Processing apparatus and processing method

Patent metadata

Field	Value
Publication number	US-9862055-B2
Application number	US-201314770015-A
Country	US
Kind code	B2
Filing date	Nov 22, 2013
Priority date	Feb 27, 2013
Publication date	Jan 9, 2018
Grant date	Jan 9, 2018

Abstract

A processing apparatus and a processing method which perform processing more accurately with a simple structure are provided. The processing apparatus includes an irradiation head 16 and a control device. The irradiation head 16 includes a laser turning unit 35 and a condensing optical system 37 . The laser turning unit 35 includes a first prism 51 , a second prism 52 , a first rotating mechanism 53 , and a second rotating mechanism 54 . The control device adjusts the differences between rotation speeds and phase angles of the first prism 51 and the second prism 52 based on a relation between at least a heat affected layer of a workpiece and a turning speed of laser.

First claim

The invention claimed is:

1. A processing apparatus which performs processing by irradiating a workpiece with laser, comprising:
an irradiation head configured to irradiate the workpiece with the laser and including a laser turning unit which turns the laser relative to the workpiece and a condensing optical system which collects the laser turned by the laser turning unit; and
a control device configured to control an operation of the irradiation head, wherein
the laser turning unit includes a first prism which refracts the laser, a second prism which is arranged at a position opposite to the first prism and refracts the laser output from the first prism, a first rotating mechanism which rotates the first prism, and a second rotating mechanism which rotates the second prism, and
the control device is further configured to adjust a rotation speed of the first prism, a rotation speed of the second prism, and a difference in a phase angle between the first prism and the second prism based on a relationship between at least a predetermined allowable thickness of a heat-affected layer of the workpiece and a turning speed of the laser beam emitted to the workpiece to control the first rotation mechanism an the second rotation mechanism synchronously and relatively in rotation such that a thickness of the heat affected layer irradiated by the laser beam is smaller than the predetermined allowable thickness.

2. The processing apparatus according to claim 1 , wherein
the first rotating mechanism includes a first spindle which holds the first prism and comprises a through hole through which the laser passes, and a first hollow motor to which the first spindle is rotatably inserted and which rotationally drives the first spindle, and
the second rotating mechanism includes a second spindle which holds the second prism and comprises a through hole through which the laser passes, and a second hollow motor to which the second spindle is rotatably inserted and which rotationally drives the second spindle.

3. The processing apparatus according to claim 2 , wherein
an error of a difference in the phase angle between the first hollow motor and the second hollow motors is equal to or less than 0.1°.

4. The processing apparatus according to claim 1 , wherein
the control device controls the first and second rotating mechanisms based on a relation between at least the predetermined allowable thickness of the heat affected layer of the workpiece, the turning speed of the laser emitted to the workpiece, and a turning radius of the laser to adjust the rotation speed of the first prism, the rotation speed of the second prism, and the difference in the phase angle between the first prism and the second prism.

5. A processing method for performing processing by irradiating a workpiece with laser, comprising:
outputting the laser;
determining a rotation speed of a first prism, a rotation speed of a second prism, and a difference in a phase angle between the first prism and the second prism based on a relation between at least a predetermined allowable thickness of a heat affected layer of the workpiece and a turning speed of the laser beam irradiated to the workpiece such that a thickness of the heat affected layer irradiated by the laser beam is smaller than the predetermined allowable thickness;
rotating a first rotating mechanism and a second rotating mechanism synchronously and relatively in rotation based on the determined rotation speeds and the determined difference in the phase angle; and
irradiating the workpiece with the laser while turning the laser.

6. The processing method according to claim 5 , wherein
the processing includes at least one of cutting processing, boring processing, welding, cladding, surface reforming processing, surface finishing, and laser lamination molding.

7. The processing method according to claim 5 , wherein
the heat affected layer includes at least one of a remelted layer, an oxide layer, a crack, and a dross.

8. The processing method according to claim 5 , wherein
the determination step determines the rotation speed of the first prism, the rotation speed of the second prism, and the difference in the phase angle between the first prism and the second prism based on the relation between at least the predetermined allowable thickness of the heat affected layer of the workpiece, the turning speed of the laser beam emitted to the workpiece, and a turning radius of the laser.

Assignees

• Mitsubishi Heavy Ind Ltd

Inventors

• Goya Saneyuki
• Kinouchi Masato
• Danno Minoru
• Watanabe Toshiya
• Ishide Takashi
• Yamashita Tsugumaru
• Fujita Yoshihito
• Yamasaki Makoto
• Suzuki Ryu
• Kanaoka Kohei

Classifications

• B23K26/082

  Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head · CPC title

• B23K26/36

  Removing material (B23K26/55, B23K26/57 take precedence) · CPC title

• B23K26/38

  by boring or cutting · CPC title

• B23K26/0652 Primary

  comprising prisms · CPC title