Heat sink, method for making the same, and electronic device having the same

Patent metadata

Field	Value
Publication number	US-9855629-B2
Application number	US-201514834673-A
Country	US
Kind code	B2
Filing date	Aug 25, 2015
Priority date	Jun 24, 2015
Publication date	Jan 2, 2018
Grant date	Jan 2, 2018

Abstract

A heat sink includes a connecting member, a first substrate, a second substrate, and a cooling medium. The connecting member is sandwiched between the first substrate and the second substrate, and defines at least one hole passing through the connecting member. Each hole includes a first end and a second end respectively enclosed by the first substrate and the second substrate to define a cavity. The cooling medium is filled in each cavity.

First claim

What is claimed is:

1. A method for making a heat sink comprising:
providing a connecting member defining at least one hole passing through the connecting member, each hole comprising a first end and a second end opposite to the first end;
providing a first substrate and a second substrate each configured to conduct heat;
disposing the connecting member on the first substrate, to cause the first end of each hole to be enclosed by the first substrate;
filling each hole with a cooling medium, wherein the cooling medium is filled in each cavity by coating or injecting; the cooling medium is made of a phase change material or a material generating a phase change material under heat; the cooling medium has a volume percentage of about 15% to about 30% in each hole;
disposing the second substrate on the connecting member away from the first substrate, to cause the connecting member to be sandwiched between the first substrate and the second substrate, and the second end of each hole to be enclosed thereby forming an enclosed cavity; and
pressing the first substrate and the second substrate, with the sandwiched connecting member, to cause the first substrate, the second substrate and the connecting member to be connected to each other.

2. The method of the claim 1 , wherein the connecting member comprises a supporting plate and two connecting plates; the two connecting plates are respectively disposed on two opposite surfaces of the supporting plate; each hole passes through the two connecting plates and the supporting plate; one connecting plate is sandwiched between the supporting plate and the first substrate; the other connecting plate is sandwiched between the supporting plate and the second substrate.

3. The method of the claim 2 , wherein the supporting plate is made of a material selected from a group consisting of copper, aluminum, carbon steel, and silver.

4. The method of the claim 2 , wherein the supporting plate comprises a supporting sheet and two copper sheets respectively defined on two opposite surfaces of the supporting sheet; one copper sheet is sandwiched between the supporting sheet and one connecting plate; the other copper sheet is sandwiched between the supporting sheet and the other connecting plate; the supporting sheet is made of an insulating material.

5. The method of the claim 2 , wherein each connecting plate is a prepreg consisting of resin and reinforcement material; the reinforcement material is selected from a group consisting of glass fiber fabric, paper-base, and composite material.

6. The method of the claim 1 , wherein each hole is formed by mechanical cutting, layer cutting, or punching.

7. The method of the claim 1 , wherein each of the first substrate and the second substrate is made of a material selected from a group consisting of copper, aluminum, silver, and graphite.

Assignees

• Hongqisheng Prec Electronics (Qinhuangdao) Co Ltd
• Fukui Prec Component (Shenzhen) Co Ltd
• Zhen Ding Tech Co Ltd
• Qi Ding Tech Qinhuangdao Co Ltd

Inventors

• Huang Yu-Cheng

Classifications

• H10W40/73

  for cooling by change of state · CPC title

• H10W40/037

  Assembling together parts thereof · CPC title

• H01L23/427

  Electricity · mapped topic

• B23P2700/10

  Heat sinks · CPC title

• B23P15/26 Primary

  heat exchangers {or the like (making heat exchangers by methods covered by other subclasses B21D53/02)} · CPC title