Backlight unit

Patent metadata

Field	Value
Publication number	US-9857526-B2
Application number	US-201414320114-A
Country	US
Kind code	B2
Filing date	Jun 30, 2014
Priority date	Nov 20, 2012
Publication date	Jan 2, 2018
Grant date	Jan 2, 2018

Abstract

A backlight unit includes: a light guide plate of an entirely flat structure; a light emitting element disposed on at least one side of the light guide plate; a first reflection part disposed under the light guide plate and having one side thereof extended to a region where the light emitting element is positioned; a second reflection part disposed on the light emitting element; and a housing for accommodating the light guide plate, the light emitting element, and the first and second reflection parts, wherein the housing has a second side which is vertically extended upwards with respect to a first side which defines a lateral cross section of the housing in which the light emitting element is accommodated as the lower side, and a third side which is vertically extended inwards with respect to the second side.

First claim

What is claimed is:

1. A backlight unit comprising:
a light guide plate;
a light emitting device disposed adjacent to a first side of the light guide plate;
a first reflector disposed under the light guide plate and having one side adjacent to an area in which the light emitting device is disposed;
a second reflector disposed above the light emitting device;
a housing receiving the light guide plate, the light emitting device, the first reflector, and the second reflector; and
a thin film transistor substrate directly contacting top surfaces of the second reflector and the light guide plate,
wherein the second reflector comprises a curved or inclined structure, a first distal end of the second reflector contacting a circuit board and a second distal end contacting the light guide plate,
wherein the housing has a side portion on which the light emitting device is received, the side portion having a cross-section comprising a first side defined as a lower surface of the housing, and a second side vertically extending from the first side in an upper direction of the housing, and
wherein the first distal end of the second reflector contacts the second side of the housing and an upper surface of the circuit board, and the second distal end of the second reflector contacts a side surface of the light guide plate.

2. The backlight unit of claim 1 ,
wherein the light emitting device comprises a flip-chip light emitting diode chip and a wavelength conversion layer covering an upper surface and both side surfaces of the light emitting diode chip.

3. The backlight unit of claim 2 , wherein the circuit board is disposed on the first side within the housing.

4. The backlight unit of claim 3 , wherein the circuit board has one surface facing the first side within the housing, and another surface on which the light emitting device is mounted.

5. The backlight unit of claim 4 , wherein the first reflector has an upper surface facing a lower surface of the light guide plate, and the distal end faces a distal end of the circuit board.

6. The backlight unit of claim 3 , wherein the second reflector extends between the second side of the housing and the light guide plate.

7. The backlight unit of claim 3 , further comprising:
optical sheets disposed on the light guide plate; and
a light shielding tape disposed parallel to the first side of the housing, the light shielding tape covering edges of the optical sheets in order to secure the optical sheets while preventing light leakage.

8. The backlight unit of claim 2 , wherein the wavelength conversion layer comprises a first layer covering the upper surface of the light emitting diode chip and a second layer covering both side surfaces of the light emitting diode chip, the first layer having a thickness that is greater than a thickness of the second layer.

9. A backlight unit comprising:
a light guide plate;
a light emitting device disposed adjacent to a first side of the light guide plate;
a housing receiving the light guide plate and the light emitting device;
a first reflector disposed under the light guide plate;
a second reflector covering the light emitting device;
a circuit board disposed between the housing and the light emitting device; and
a thin film transistor substrate directly contacting top surfaces of the second reflector and the light guide plate,
wherein the light emitting device comprises a flip-chip light emitting diode chip and a wavelength conversion layer covering an upper surface and both side surfaces of the light emitting diode chip,
wherein the wavelength conversion layer comprises a first layer covering the upper surface of the light emitting diode chip and a second layer covering both side surfaces of the light emitting diode chip, the first layer having a higher thickness than the second layer,
wherein the second reflector comprises a curved structure or an inclined structure,
wherein the housing comprises a side portion receiving the light emitting device, a cross-section of the housing comprising a second side vertically extending in an upper direction based on a first side defined as a lower side, and
wherein the second reflector has a first distal end contacting the second-side of the housing or an upper surface of the circuit board, and a second distal end contacting a side surface of the light guide plate.

10. The backlight unit of claim 9 , wherein the circuit board is disposed on the first side of the housing.

11. The backlight unit of claim 9 , wherein the first reflector is disposed under the light guide plate and has one side adjacent to an area in which the light emitting device is disposed.

12. The backlight unit of claim 9 , wherein the circuit board is disposed on the first side within the housing,
wherein the first reflector has an upper surface facing a lower surface of the light guide plate, and a distal end facing a distal end of the circuit board.

13. The backlight unit of claim 9 , wherein the second reflector extends between the second side of the housing and the light guide plate.

14. The backlight unit of claim 9 , further comprising:
optical sheets disposed on the light guide plate; and
a light shielding tape disposed parallel to the first side of the housing, the light shielding tape covering edges of the optical sheets in order to secure the optical sheets while preventing light leakage.

15. The backlight unit of claim 9 , wherein the second reflector is disposed parallel to the circuit board.

Assignees

• Seoul Semiconductor Co Ltd

Inventors

• Song Young Jun

Classifications

• H01L33/508

  Electricity · mapped topic

• H01L33/505

  Electricity · mapped topic

• G02B6/0088

  of the light guide or other optical sheets in the package · CPC title

• G02B6/005

  provided by one optical element, or plurality thereof, placed on the light output side of the light guide · CPC title

• G02B6/0073 Primary

  Light emitting diode [LED] · CPC title