Laser die backside film removal for integrated circuit (IC) packaging

Patent metadata

Field	Value
Publication number	US-9859248-B2
Application number	US-201615196866-A
Country	US
Kind code	B2
Filing date	Jun 29, 2016
Priority date	Mar 14, 2013
Publication date	Jan 2, 2018
Grant date	Jan 2, 2018

Abstract

Embodiments of the present disclosure are directed to die adhesive films for integrated circuit (IC) packaging, as well as methods for forming and removing die adhesive films and package assemblies and systems incorporating such die adhesive films. A die adhesive film may be transparent to a first wavelength of light and photoreactive to a second wavelength of light. In some embodiments, the die adhesive film may be applied to a back or “inactive” side of a die, and the die surface may be detectable through the die adhesive film. The die adhesive film may be cured and/or marked with laser energy having the second wavelength of light. The die adhesive film may include a thermochromic dye and/or nanoparticles configured to provide laser mark contrast. UV laser energy may be used to remove the die adhesive film in order to expose underlying features such as TSV pads.

First claim

What is claimed is:

1. A method, comprising:
removing, by a die bonding head, a die from a support, the die having an adhesive layer on a side of the die, wherein the adhesive layer is located on an opposite side of the die from the die bonding head when removed, and wherein the die is composed of a semiconductor material and the adhesive layer comprises a polymer matrix;
moving, by the die bonding head, the die to a bonding site located above a panel;
positioning, by the die bonding head, the die on the panel with the adhesive layer against the panel, the die positioned based on a comparison of an image of the side of the die with an image of the panel, wherein the side of the die is detectable through the adhesive layer, and wherein the image of the panel captures a fiducial on the panel used for the positioning of the die on the panel;
curing, by the die bonding head, the adhesive layer to bond the die to the panel; and
releasing, by the die bonding head, the die to allow for coupling of a plurality of build-up layers to the die and a removal of one or more portions of the adhesive layer via laser radiation.

2. The method of claim 1 , further comprising preheating, by the die bonding head, the die prior to positioning the die on the panel.

3. The method of claim 1 , wherein curing the adhesive layer includes heating the adhesive layer to a bonding temperature.

4. The method of claim 3 , wherein the bonding temperature is between 50 and 200 degrees Celsius.

5. The method of claim 1 , wherein curing the adhesive layer includes curing the adhesive layer with laser energy.

6. The method of claim 1 , wherein the side of the die is a first side of the die, and wherein the method further comprises:
capturing an image of a second side of the die, the second side of the die being opposite to the first side of the die; and
identifying a fiducial on the second side of the die based on the image of the second side of the die, wherein removing the die from the support includes aligning the die on the die bonding head based on a location of the fiducial.

7. The method of claim 1 , further comprising:
capturing the image of the side of the die; and
identifying a fiducial on the side of the die based on the image of the side of the die, wherein the die is positioned on the panel based on a location of the fiducial on the side of the die.

8. The method of claim 7 , wherein the image of the side of the die is a second image of the side of the die, wherein the second image of the side of the die is captured after the die is removed from the support, and wherein the method further comprises:
capturing a first image of the side of the die prior to removing the die from the support; and
comparing the first image with the second image to determine a location of the die on the die bonding head, wherein positioning the die on the panel is at least partially based on the location of the die on the die bonding head.

9. The method of claim 7 , further comprising:
capturing the image of the panel; and
identifying the fiducial on the panel based on the image of the panel.

10. The method of claim 1 , further comprising:
capturing the image of the side of the die; and
identifying an electrical routing feature on the side of the die or outer contours of the die based on the image of the side of the die, wherein the die is positioned on the panel based on the location of the electrical routing feature on the side of the die or the outer contours of the die.

11. The method of claim 10 , further comprising:
capturing the image of the panel; and
identifying the fiducial on the panel based on the image of the panel.

12. One or more non-transitory computer-readable media having instructions stored thereon, wherein the instructions, in response to execution by a die bonder, cause the die bonder to:
remove, by a die bonding head of the die bonder, a die from a support, the die having an adhesive layer on a side of the die, wherein the adhesive layer is located on an opposite side of the die from the die bonding head when removed, and wherein the die is composed of a semiconductor material and the adhesive layer comprises a polymer matrix;
move, by the die bonding head, the die to a bonding site located above a panel;
position, by the die bonding head, the die on the panel with the adhesive layer against the panel, the die positioned based on a comparison of an image of the side of the die with an image of the panel, wherein the side of the die is detectable through the adhesive layer, and wherein the image of the panel captures a fiducial on the panel used to position the die on the panel;
cure, by the die bonding head, the adhesive layer to bond the die to the panel; and
release, by the die bonding head, from the die to allow for coupling of a plurality of build-up layers to the die and a removal of one or more portions of the adhesive layer via laser radiation.

13. The one or more non-transitory computer-readable media of claim 12 , wherein the instructions, in response to execution by the die bonder, further cause the die bonder to preheat, by the die bonding head, the die prior to positioning the die on the panel.

14. The one or more non-transitory computer-readable media of claim 12 , wherein to cure the adhesive layer includes to heat the adhesive layer to a bonding temperature.

15. The one or more non-transitory computer-readable media of claim 14 , wherein the bonding temperature is between 50 and 200 degrees Celsius.

16. The one or more non-transitory computer-readable media of claim 12 , wherein to cure the adhesive layer includes to cure the adhesive layer with laser energy.

17. The one or more non-transitory computer-readable media of claim 12 , wherein the side of the die is a first side of the die, and wherein the instructions, in response to execution by the die bonder, further cause the die bonder to: capture an image of a second side of the die, the second side of the die being opposite to the first side of the die; and identify a fiducial on the second side of the die based on the image of the second side of the die, wherein to remove the die from the support includes to align the die on the die bonding head based on a location of the fiducial on the second side of the die.

18. The one or more non-transitory computer-readable media of claim 12 , wherein the instructions, in response to execution by the die bonder, further cause the die bonder to: capture the image of the side of the die; and identify a fiducial on the side of the die based on the image of the side of the die, wherein the die is positioned on the panel based on a location of the fiducial on the side of the die.

19. The one or more non-transitory computer-readable media of claim 18 , wherein the image of the side of the die is a second image of the side of the die, wherein the second image of the side of the die is captured after the die is removed from the support, and wherein the instructions, in response to execution by the die bonder, further cause the die bonder to: capture a first image of the side of the die prior to removal of the die from the support; and compare the first image with the second image to determine a location of the die on the die bonding head, wherein the die is positioned on the panel based at least partially on the location of the die on the die bonding head.

20. The one or more non-transitory computer-readable media of claim 18 , wherein the instructions, in response to execution by the die bonder, further cause the die

Assignees

• Intel Corp

Inventors

• Faruqui Danish
• Prack Edward R
• Voronov Sergei L
• Wilkinson Jr David K
• Dambrauskas Tony
• Skoglund Lars D
• Tomita Yoshihiro
• Oka Mihir A
• Dias Rajen C

Classifications

• H10W90/794

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/732

  between stacked chips · CPC title

• H10W90/722

  between stacked chips · CPC title

• H10W90/297

  characterised by the through-semiconductor vias [TSVs] in the stacked chips · CPC title