Microfluidic delivery system and method

Patent metadata

Field	Value
Publication number	US-9861720-B2
Application number	US-201414311150-A
Country	US
Kind code	B2
Filing date	Jun 20, 2014
Priority date	Jun 20, 2014
Publication date	Jan 9, 2018
Grant date	Jan 9, 2018

Abstract

One or more embodiments are directed to a microfluidic delivery system that dispenses a fluid in a direction that, at least in part, opposes gravity. In one embodiment, the microfluidic delivery system includes a microfluidic refill cartridge that is configured to be placed in a housing. The microfluidic refill cartridge includes at least one nozzle that faces upward or off to a side. The microfluidic refill cartridge includes a fluid transport member that allows fluid to travel upward from a fluid reservoir in opposition to gravity. A fluid path is located above the fluid transport member placing an end of the fluid transport member in fluid communication with a chamber and a nozzle. In response to the microfluidic delivery system receiving an electrical signal, an ejection element is configured to cause fluid in the chamber to be expelled through the nozzle. In response to the fluid being expelled from the nozzle, fluid may be pulled up through the fluid transport member and through the fluid path to refill the chamber.

First claim

The invention claimed is:

1. A microfluidic delivery system comprising:
a first chamber in fluid communication with a fluid transport member, after a priming process the first chamber being filled with liquid received from an upper end of the fluid transport member; and
a semiconductor die located over the first chamber, the semiconductor die having a first side and a second side that is opposite the first side, the semiconductor die including: a plurality of second chambers;
an inlet at the first side of the semiconductor die, the inlet placing the plurality of second chambers in fluid communication with the first chamber, after the priming process the inlet including liquid received from the first chamber and the plurality of second chambers including liquid received from the inlet;
a plurality of nozzles at the second side of the semiconductor die and in fluid communication with the plurality of second chambers; and
a plurality of ejection elements associated with the plurality of second chambers, each of the ejection elements being configured to cause the liquid in the plurality of second chambers to be expelled through the plurality of nozzles.

2. The microfluidic delivery system of claim 1 , wherein the first chamber includes a through hole located from a first side of a circuit board to a second side of the circuit board.

3. The microfluidic delivery system of claim 1 , wherein the first chamber is sealed from atmosphere.

4. The microfluidic delivery system of claim 1 , wherein after liquid exits the plurality of nozzles, the plurality of second chambers refills with liquid by capillary action.

5. The microfluidic delivery system of claim 1 , wherein the plurality of nozzles face upward so that liquid is expelled along a trajectory that includes a vertical component in opposition to gravity.

6. The microfluidic delivery system of claim 1 , wherein each of the nozzles are located above a respective second chamber.

7. The microfluidic delivery system of claim 1 , wherein the plurality of ejection elements are heating elements configured to heat the liquid in the second chambers creating a vapor bubble that causes vapor to be ejected through the nozzles.

8. A method of delivering a fluid after a priming process, the method comprising:
using capillary action, receiving a liquid in a first chamber, the liquid being received from an upper end of a fluid transport member, the first chamber being located above the upper end of the fluid transport member;
providing liquid from the first chamber to an inlet of a semiconductor die and to a second chamber of the semiconductor die, the semiconductor die being located above the first chamber, the inlet being at a first side of the semiconductor die and the second chamber being at a second side of the semiconductor die that is opposite the first side, the semiconductor die including a nozzle at the second side;
receiving an electrical signal;
in response to receiving the electrical signal, causing the liquid in the second chamber to move to cause a portion of the liquid to exit the nozzle; and
using capillary action to refill the second chamber with liquid from the first chamber.

9. The method of claim 8 , wherein causing the liquid in the second chamber to move comprises heating the liquid in a plurality of second chambers that are each associated with a respective nozzle to cause a portion of the heated liquid to exit the plurality of nozzles.

10. The method of claim 8 , wherein the first chamber is sealed from atmosphere.

11. The method of claim 8 , wherein the liquid is a scented oil.

12. The method of claim 8 , wherein causing the liquid in the second chamber to move comprises heating the liquid in the second chamber to create a vapor bubble that causes a portion of the vapor to exit the nozzle.

13. A microfluidic delivery system comprising:
a through hole extending from a first side of a circuit board to a second side of the circuit board;

a first chamber located proximate the first side of the circuit board and in fluid communication with a fluid transport member, the first chamber being filled with liquid received from an upper end of the fluid transport member;
a semiconductor die located over the first chamber and the through hole, the semiconductor die having a first side and a second side opposite the first side, the semiconductor die including:
a plurality of second chambers located above the first chamber;
an inlet at the first side of the semiconductor die, the inlet being part of a fluid path that places the first chamber in fluid communication with the plurality of second chambers, the inlet, after a priming process, including liquid received from the first chamber and the plurality of second chambers including, after the priming process, liquid received from the inlet;
a plurality of nozzles in fluid communication with the plurality of second chambers, respectively, the plurality of nozzles being located at the second side of the semiconductor die; and
a plurality of ejection elements associated with the plurality of second chambers, respectively, the plurality of ejection elements being configured to cause the liquid in the plurality of second chambers, respectively, to be expelled through the plurality of nozzles; and
a fluid path from the first chamber to the plurality of second chambers and including the through hole of the circuit board, after the priming process the fluid path being filled with liquid received from the first chamber.

14. The microfluidic delivery system of claim 13 , the semiconductor die mounted to the circuit board so that the through hole of the circuit board is aligned with the inlet of the semiconductor die.

15. The microfluidic delivery system of claim 13 , wherein the plurality of ejection elements are heating elements configured to heat the liquid in the plurality of second chambers creating a vapor bubble that causes vapor to be ejected through the plurality of nozzles.

Assignees

• St Microelectronics Inc

Inventors

• Dodd Simon
• Scheffelin Joe
• Hunt Dave
• Hoekstra Tim
• Sherman Faiz
• Bush Steve

Classifications

• A61L2209/134

  Distributing means, e.g. baffles, valves, manifolds, nozzles · CPC title

• A61L2209/133

  Replaceable cartridges, refills · CPC title

• A61L9/14 Primary

  using sprayed or atomised substances {including air-liquid contact processes} · CPC title

• B05B17/0684

  Wicks or the like · CPC title

• A61L2209/132

  Piezo or ultrasonic elements for dispensing · CPC title