Techniques for powder delivery in additive fabrication and related systems and methods
US-2024017493-A1 · Jan 18, 2024 · US
US9862138B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9862138-B2 |
| Application number | US-201213534947-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 27, 2012 |
| Priority date | Jul 8, 2011 |
| Publication date | Jan 9, 2018 |
| Grant date | Jan 9, 2018 |
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A structure including a substrate and a coating material. The substrate includes a plurality of voids and a surface on which at least the plurality of voids are formed, and is formed such that a void ratio of the plurality of voids decreases one of 2-dimensionally and 3-dimensionally from an inner side of the substrate toward an outer side thereof. The coating material is formed on the surface of the substrate.
Opening claim text (preview).
The invention is claimed as follows: 1. A structure, comprising: a substrate that includes a plurality of unit cells, wherein the plurality of unit cells further includes a plurality of voids, each void of the plurality of voids extending along a central longitudinal axis of a unit cell, the plurality of voids aligned regularly such that a void ratio of the plurality of voids in the substrate decreases one of 2-dimensionally or 3-dimensionally from an inner side of the substrate toward an outer side thereof, wherein each unit cell of the plurality of unit cells has a hexagonal cross-section perpendicular to its central longitudinal axis and includes: an upper wall, a middle wall, and a lower wall arranged parallel to each other; a plurality of first communication holes opening on lateral side surfaces of the unit cell and positioned between the upper wall and the middle wall; and a plurality of second communication holes opening on lateral side surfaces of the unit cell and positioned between the middle wall and the lower wall, wherein each first communication hole of the plurality of first communication holes extends uninterruptedly from a respective first lateral side surface to a respective second lateral side surface of the unit cell, and wherein each second communication hole of the plurality of second communication holes extends uninterruptedly from the respective second lateral side surface to a respective third lateral side surface of the unit cell, wherein the third respective lateral side surface is adjacent to the second respective lateral side surface and the second respective lateral side surface is adjacent to the first respective lateral side surface of the unit cell; and a coating material formed on a surface of the substrate. 2. The structure according to claim 1 , wherein the plurality of first communication holes and the plurality of second communication holes cause the unit cell of the plurality of unit cells to communicate with an adjacent unit cell of the plurality of unit cells. 3. The structure according to claim 1 , wherein a shortest distance across the surface of the substrate that is located between the plurality of voids and the plurality of the first communication holes or the plurality of second communication holes is 100 to 10000 times a thickness of the coating material. 4. The structure according to claim 1 , wherein the coating material includes a metal layer. 5. The structure according to claim 4 , wherein the coating material further includes a resin layer formed on the metal layer. 6. The structure according to claim 1 , wherein the plurality of unit cells are aligned regularly on the substrate. 7. The structure according to claim 6 , wherein an alignment of opening surfaces of the plurality of voids in the substrate is a honeycomb structure. 8. The structure according to claim 1 , wherein a pitch of the plurality of voids changes at a predetermined rate from the inner side of the substrate to the outer side of the substrate.
Plural void-containing components · CPC title
Honeycomb-like · CPC title
With gradual property change within a component · CPC title
Processes of additive manufacturing · CPC title
Products made by additive manufacturing · CPC title
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