Arrangement for producing an electrically conductive pattern on a surface

US9862000B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9862000-B2
Application numberUS-201615146006-A
CountryUS
Kind codeB2
Filing dateMay 4, 2016
Priority dateJan 30, 2012
Publication dateJan 9, 2018
Grant dateJan 9, 2018

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A method and an arrangement are disclosed for producing an electrically conductive pattern on a surface. Electrically conductive solid particles are transferred onto an area of predetermined form on a surface of a substrate. The electrically conductive solid particles are heated to a temperature that is higher than a characteristic melting point of the electrically conductive solid particles, thus creating a melt. The melt is pressed against the substrate in a nip, wherein a surface temperature of a portion of the nip that comes against the melt is lower than said characteristic melting point.

First claim

Opening claim text (preview).

The invention claimed is: 1. An arrangement for producing an electrically conductive pattern on a surface, comprising: a particle handler configured to transfer electrically conductive solid particles onto an area of predetermined form on a surface of a paper, board, polymer film, textile, or non-woven material substrate, a heater configured to heat electrically conductive solid particles on the surface of the substrate, to a temperature that is higher than a characteristic melting point of the electrically conductive solid particles, and thus configured to create a melt, a nip configured to press the melt against the substrate, and a nip temperature regulator configured to keep a surface temperature of a portion of the nip that comes against the melt at least 60 centigrade degrees below said characteristic melting point, wherein the melt of the conductive particles is solidified in the form of an essentially continuous, electrically conductive layer covering the area of the particles on the surface of said substrate. 2. An arrangement according to claim 1 , comprising at least one of: an adhesive printing section configured to spread an adhesive onto said substrate to create said area of predetermined form, and an electric charger section configured to create a spatial distribution of static electric charge in said substrate to create said area of predetermined form. 3. An arrangement according to claim 1 , wherein the particle handler is configured to transfer the electrically conductive solid particles onto the area of predetermined form on the surface of the substrate either as a dry powder or as a part of a compound that contains, in addition to the electrically conductive solid particles, a fluid or gelatinous substance. 4. An arrangement according to claim 2 , wherein the particle handler is configured to transfer the electrically conductive solid particles onto the area of predetermined form on the surface of the substrate either as a dry powder or as a part of a compound that contains, in addition to the electrically conductive solid particles, a fluid or gelatinous substance. 5. An arrangement according to claim 1 , wherein the heater comprises at least one of the following: an infrared radiator, a micro- or millimeter wave radiator, a flash lamp, a laser source, a heated body for passing the substrate on with that side of the substrate against the heated body that does not have electrically conductive solid particles on it.

Assignees

Inventors

Classifications

  • Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path · CPC title

  • by electrographic or magnetographic printing · CPC title

  • by mechanical means · CPC title

  • Non-woven fibrous reinforcement · CPC title

  • B05C1/003Primary

    incorporating means for heating or cooling the liquid or other fluent material (B05C11/1042 takes precedence) · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US9862000B2 cover?
A method and an arrangement are disclosed for producing an electrically conductive pattern on a surface. Electrically conductive solid particles are transferred onto an area of predetermined form on a surface of a substrate. The electrically conductive solid particles are heated to a temperature that is higher than a characteristic melting point of the electrically conductive solid particles, t…
Who is the assignee on this patent?
Stora Enso Oyj
What technology area does this patent fall under?
Primary CPC classification B05C1/003. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jan 09 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).