dimensional object; wherein the flexible multi-layer substrate has either a specific essetial work of fracture greater than 12 kJ/m 2 and less than 500 kJ/m 2 , a w p β of greater than 8 mJ/mm 3 and less than 500 mJ/mm 3 , or both, in each direction of support. 2. The process of claim 1 wherein the flexible multi-layer substrate possesses a parallel direction and a transverse direction and the flexible multi-layer substrate has either a specific essential work of fracture of greater than 12 kJ/m 2 and less than 500 kJ/m 2 , a w p β of greater than 8 mJ/mm 3 and less than 500 mJ/mm 3 , or both, in both the parallel direction and the transverse direction. 3. The process of claim 1 wherein the radiation curable resin comprises from 30 to 85 wt. % of cationically curable compounds, and from 10 to 60 wt. % of free-radically curable compounds. 4. The process of claim 1 wherein the transport layer possesses a surface, said surface being secured to the structural layer, wherein at least a portion of said surface has been subject to a corona treatment. 5. The process of claim 1 wherein the flexible multi-layer substrate has a thickness of from 20 to 250 microns. 6. The process of claim 1 wherein the actinic radiation is UV radiation in the range from 320 to 400 nm. 7. The process of claim 1 wherein the transport layer comprises a polyolefin. 8. The process of claim 1 wherein the transport layer is a polyethylene or polymethylpentene. 9. The process of claim 1 wherein the structural layer is a thermoplastic polyamide or thermoplastic polyester. 10. The process of claim 1 wherein the radiation curable resin possesses a temperature from 25 degrees C. to 45 degrees C. at the time of exposure to the actinic radiation. 11. The process of claim 1 wherein the transport layer has a matte surface finish. 12. The process of claim 1 wherein flexible multi-layer substrate is a two-layer substrate created by a lamination process, the transport layer and structural layer being secured to one another with a polyurethane adhesive. 13. A process for additive fabrication comprising: (1) coating a layer of radiation curable resin on a substrate, said substrate having a parallel direction and a transverse direction, and a surface tension of from 19.5 mN·m −1 to 41 nN·m −1 , a specific essential work of fracture from 12 kJ/m 2 to 500 kJ/m 2 in both the parallel direction and the transverse direction, a tensile modulus at the operating temperature of the additive fabrication process above 0.2 GPa and less than 6 GPa in the parallel direction, and a yield stress above 20 MPa and less than 150 MPa in the parallel direction; (2) contacting the layer of radiation curable resin with a previously cured layer; (3) exposing the layer of radiation curable resin to actinic radiation, provided by a source of actinic radiation, thereby forming a cured layer which adheres to the previously cured layer; (4) separating the cured layer and the substrate; and (5) repeating steps 1-4 a sufficient number of times in order to build up a three-dimensional object. 14. The process of claim 13 wherein the substrate is a flexible multi-layer substrate comprising a transport layer and a structural layer and the layer of radiation curable resin is coated on the transport layer of the multi-layer substrate. 15. The process of claim 13 wherein the actinic radiation is light, said light possessing a transmission spectrum, and wherein the substrate has a transmission of 80% of the light at the transmission spectrum. 16. The process of claim 13 wherein the substrate possesses a T g of from 30° C. to about 200° C. 17. The process of claim 15 wherein the substrate possesses a T g of from 30° C. to about 65° C. 18. The process of claim 13 wherein the substrate possesses a w p β of greater than 8 mJ/mm 3 in both the parallel and transverse direction. 19. The process of claim 13 Wherein the operating temperature of the additive fabrication process is from 25° C. to 45° C.

Assignees

Inventors

Classifications

  • B33Y10/00Primary

    Processes of additive manufacturing · CPC title

  • the energy source being concentrated, e.g. scanning lasers or focused light sources · CPC title

  • Structures for supporting 3D objects during manufacture and intended to be sacrificed after completion thereof · CPC title

  • Apparatus for additive manufacturing; Details thereof or accessories therefor · CPC title

  • Operations & Transport · mapped topic

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US9862146B2 cover?
A method and apparatus for additive fabrication which provides a substrate which helps the newly hardened resin layer to separate from the substrate while providing a substrate of appropriate strength and durability. In an embodiment, the substrate is a multi-layer substrate comprising a transport layer and a structural layer, the transport layer comprising a polyolefin or a fluoropolymer, and …
Who is the assignee on this patent?
Driessen Marco Marcus Matheus, Seitz Michelle Elizabeth, Steeman Paulus Antonius Maria, and 5 more
What technology area does this patent fall under?
Primary CPC classification B33Y10/00. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jan 09 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).