Air flow measuring device

US9857211B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9857211-B2
Application numberUS-201414509453-A
CountryUS
Kind codeB2
Filing dateOct 8, 2014
Priority dateJul 20, 2011
Publication dateJan 2, 2018
Grant dateJan 2, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An air flow measuring device is adapted to be attached to a duct. The device includes a first housing, a second housing, and a flow sensor. The first housing defines a bypass flow passage which takes in a part of air flowing in the duct, and includes a hollow part and a recess. The bypass flow passage is formed in the hollow part. The recess is formed on an upper side of the hollow part in a vertical direction of the device, and at the recess, an outer surface of the first housing is recessed inward of the first housing. The second housing is formed through secondary formation with the first housing as a primary formed part. The first housing is held on a lower side of the second housing in the vertical direction. The flow sensor is disposed in the bypass flow passage.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of producing an air flow measuring device, the air flow measuring device including: a first housing that defines a bypass flow passage which takes in a part of air flowing in a duct and that includes: a hollow part in which the bypass flow passage is formed; and a recess which is formed on an upper side of the hollow part in a vertical direction of the device and at which an outer surface of the first housing is recessed inward of the first housing; a second housing that is formed through secondary formation with the first housing as a primary formed part, wherein: the recess includes side surfaces on its both sides in the vertical direction; and one of the side surfaces of the recess is located on a side of the recess that faces the second housing; and a flow sensor that is disposed in the bypass flow passage, the method comprising: providing the first housing; and forming the second housing through the secondary formation with the first housing as the primary formed part such that the first housing is held on a lower side of the second housing in the vertical direction, wherein the forming of the second housing includes inserting a part of a die into the recess to make the one of the side surfaces serve as a die cramp surface, and wherein, during the step of forming the second housing through the secondary forming: the first housing is supported by a part of the die on the lower side of the second housing in the vertical direction; the second housing is formed as a result of injection of secondary formation resin into the die with the first housing being fixed in the die; and the first housing, which is provided separately from the duct, is attached to the duct. 2. The method according to claim 1 , further comprising configuring the recess as a circumferential groove that is formed continuously along an entire periphery of the outer surface of the first housing.

Assignees

Inventors

Classifications

  • using a hot wire flow sensor · CPC title

  • Positioning or centering articles in the mould · CPC title

  • by control of a separate heating or cooling element · CPC title

  • Micromachined devices · CPC title

  • the pressure or differential pressure being measured by means of communicating tubes or reservoirs with movable fluid levels, e.g. by U-tubes · CPC title

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What does patent US9857211B2 cover?
An air flow measuring device is adapted to be attached to a duct. The device includes a first housing, a second housing, and a flow sensor. The first housing defines a bypass flow passage which takes in a part of air flowing in the duct, and includes a hollow part and a recess. The bypass flow passage is formed in the hollow part. The recess is formed on an upper side of the hollow part in a ve…
Who is the assignee on this patent?
Denso Corp
What technology area does this patent fall under?
Primary CPC classification G01F1/6842. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Jan 02 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).