Integrated circuit having first and second magnetic field sensing elements

Patent metadata

Field	Value
Publication number	US-9859489-B2
Application number	US-201514707319-A
Country	US
Kind code	B2
Filing date	May 8, 2015
Priority date	Jan 20, 2006
Publication date	Jan 2, 2018
Grant date	Jan 2, 2018

Abstract

An integrated circuit can have a first substrate supporting a magnetic field sensing element and a second substrate supporting another magnetic field sensing element. The first and second substrates can be arranged in a variety of configurations. Another integrated circuit can have a first magnetic field sensing element and second different magnetic field sensing element disposed on surfaces thereof.

First claim

What is claimed is:

1. An integrated circuit, comprising:
a first magnetic field sensing element for providing a first sensitivity to a magnetic field;
a second magnetic field sensing element for providing a selected second different sensitivity to the magnetic field; and
a circuit coupled to the first and second magnetic field sensing elements, operable to provide the integrated circuit with a first operating range responsive to the first magnetic field sensing element and a second selected different operating range responsive to the second magnetic field sensing element, wherein the first and second magnetic field sensing elements are different types of magnetic field sensing elements, wherein the different types of magnetic field sensing elements are two different types in a group of types of magnetic field sensing elements comprising a planar Hall effect element, a vertical Hall effect element, a giant magnetoresistance (GMR) element, an anisotropic magnetoresistance (AMR) element, and a tunneling magnetoresistance (TMR) element.

2. The integrated circuit of claim 1 , wherein the first magnetic field sensing element comprises the planar Hall effect element and the second magnetic field sensing element comprises the vertical Hall effect element.

3. The integrated circuit of claim 1 , further comprising a lead frame having a plurality of leads, wherein at least two of the plurality of leads are coupled to form a current conductor portion, wherein the current conductor portion is disposed proximate to the first and second magnetic field sensing elements, and wherein the integrated circuit is responsive to a current flowing through the current conductor portion.

4. The integrated circuit of claim 1 , further comprising a conductor, wherein the integrated circuit is adapted to be responsive to magnetic field generated by a current passing through the conductor.

5. The integrated circuit of claim 1 , further comprising a substrate, wherein the first and second magnetic field sensing elements are supported by the substrate, wherein the substrate comprised of a selected one of Si, GaAs, InP, InSb, InGaAs, InGaAsP, SiGe, ceramic, or glass.

6. The integrated circuit of claim 1 , further including at least one flux concentrator disposed proximate to at least one of the first magnetic field sensing element or the second magnetic field sensing element.

7. The integrated circuit of claim 1 , wherein the integrated circuit is adapted to be responsive to a current passing through a wire.

8. The integrated circuit of claim 1 , further comprising:
a current conductor disposed proximate to the first or second magnetic field sensing elements; and
a flux concentrator shaped so that a first portion of the flux concentrator is disposed under the first and second magnetic field sensing elements and a second portion of the flux concentrator is disposed above the first and second magnetic field sensing elements.

9. The integrated circuit of claim 1 , wherein the first magnetic field sensing element comprises the vertical Hall effect element and the second magnetic field sensing element comprises the giant magnetoresistance element, the anisotropic magnetoresistance element, or the tunneling magnetoresistance element.

10. An integrated circuit, comprising:
a substrate;
a first magnetic field sensing element disposed on a surface of the substrate;
a second magnetic field sensing element disposed on the surface of the substrate; and
a circuit coupled to the first and second magnetic field sensing elements, the circuit operable to provide the integrated circuit with a first operating range responsive to the first magnetic field sensing element and a second selected different operating range responsive to the second magnetic field sensing element, wherein the second magnetic field sensing element has a different structure than the first magnetic field sensing element, wherein the first and second magnetic field sensing elements are different types of magnetic field sensing elements, wherein the different types of magnetic field sensing elements are two different types in a group of types of magnetic field sensing elements comprising a planar Hall effect element, a vertical Hall effect element, a giant magnetoresistance (GMR) element, an anisotropic magnetoresistance (AMR) element, and a tunneling magnetoresistance (TMR) element.

11. The integrated circuit of claim 10 , further comprising a conductor, wherein the integrated circuit is adapted to be responsive to magnetic field generated by a current passing through the conductor.

12. The integrated circuit of claim 10 , wherein the first magnetic field sensing element comprises the planar Hall effect element or the vertical Hall effect element and the second magnetic field sensing element comprises the giant magnetoresistance element, the anisotropic magnetoresistance element, or the tunneling magnetoresistance element.

13. The integrated circuit of claim 10 , further comprising a circuit element disposed on the surface of the substrate.

14. The integrated circuit of claim 10 , further comprising a lead frame having a plurality of leads, wherein at least two of the plurality of leads are coupled to form a current conductor portion, wherein the current conductor portion is disposed proximate to the first and second magnetic field sensing elements, and wherein the integrated circuit is responsive to a current flowing through the current conductor portion.

15. The integrated circuit of claim 14 , further comprising a conductor, wherein the integrated circuit is adapted to be responsive to magnetic field generated by a current passing through the conductor.

16. The integrated circuit of claim 10 , further including at least one flux concentrator disposed proximate to at least one of the first magnetic field sensing element or the second magnetic field sensing element.

17. The integrated circuit of claim 10 , wherein the integrated circuit is adapted to be responsive to a current passing through a wire.

18. The integrated circuit of claim 10 , further comprising:
a current conductor disposed proximate to the first or second magnetic field sensing elements; and
a flux concentrator shaped so that a first portion of the flux concentrator is disposed under the first and second magnetic field sensing elements and a second portion of the flux concentrator is disposed above the first and second magnetic field sensing elements.

19. The integrated circuit of claim 10 , wherein the first magnetic field sensing element comprises the planar Hall effect element and the second magnetic field sensing element comprises the vertical Hall effect element.

20. The integrated circuit of claim 10 , wherein the first magnetic field sensing element comprises the vertical Hall effect element and the second magnetic field sensing element comprises the giant magnetoresistance element, the anisotropic magnetoresistance element, or the tunneling magnetoresistance element.

21. An integrated circuit, comprising:
a first magnetic field sensing element;
a second magnetic field sensing element;
a circuit coupled to the first and second magnetic field sensing elements, wherein the first and second magnetic field sensing elements are different types of magnetic field sensing elements, wherein the different types of magnetic field sensing elements are two different types in a group of types of magnetic field sensing elements comprising a planar Hall effect element, a vertical Hall effect element, a giant magnetor

Assignees

• Allegro Microsystems Llc

Inventors

• Doogue Michael C
• Taylor William P
• Mangtani Vijay

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/753

  between laterally-adjacent chips · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W70/421

  Shapes or dispositions · CPC title

• H01L2224/48091

  Electricity · mapped topic