Method and apparatus for forming interface between coaxial cable and connector

Patent metadata

Field	Value
Publication number	US-9859625-B2
Application number	US-201615143039-A
Country	US
Kind code	B2
Filing date	Apr 29, 2016
Priority date	May 13, 2015
Publication date	Jan 2, 2018
Grant date	Jan 2, 2018

Abstract

A method of forming a solder joint between a coaxial cable and a coaxial connector includes the steps of: positioning a solder element between an end of an outer conductor of the coaxial cable and a connector body of the connector; lowering the connector body onto a mounting structure; melting the solder element to form a solder joint between the outer conductor and the connector body, the solder joint including a lower surface formed by contact with the mounting structure; and applying suction to the melting solder element to reduce the formation of bubbles within the solder joint.

First claim

That which is claimed is:

1. A method of forming a solder joint between a coaxial cable and a coaxial connector, comprising the steps of:
positioning a solder element between an end of an outer conductor of the coaxial cable and a connector body of the coaxial connector;
lowering the connector body onto a mounting structure;
melting the solder element to form a solder joint between the outer conductor and the connector body, the solder joint including a lower surface formed by contact with the mounting structure; and
applying suction to the melting solder element to reduce the formation of bubbles within the solder joint;
wherein the mounting structure includes a membrane that is permeable to air but impermeable to solder.

2. The method defined in claim 1 , wherein the applying step comprises applying suction through the mounting structure.

3. The method defined in claim 2 , wherein the mounting structure includes a cap that provides a surface to form the solder joint, and wherein the suction is applied through the cap surface.

4. The method defined in claim 1 , wherein the solder element is a solder preform mounted on the outer conductor of the cable.

5. The method defined in claim 1 , wherein the mounting structure is an interface pedestal.

6. The method defined in claim 1 , wherein the coaxial cable further comprises an inner conductor, and wherein an inner contact is mounted onto the inner conductor prior to the lowering step, and wherein the mounting structure includes a cavity for receiving the inner contact.

7. A method for attaching a connector to a coaxial cable, comprising the steps of:
positioning a solder element between an end of an outer conductor of the coaxial cable and a connector body of the coaxial connector;
positioning the connector body on a mounting structure;
melting the solder element to form a solder joint between the outer conductor and the connector body, the solder joint including a surface formed by contact with the mounting structure; and
applying suction to the melting solder element to prevent the formation of bubbles within the solder joint;
wherein the mounting structure includes a membrane that is permeable to air but substantially impermeable to solder.

8. The method defined in claim 7 , wherein the applying step comprises applying suction through the mounting structure.

9. The method defined in claim 8 , wherein the mounting structure includes a cap that provides a surface to form the solder joint, and wherein the suction is applied through the cap surface.

10. The method defined in claim 7 , wherein the solder element is a solder preform mounted on the outer conductor of the cable.

11. The method defined in claim 7 , wherein the mounting structure is an interface pedestal.

12. The method defined in claim 7 , wherein the coaxial cable further comprises an inner conductor, and wherein an inner contact is mounted onto the inner conductor prior to the lowering step, and wherein the mounting structure includes a cavity for receiving the inner contact.

Assignees

• Commscope Technologies Llc

Inventors

• Paynter Jeffery D

Classifications

• H01R4/024 Primary

  comprising preapplied solder · CPC title

• H01R43/0207

  Ultrasonic-, H.F.-, cold- or impact welding · CPC title

• H01R9/05

  for coaxial cables · CPC title

• B23K2101/38

  Conductors · CPC title

• B23K2101/32

  Wires · CPC title