Transparent conductive component with interconnect circuit tab comprising cured organic polymeric material

Patent metadata

Field	Value
Publication number	US-9857930-B2
Application number	US-201514970695-A
Country	US
Kind code	B2
Filing date	Dec 16, 2015
Priority date	Dec 16, 2015
Publication date	Jan 2, 2018
Grant date	Jan 2, 2018

Abstract

In one embodiment a transparent conductive component is described comprising a flexible transparent substrate; a transparent conductive layer disposed on the flexible transparent substrate; and a plurality of metal traces disposed on and in electrical communication with the transparent conductive layer. A portion of the flexible transparent substrate comprising the transparent conductive layer and metal traces forms an interconnect circuit tab. At least the interconnect circuit tab comprises a cured organic polymeric material disposed on the (e.g. patterned) transparent conductive layer and metal traces metal traces and flexible transparent substrate such that the cured organic polymeric material forms an exposed surface layer. The cured organic polymeric material is optionally disposed at the bezel region and/or at a central region of the transparent conductive component (e.g. touch sensor).

First claim

The invention claimed is:

1. A transparent conductive component comprising:
a flexible transparent substrate;
a transparent conductive layer disposed on the flexible transparent substrate at least at a central region of the flexible transparent substrate;
a plurality of metal traces disposed on and in electrical communication with the transparent conductive layer wherein a portion of the flexible transparent substrate, metal traces and optionally the transparent conductive layer forms an interconnect circuit tab;
wherein at least the interconnect circuit tab comprises an exposed surface layer of cured organic polymeric material.

2. The transparent conductive component of claim 1 wherein at least the interconnect circuit tab is free of PET coverlay.

3. The transparent conductive component of claim 1 wherein the cured organic polymeric material is disposed at a bezel region adjacent the interconnect circuit tab of the transparent conductive component.

4. The transparent conductive component of claim 3 wherein the bezel region is free of PET coverlay.

5. The transparent conductive component of claim 1 wherein a cover layer is disposed upon a central region of the transparent conductive layer except for the interconnect tab.

6. The transparent conductive component of claim 5 wherein the cover layer is glass, a polymeric coverlay, or a cured organic polymeric material.

7. The transparent conductive component of claim 1 wherein the cured organic polymeric material has a thickness ranging from 5 to 50 microns.

8. The transparent conductive component of claim 1 wherein the cured organic polymeric material has a thickness ranging from 5 to 10 microns.

9. The transparent conductive component of claim 1 wherein the transparent conductive layer has a thickness less than 100 or 75 nanometers.

10. The transparent conductive component of claim 1 wherein the cured organic polymeric material has a tensile modulus ranging from 1 to 5 GPa.

11. The transparent conductive component of claim 1 wherein the cured organic polymeric material comprises a cured (meth)acrylate or cured epoxy polymerizable resin.

12. The transparent conductive component of claim 1 wherein the flexible transparent substrate has a thickness ranging from about 50 to 200 microns.

13. The transparent conductive component of claim 1 wherein the transparent conductive layer comprises indium tin oxide.

14. The transparent conductive component of claim 1 wherein the metal traces have a thickness ranging from about 3 to 15 microns and a width ranging from about 25 to 60 microns.

15. The transparent conductive component of claim 1 wherein the flexible transparent substrate of the interconnect circuit tab further comprises perforation.

16. The transparent conductive component of claim 1 wherein the metal traces form bonding pad near a peripheral edge of the interconnect circuit tab and a stiffening layer is disposed on the opposing surface of the flexible transparent substrate as the bonding pads.

17. The transparent conductive component of claim 16 wherein a bezel region lacks the cured organic material and comprises a corrosion resistant metal material at the exposed surface layer.

18. The transparent conductive component of claim 1 wherein the metal traces do not crack when the interconnect circuit tab is bent to a radius of 2 mm at least 40 cycles.

19. A touch sensor comprising the transparent conductive component of claim 1 .

20. A method of making a transparent conductive component comprising:
providing a flexible transparent substrate comprising a transparent conductive layer disposed on the flexible transparent substrate and a plurality of metal traces disposed on the flexible transparent substrate such that the metal traces are in electrical communication with the transparent conductive layer and a portion of the flexible transparent substrate comprising the metal traces forms an interconnect circuit tab;
applying a layer of an organic polymerizable material to the metal traces and flexible transparent substrate of at least the interconnect circuit tab;
curing the organic polymerizable material.

21. The method of claim 20 wherein the organic polymerizable material comprises a dry film solder mask.

22. The method of claim 20 wherein the organic polymerizable material comprises a liquid polymerizable resin.

23. The method of claim 20 wherein the curing comprises photocuring, thermal curing, or a combination thereof.

Assignees

• 3M Innovative Properties Co

Inventors

• Sebastian Muthu
• Barton Roger W
• Travasso Dominic M

Classifications

• G06F3/044 Primary

  by capacitive means · CPC title

• B32B2307/202

  Conductive · CPC title

• B32B2457/208

  Touch screens · CPC title

• B32B2307/412

  Transparent · CPC title

• B32B27/06

  as the main or only constituent of a layer, {which is} next to another layer of {the same or of} a {different material (next to a layer of a particular substance B32B9/045; next to a bituminous or tarry layer B32B11/046; next to a water setting substance layer B32B13/12; next to a metal layer B32B15/08; next to a glass layer B32B17/10; next to a layer formed of natural mineral fibres or particles B32B19/045; next to a wood layer B32B21/08; next to a cellulosic plastic layer B32B23/08; next to a natural or synthetic rubber layer B32B25/08)} · CPC title