Functionalized boron nitride materials and methods for their preparation and use

Patent metadata

Field	Value
Publication number	US-9859034-B2
Application number	US-201514665472-A
Country	US
Kind code	B2
Filing date	Mar 23, 2015
Priority date	Mar 23, 2015
Publication date	Jan 2, 2018
Grant date	Jan 2, 2018

Abstract

A polymeric flexible substrate may be formed from h-BN sheets having a monolayer of hexagonal born nitride interspersed with domains of at least one functionalized material. The functionalized h-BN sheets may be used in various electronic components such as in circuit boards and touch sensors.

First claim

What is claimed is:

1. A sheet comprising a monolayer of hexagonal boron nitride interspersed with domains of at least one functionalized material, wherein the at least one functionalized material has a hexagonal monolayer structure; and the sheet has a first planar surface and a second planar surface opposite to the first planar surface, and the domains of the at least one functionalized material are functionalized with a semiconductor material on the first planar surface; the sheet further comprises:
a first electrode film disposed adjacent to the first planar surface of the sheet, wherein the first electrode film is configured to contact the semiconductor material; and
a second electrode film disposed adjacent to the second planar surface of the sheet, wherein the second electrode film is configured to contact the domains of the at least one functionalized material;
the first electrode film in contact with the semiconductor material and the second electrode film in contact with the domains of the at least one functionalized material define a conductive path from the first electrode film to the second electrode film.

2. The sheet of claim 1 , wherein the at least one functionalized material comprises at least one of graphane, graphene, graphyne, silicene, stanene, and molybdenum disulfide.

3. The sheet of claim 1 , wherein the domains of the at least one functionalized material have a dimension of at least about 100 nm.

4. The sheet of claim 1 , wherein the domains of the at least one functionalized material comprise about 5% to about 75% of the area of the sheet.

5. The sheet of claim 1 , wherein the at least one functionalized material comprises functionalized graphene.

6. The sheet of claim 1 , further comprising at least one polymer layer.

7. The sheet of claim 6 , wherein the at least one polymer layer comprises polymer selected from at least one of polyimide, polyaniline, polyacrylamide, polyvinylidine fluoride, nylon, polyvinyl chloride, polystyrene, polyethylene, polypropylene, polycarbonate, poly(vinylidene fluoride-co-tri-fluoroethylene), poly(diallyldimethylammonium chloride), polycaprolactone, or any combination thereof.

8. The sheet of claim 1 , wherein the sheet is thermally stable at a temperature of greater than about 300° C. and has a band gap of at least about 5.9 electron volts.

9. The sheet of claim 1 , wherein the sheet has an oxygen permeability equal to or less than about 10 −5 g/m 2 /day and has a water permeability equal to or less than about 10 −6 g/m 2 /day.

10. The sheet of claim 1 , wherein the at least one functionalized material is functionalized with the semiconductor material selected from the group consisting of inorganic semiconductor nanowires, inorganic semiconductor microwires, silicon microwires, and conductive polydimethylsiloxane.

11. The sheet of claim 1 , wherein the sheet is a component of a touch sensor.

12. The sheet of claim 1 , wherein the domains of the at least one functionalized material are additionally functionalized with the semiconductor material on the second planar surface.

13. A flexible substrate for electronic devices, the flexible substrate comprising:
a composite sheet, wherein the composite sheet comprises domains of at least one functionalized material interspersed in a monolayer of hexagonal boron nitride, wherein the domains of the at least one functionalized material are functionalized with a semiconductor material selected from inorganic semiconductor nanowires or inorganic semiconductor microwires; and
at least one polymer film.

14. The flexible substrate of claim 13 , wherein the at least one functionalized material comprises at least one of graphene, silicene, stanene, and molybdenum disulfide.

15. The flexible substrate of claim 13 , wherein the polymer film comprises a polymer selected from the group consisting of polyimide, polyaniline, polyacrylamide, polyvinylidine fluoride, nylon, polyvinyl chloride, polystyrene, polyethylene, polypropylene, polycarbonate, poly(vinylidene fluoride-co-tri-fluoroethylene), poly(diallyldimethyl ammonium chloride), polycaprolactone, or any combination thereof.

16. The flexible substrate of claim 13 , wherein the flexible substrate has an oxygen permeability of equal to or less than about 10 −5 g/m 2 /day and a water permeability equal to or less than about 10 −6 g/m 2 /day.

17. The flexible substrate of claim 13 , wherein:
the at least one functionalized material comprises functionalized graphene.

18. The flexible substrate of claim 13 , wherein:
the composite sheet has a first planar surface and a second planar surface opposite to the first planar surface;
the domains of the at least one functionalized material are functionalized with the the semiconductor material on the first planar surface;
the flexible substrate further comprises:
a first electrode film disposed between the at least one polymer film and the first planar surface, wherein the first electrode film is configured to contact the semiconductor material; and
a second electrode film disposed on the second planar surface, wherein the second electrode film is configured to contact the domains of the at least one functionalized material;
the first electrode film in contact with the semiconductor material on the first planar surface and the second electrode film in contact with the domains of the at least one functionalized material define a conductive path from the first electrode film to the second electrode film.

19. The flexible substrate of claim 13 , wherein:
the composite sheet has a first planar surface and a second planar surface opposite to the first planar surface;
the domains of the at least one functionalized material are functionalized with the semiconductor material on each of the first planar surface and the second planar surface;
the composite sheet further comprises:
a first electrode film disposed between the at least one polymer film and the first planar surface;
a second electrode film disposed adjacent to the second planar surface; and
an additional polymer film disposed on the second electrode film.

Assignees

• Empire Technology Dev Llc

Inventors

• Sjong Angele

Classifications

• H10W20/057

  by selectively depositing, e.g. by using selective CVD or plating · CPC title

• H10W70/698

  Semiconductor materials that are electrically insulating, e.g. undoped silicon · CPC title

• H10W70/695

  Organic materials · CPC title

• H10W70/664

  Carbon-based materials, e.g. fullerenes · CPC title

• H10W20/4462

  Carbon or carbon-containing materials, e.g. graphene · CPC title