Thermal airflow sensor having a diaphragm with a cavity opening on the back side and a support member including a communicating hole

Patent metadata

Field	Value
Publication number	US-9857212-B2
Application number	US-201314408012-A
Country	US
Kind code	B2
Filing date	Jun 10, 2013
Priority date	Jun 29, 2012
Publication date	Jan 2, 2018
Grant date	Jan 2, 2018

Abstract

An object of the present invention is to provide a thermal airflow sensor with high detection accuracy. In achieving the above object, this invention provides a thermal flow sensor including: a flow rate detection element that has a diaphragm formed by processing a semiconductor substrate, a heating resistor provided on the diaphragm, and resistance temperature detectors installed upstream and downstream of the heating resistor; and a support member that adhesively holds the flow rate detection element with a sheet adhesive interposed therebetween. The support member includes a communicating hole of which one end has an opening to a cavity provided on the back side of the diaphragm. The sheet adhesive has a ventilating hole formed in an opening area of the communicating hole in the support member.

First claim

The invention claimed is:

1. A thermal flow sensor comprising:
a flow rate detection element that has a diaphragm formed by processing a semiconductor substrate, a heating resistor provided on the diaphragm, and resistance temperature detectors installed upstream and downstream of the heating resistor; and
a support member that adhesively holds the flow rate detection element with a sheet adhesive interposed therebetween, wherein the sheet adhesive is a solid sheet layer;
wherein the support member has a first ventilating hole for ventilating a cavity on a back side of the diaphragm and the support member has a second ventilating hole formed on a same plane as where the first ventilating hole is provided and a position of the second ventilating hole on the plane corresponding to where the semiconductor substrate is not provided, and a trench is provided on the support member to form a communicating passage through which the first and second ventilating holes communicate;
wherein the sheet adhesive has a third ventilating hole that is provided in an area where a diaphragm opening edge of the sheet adhesive matches the first ventilating hole of the support member; and
wherein the third ventilating hole is provided in the area of the sheet adhesive such that the cavity is configured to communicate with the the first ventilating hole.

2. The thermal airflow sensor according to claim 1 , wherein a number of ventilating holes are formed at a predetermined interval all over the sheet adhesive.

3. The thermal airflow sensor according to claim 2 , wherein a largest size of the ventilating holes formed over the sheet adhesive is smaller than a smallest size between a diaphragm back side opening edge on a back side of a semiconductor device and a back side periphery of the semiconductor device.

4. The thermal airflow sensor according to claim 3 , further comprising a resin that integrally seals the support member and the flow rate detection element;
wherein the resin has a first opening that exposes the diaphragm, and a second opening that exposes the first ventilating hole.

5. The thermal airflow sensor according to claim 2 , wherein the predetermined interval is smaller than the smallest size of a region in which an area of the diaphragm back side opening matches an area of the ventilating holes provided in the support member.

6. The thermal airflow sensor according to claim 1 , wherein the support member is a lead frame.

7. The thermal airflow sensor according to claim 1 , wherein the support member is adhesively bonded onto a lead frame.

8. The thermal airflow sensor according to claim 7 , further comprising a resin that integrally seals the lead frame, the support member, and the flow rate detection element;
wherein the resin has a first opening that exposes the diaphragm, and a second opening that exposes the second ventilating hole provided in the support member.

9. The thermal airflow sensor according to claim 1 , wherein a portion of the support member forming the communicating passage of the trench is thinner in width relative to other portions of the support member.

Assignees

• Hitachi Automotive Systems Ltd

Inventors

• Doi Ryosuke
• Hanzawa Keiji
• Tokuyasu Noboru

Classifications

• G01F1/6845

  Micromachined devices · CPC title

• G01F5/00

  Measuring a proportion of the volume flow · CPC title

• G01P5/12

  using variation of resistance of a heated conductor · CPC title

• G01F1/692 Primary

  Thin-film arrangements · CPC title