Method of forming aligned pattern in pattern formation region by using imprint process

Patent metadata

Field	Value
Publication number	US-9855703-B2
Application number	US-201514724898-A
Country	US
Kind code	B2
Filing date	May 29, 2015
Priority date	Jul 25, 2014
Publication date	Jan 2, 2018
Grant date	Jan 2, 2018

Abstract

A method of forming a pattern by using an imprint process includes: forming an adhesion promoting layer only in a pattern formation region on a substrate; coating a resin to cover the substrate and the adhesion promoting layer; transferring a pattern of a stamp mold to the resin covering the substrate and the adhesion promoting layer, by pressing the stamp mold onto the resin; irradiating ultraviolet light onto the resin covering the substrate and the adhesion promoting layer, to cure the resin and form a pattern of the cured resin to correspond to the pattern of the stamp mold, on the substrate; and detaching the stamp mold from the substrate, to leave a portion of the cured resin pattern only on the adhesion promoting layer on the substrate and to remove a remaining portion of the cured resin pattern from the substrate.

First claim

What is claimed is:

1. An imprint process method of forming an aligned pattern, the method comprising:
forming an adhesion promoting layer only in a pattern formation region on a first substrate;
coating a resin on the first substrate to cover the adhesion promoting layer;
transferring a first pattern of a stamp mold to the resin coated on the first substrate and covering the adhesion promoting layer, by pressing the stamp mold onto the resin coated on the first substrate and covering the adhesion promoting layer;
irradiating ultraviolet light onto the resin coated on the first substrate and covering the adhesion promoting layer, to cure the resin and form a second pattern of the cured resin to correspond to the first pattern of the stamp mold, on the first substrate; and
detaching the stamp mold from the substrate, to leave a portion of the cured resin second pattern only on the adhesion promoting layer on the first substrate and to remove a remaining portion of the cured resin second pattern from the first substrate.

2. The method of claim 1 , wherein the forming the adhesion promoting layer comprises:
forming a mask on the first substrate to expose the pattern formation region;
forming an adhesion promoting material layer on the first substrate to cover the mask and to cover the pattern formation region; and
removing the mask from the first substrate to remove a portion of the adhesion promoting material layer formed in a region outside the pattern formation region.

3. The method of claim 2 , wherein the adhesion promoting material layer comprises an ultraviolet-curable material.

4. The method of claim 2 , wherein the adhesion promoting material layer comprises a solution of a silane coupling agent.

5. The method of claim 2 , wherein the adhesion promoting material layer is formed on the first substrate in a dry state to have a thickness of about 10 nanometers or less.

6. The method of claim 2 , wherein the adhesion promoting layer is formed on the first substrate by spin coating or vapor deposition.

7. The method of claim 2 , wherein the forming the mask on the first substrate comprises attaching a mask material layer onto the first substrate by an electrostatic force or a reversible bonding.

8. The method of claim 7 , wherein the mask material layer comprises a polymer film or a release film.

9. The method of claim 1 , wherein the forming the adhesion promoting layer comprises:
forming a mask on the first substrate to expose a surface of the substrate in the pattern formation region; and
performing an oxygen plasma treatment or an ultraviolet ozone treatment on the surface of the first substrate exposed in the pattern formation region.

10. The method of claim 1 , wherein the curing the resin comprises chemically bonding the adhesion promoting layer and the resin to each other.

11. The method of claim 1 , further comprising:
forming an adhesive layer on a second substrate separate from the first substrate;
pressing the stamp mold with the remaining portion of the cured resin second pattern thereon, onto the second substrate with the adhesive layer thereon, such that the remaining portion of the cured resin second pattern on the stamp mold contacts the adhesive layer on the second substrate; and
detaching the stamp mold from the second substrate to leave the remaining portion of the cured resin second pattern in contact with the adhesive layer on the second substrate and to remove the remaining portion of the cured resin second pattern from the stamp mold.

12. The method of claim 11 , wherein the adhesive layer comprises a double-sided tape.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Lee Sunghoon
• Kim Dongouk
• Park Joonyong
• Bae Jihyun
• Shin Bongsu
• Chung Jaeseung
• Hahm Sukgyu
• Ok Jong G
• Yoon Ilsun

Classifications

• B29C67/00

  Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00 · CPC title

• B29C2045/0075

  curing or polymerising by irradiation · CPC title

• B29C59/165

  of profiled articles, e.g. hollow or tubular articles · CPC title

• B29C59/16 Primary

  by wave energy or particle radiation {, e.g. infrared heating (B29C59/007 takes precedence)} · CPC title

• G03F7/0002 Primary

  Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping · CPC title