Reduced wire profile stent

US9861506B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9861506-B2
Application numberUS-201615082434-A
CountryUS
Kind codeB2
Filing dateMar 28, 2016
Priority dateOct 4, 2011
Publication dateJan 9, 2018
Grant dateJan 9, 2018

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  1. Title

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  2. Abstract

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Abstract

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Methods and apparatuses of stents with likely reduced rates of tissue perforation are provided. Some embodiments include reducing the profile of a portion of the stent using a wire profile reduction electropolishing bath and/or other wire profile reduction means.

First claim

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What is claimed is: 1. A method of manufacturing a reduced wire profile stent comprising: providing a non-welded stent comprising a wire braided or woven into a tubular body having a proximal tube portion, a distal tube portion, a central tube portion disposed between the proximal tube portion and the distal tube portion, and a lumen extending between the proximal tube portion and the distal tube portion, wherein at least one of the proximal or distal tube portions of the tubular body terminates in crowns, the crowns of the tubular body comprising a wire first portion, where the wire first portion and the central tube portion of the tubular body each has a constant circular initial wire profile; bathing the wire first portion in a first wire profile reduction solution; and applying a first electropolishing voltage to the first wire profile reduction solution bath to reduce the profile of the wire first portion and form a first reduced wire profile stent, where the central tube portion retains the initial wire profile, and the wire first portion has a constant circular wire profile smaller than the initial wire profile. 2. The method of claim 1 , further comprising: rinsing the first reduced wire profile stent of the first wire profile reduction solution. 3. The method of claim 2 , wherein the rinsing the first reduced wire profile stent of the first wire profile reduction solution further comprises rinsing the first reduced wire profile stent with deionized water. 4. The method of claim 1 , wherein a second portion of the first tubular body is masked while bathing the wire first portion of the first tubular body in the first wire profile reduction solution. 5. The method of claim 1 , further comprising: bathing a second portion of the first reduced wire profile stent in a second wire profile reduction solution; and applying a second electropolishing voltage to the second wire profile reduction solution bath to reduce the profile of the second portion of the first reduced wire profile stent; wherein the second portion of the first reduced wire profile stent is the same or different from the wire first portion of the first tubular body, wherein the first wire profile reduction solution is the same or different from the second wire profile reduction solution, and wherein the first electropolishing voltage is the same or different from the second electropolishing voltage. 6. The method of claim 1 , wherein the first wire profile reduction solution comprises at least one of perchloric acid, ethanol, butyl cellusolve, water, methanol, acetic acid, hydrofluoric acid, nitric acid, sulphuric acid, orthophosphoric acid, glacial acetic acid, chromium trioxide, hydrochloric acid, and glycerin. 7. The method of claim 1 , wherein the applying the first electropolishing voltage to the first wire profile reduction solution bath to reduce the profile of the wire first portion occurs for about 1-5 minutes. 8. The method of claim 1 , wherein the first electropolishing voltage is about 3-15 volts. 9. The method of claim 1 , further comprising bringing the first wire profile reduction solution to a temperature of at least one of about room temperature or about −30° Celsius.

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What does patent US9861506B2 cover?
Methods and apparatuses of stents with likely reduced rates of tissue perforation are provided. Some embodiments include reducing the profile of a portion of the stent using a wire profile reduction electropolishing bath and/or other wire profile reduction means.
Who is the assignee on this patent?
Cook Medical Technologies Llc
What technology area does this patent fall under?
Primary CPC classification A61F2/90. Mapped technology areas include Human Necessities.
When was this patent published?
Publication date Tue Jan 09 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).