High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion

Patent metadata

Field	Value
Publication number	US-9859471-B2
Application number	US-201213362683-A
Country	US
Kind code	B2
Filing date	Jan 31, 2012
Priority date	Jan 31, 2011
Publication date	Jan 2, 2018
Grant date	Jan 2, 2018

Abstract

High-brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion are provided. In one aspect, a high brightness package for a light emitter (e.g., a LED or LED chip) can include a body and a cavity disposed in the body. The cavity can include at least one cavity wall extending toward an intersection area of the body where the cavity wall intersects a cavity floor. The package can further include at least one electrical element having first and second surfaces, each of the first and second surfaces proximate the intersection area. The first surface can be disposed on a first plane and the second surface can be at least partially disposed on a second plane that is different than the first plane. The body can at least substantially cover the second surface.

First claim

What is claimed is:

1. A high brightness package for housing light emitters, the package comprising:
a body;
a cavity disposed in the body, the cavity comprising a cavity floor and at least one cavity wall, wherein the cavity wall intersects the cavity floor at an intersection area of the body; and
at least one electrical element disposed in a portion of the body, wherein the at least one electrical element comprises a conductive surface, at least two external portions, and one or more transitional zones disposed between the conductive surface and the at least two external portions;
wherein the conductive surface forms a portion of the cavity floor for electrically connecting with one or more light emitters; and
wherein the at least two external portions of the electrical element extend about an aperture, wherein the one or more transitional zones are disposed at at least one edge defining the aperture and are recessed into the body below the cavity floor such that a gap forms between the one or more transitional zones and the intersection area, wherein the gap is filled by the body, and wherein a portion of the aperture is filled by the body.

2. The package of claim 1 , further comprising one or more light emitting diode (LED) chips attached to the electrical element.

3. The package of claim 1 , wherein the body comprises a plastic body.

4. The package of claim 1 , further comprising at least one thermal element, wherein one or more LED chips at least partially mounted over the thermal element.

5. The package of claim 4 , wherein the thermal element is electrically isolated from the at least one electrical element.

6. The package of claim 4 , wherein the body comprises plastic, and wherein the body at least partially encases the at least one electrical and thermal element.

7. The package of claim 1 , wherein the one or more transitional zones are disposed on a different plane than the conductive surface.

8. The package of claim 1 , wherein the one or more transitional zones comprise a recess.

9. The package of claim 1 , wherein the one or more transitional zones comprise a linear sloping profile.

10. The package of claim 1 , wherein the one or more transitional zones comprise a curved profile.

11. The package of claim 1 , wherein the conductive surface of the electrical element is at least partially covered with an encapsulant.

12. The package of claim 1 , wherein the one or more transitional zones are stamped, etched, or bent away from the cavity floor.

13. The package of claim 1 , further comprising a thermal element that has at least one or more surfaces that extend away from the cavity floor.

14. The package of claim 1 , wherein the body comprises a cavity angle of at least approximately 135° or more.

15. The package of claim 1 , wherein the body comprises a cavity angle of at least approximately 139° or more.

16. The package of claim 1 , wherein the body comprises a thickness of approximately 0.9 millimeters (mm) or less.

17. A high brightness package for housing light emitters, the package comprising:
a body;
a cavity disposed in the body, the cavity comprising a cavity floor and at least one cavity wall, wherein the cavity wall intersects the cavity floor at an intersection area of the body; and
a leadframe disposed within a portion of the body, the leadframe comprising at least one electrical element;
wherein the electrical element comprises one or more openings disposed therethrough, wherein each of the one or more openings are positioned below a portion of the intersection area, wherein at least one edge defining a respective one of the one or more openings in the at least one electrical element is disposed inboard of the intersection area such that a gap is disposed between the edge of the at least one electrical element and the intersection area such that an area disposed below the portion of the intersection area where the cavity wall intersects the cavity floor is devoid of the electrical element, and wherein the body at least partially fills the gap between the edge of the electrical element and the intersection area.

18. The package of claim 17 , further comprising one or more light emitting diode (LED) chips.

19. The package of claim 17 , wherein the body comprises a plastic body.

20. The package of claim 19 , wherein the leadframe comprises a thermal element, the one or more LED chips at least partially mounted over the thermal element.

21. The package of claim 20 , wherein the thermal element is electrically isolated from the at least one electrical element.

22. The package of claim 21 , wherein the plastic body at least partially encases the at least one electrical and thermal elements.

23. The package of claim 17 , wherein the gap is formed by stamping, punching, drilling, or etching the at least one electrical element or any combination thereof.

24. The package of claim 17 , wherein the at least one electrical element is at least partially covered with an encapsulant.

25. The package of claim 17 , wherein the body comprises a cavity angle of at least approximately 135° or more.

26. The package of claim 17 , wherein the body comprises a cavity angle of at least approximately 139° or more.

27. The package of claim 17 , wherein the body comprises a thickness of approximately 0.9 millimeters (mm) or less.

28. A display panel system comprising:
a panel;
at least one light emitting diode (LED) package for providing light to the panel,
the at least one LED package comprising:
a body;
a cavity disposed in the body, the cavity comprising a cavity floor and at least one cavity wall, wherein the cavity wall intersects the cavity floor at an intersection area of the body; and
at least one electrical element disposed in a portion of the body, the at least one electrical element comprising a conductive surface, at least two external portions, and one or more transitional zones disposed between the conductive surface and the at least two external portions;
wherein the conductive surface forms a portion of the cavity floor for electrically connecting with a light emitter; and
wherein the at least two external portions of the electrical element extend about an aperture, wherein the one or more transitional zones are disposed at at least one edge defining the aperture and are recessed into the body below the cavity floor such that a gap forms between the one or more transitional zones and the intersection area, wherein the gap is filled by the body, and wherein a portion of the aperture is filled by the body.

29. The display panel system of claim 28 , wherein the body comprises a plastic body.

30. The display panel system of claim 29 , wherein the plastic body at least partially encases the at least one electrical element and a thermal element.

31. The display system of claim 28 , wherein the LED package directly backlights the panel.

32. The display panel system of claim 28 , wherein the LED package is configured to illuminate the side edge of the panel.

33. The display panel system of claim 28 , wherein the LED package comprises a thickness of approximately 0.9 millimeters (mm) or less.

34. The display panel system of claim 28 , wherein the one or more transitional zones are formed by stamping, etching, or bendin

Assignees

• Hussell Christopher P
• Joo Sung Chul
• Cree Inc

Inventors

• Hussell Christopher P
• Joo Sung Chul

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/753

  between laterally-adjacent chips · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/07553

  changes in shapes · CPC title