PVD coating for metal machining

Patent metadata

Field	Value
Publication number	US-9856556-B2
Application number	US-201113643022-A
Country	US
Kind code	B2
Filing date	Mar 30, 2011
Priority date	Apr 23, 2010
Publication date	Jan 2, 2018
Grant date	Jan 2, 2018

Abstract

The present invention relates to a wear resistant coating suitable to be deposited on cutting tool inserts for chip forming metal machining. The coating comprises at least two layers with different grain size, but with essentially the same composition. The coating is deposited by Physical Vapor Deposition (PVD).

First claim

The invention claimed is:

1. A method of coating a machine cutting tool, comprising:
depositing, on the machine cutting tool, plural AlTiN alternating coating layers using cathodic arc evaporation with a cathode,
wherein said plural AlTiN alternating coating layers differ in average grain width and comprise:
at least one first layer comprising:
a first composition; and
a first average grain width of between 2 nm and 50 nm; and
at least one second layer in contact with the at least one first layer and comprising:
a second composition; and
a second average grain width of between 30 nm and 500 nm,
wherein the first composition is the same as the second composition to within plus or minus 3 at. % units for each chemical element of said first and second compositions; and
wherein a ratio of the first average grain width to the second average grain width is greater than two.

2. The method of claim 1 , wherein the depositing comprises depositing with a same cathode the plural AlTiN alternating coating layers using cathodic arc evaporation.

3. The method of claim 1 , wherein the depositing comprises depositing, with identical composition cathodes, the plural AlTiN alternating coating layers using cathodic arc evaporation.

4. The method of claim 1 , wherein the depositing comprises depositing, with different process conditions, the plural AlTiN alternating coating layers using cathodic arc evaporation.

5. The method of claim 1 , wherein the depositing utilizes process parameters for the at least one first layer that include:
a first magnetic field at the cathode;
a first deposition temperature;
a first evaporation current; and
a first bias voltage.

6. The method of claim 5 , wherein the depositing utilizes process parameters for the at least one second layer that include:
a second magnetic field at the cathode that is different than the first magnetic field;
a second deposition temperature;
a second evaporation current; and
a second bias voltage.

7. The method of claim 5 , wherein the depositing utilizes process parameters for the at least one second layer that include:
a second magnetic field at the cathode;
a second deposition temperature that is different than the first deposition temperature;
a second evaporation current; and
a second bias voltage.

8. The method of claim 5 , wherein the depositing utilizes process parameters for the at least one second layer that include:
a second magnetic field at the cathode;
a second deposition temperature;
a second evaporation current that is different than the first evaporation current; and
a second bias voltage.

9. The method of claim 5 , wherein the depositing utilizes process parameters for the at least one second layer that include:
a second magnetic field at the cathode;
a second deposition temperature;
a second evaporation current that is between 100 and 300 A and the first evaporation current is between 30 and 100 A; and
a second bias voltage.

10. The method of claim 5 , wherein the depositing utilizes process parameters for the at least one second layer that include:
a second magnetic field at the cathode;
a second deposition temperature;
a second evaporation current; and
a second bias voltage that is different than the first bias voltage.

11. The method of claim 1 , wherein the at least one first layer has a thickness of between 0.03 μm and 5 μm.

12. The method of claim 11 , wherein the at least one first layer has a thickness of between 0.05 μm and 2 μm.

13. The method of claim 1 , wherein the at least one second layer has a thickness of between 0.1 μm and 5 μm.

14. The method of claim 13 , wherein the at least one second layer has a thickness of between 0.2 μm and 2 μm.

15. The method of claim 1 , wherein said plural AlTiN alternating coating layers comprise between 2 and 200 layers.

16. The method of claim 15 , wherein said plural AlTiN alternating coating layers comprise between 2 and 40 layers.

17. The method of claim 15 , wherein said plural AlTiN alternating coating layers comprise between 2 and 20 layers.

18. The method of claim 1 , wherein an overall thickness of said plural AlTiN alternating coating layers is between 0.3 μm and 20 μm.

19. The method of claim 18 , wherein an overall thickness of said plural AlTiN alternating coating layers is between 0.5 μm and 10 μm.

20. A method of coating a machine cutting tool, comprising:
depositing, on the machine cutting tool, plural AlTiN alternating first and second coating layers using cathodic arc evaporation with a cathode,
wherein said plural AlTiN alternating first and second coating layers differ in average grain width and:
said plural first layers comprise:
a first composition; and
a first average grain width of between 2 nm and 50 nm; and
said plural second layers comprise:
a second composition; and
a second average grain width of between 30 nm and 500 nm,
wherein the first composition is the same as the second composition to within plus or minus 3 at. % units for each chemical element of said first and second compositions; and
wherein a ratio of the first average grain width to the second average grain width is greater than two.

Assignees

• Sjölén Jacob
• Andersson Jon
• Vetter Jörg
• Müller Jürgen
• Oerlikon Surface Solutions Ag Pfaeffikon

Inventors

• Sjölén Jacob
• Andersson Jon
• Vetter Jörg
• Müller Jürgen

Classifications

• C23C14/325 Primary

  Electric arc evaporation · CPC title

• C23C30/005

  on hard metal substrates · CPC title

• C23C14/0641

  Nitrides (C23C14/0617 takes precedence) · CPC title