Selective laser-assisted transfer of discrete components

Patent metadata

Field	Value
Publication number	US-9862141-B2
Application number	US-201514968562-A
Country	US
Kind code	B2
Filing date	Dec 14, 2015
Priority date	Apr 11, 2011
Publication date	Jan 9, 2018
Grant date	Jan 9, 2018

Abstract

Electronic components are often assembled using robotic equipment, such as pick-and-place machines, that is not optimized for components such as ultra-thin semiconductor bare dice. Selective laser-assisted die transfer is described based on the unique blistering behavior of a multilayer dynamic release layer when irradiated by low energy focused laser pulse(s) in which the blister creates translation of the article being placed. Accurate placement results are provided with negligible lateral and angular displacement.

First claim

What is claimed is:

1. A method of transferring articles, comprising:
adhering an article to an adhesive layer of a laser-transparent carrier;
focusing a low-energy laser beam through the laser-transparent carrier on a blistering layer in said carrier, which is proximal said adhesive layer, to form a blister in the blistering layer which deforms said adhesive layer; and
transferring said article from said laser-transparent carrier to a receiving substrate placed in close proximity in response to separation of said article as the blister expands.

2. The method recited in claim 1 , wherein said blister expands to a substantially fixed distance in response to receiving said low-energy laser beam.

3. The method recited in claim 1 , wherein said blistering layer comprises a polymer, polyimide, or inorganic material selected for ablation in a controlled, and non-explosive, manner in response to irradiation with a laser beam of a given wavelength and pulse energy and which exhibits sufficient elastic behavior that a blister can be formed without rupturing.

4. The method recited in claim 1 , wherein said blistering layer is subject to ablation that is limited to a non-penetrating ablation creating vapors to form said blister without rupturing said blister.

5. The method recited in claim 1 , wherein said blister is formed in response to said low-energy laser beam evaporating a small amount of material from said blistering layer which generates gases that create a blister in said carrier which deforms said adhesive layer of said laser-transparent carrier.

6. The method recited in claim 1 , wherein said low-energy laser beam comprises a laser beam output having an ultraviolet wavelength.

7. The method recited in claim 1 , wherein said low-energy laser beam comprises a single pulse or series of pulses from a laser.

8. The method recited in claim 1 , wherein said low-energy laser beam has a scanning pattern with a high repetition rate and scanning speed selected to create a continuous blister.

9. The method recited in claim 8 , wherein said scanning pattern is selected from a group of scanning patterns consisting of straight lines, curved lines, closed curves, circles, triangles, rectangles, and other geometric shapes.

10. The method recited in claim 1 , wherein said low-energy laser beam comprises less than 1 mJ of energy to assure that said blisters do not burst during transfer of said article.

11. The method recited in claim 10 , wherein said low-energy laser has on the order of 20 μJ of energy per pulse.

12. The method recited in claim 1 , wherein material vaporized by said low-energy laser beam are confined to an interior of said blister within said blistering layer.

13. The method recited in claim 12 , wherein said ultra-thin article has a thickness of less than 100 μm.

14. The method recited in claim 12 , wherein said ultra-thin article has a thickness of less than 50 μm.

Assignees

• Ndsu Res Foundation

Inventors

• Marinov Val R
• Swenson Orven
• Pavicic Mark
• Miller Ross A
• Chen Zhigang
• Sarwar Ferdous
• Semler Matthew R

Classifications

• H10P72/7448

  the bond interface between the auxiliary support and the wafer comprising two or more, e.g. multilayer adhesive or adhesive and release layer · CPC title

• H10W72/07337

  using a polymer adhesive, e.g. an adhesive based on silicone or epoxy · CPC title

• H10W72/073 Primary

  of die-attach connectors · CPC title

• H10W72/07304

  the auxiliary member being temporary, e.g. a sacrificial coating · CPC title

• H10P72/7432

  used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate · CPC title