Functionalized metal oxide soldering methods and UV sensor manufactured thereof

Patent metadata

Field	Value
Publication number	US-9855618-B2
Application number	US-201514623155-A
Country	US
Kind code	B2
Filing date	Feb 16, 2015
Priority date	Dec 3, 2014
Publication date	Jan 2, 2018
Grant date	Jan 2, 2018

Abstract

Provided are a method of soldering a functionalized metal oxide, and an electronic device manufactured thereby, and more particularly, a method of soldering a functionalized metal oxide which is capable of growing a solder structure by a hydrothermal synthesis method using a pulsed laser, and is usable in a UV sensor, and an electronic device manufactured thereby. According to the present invention, thermal diffusion generated from a laser is limited due to the use of a pulsed laser, and thus, nanosolder having high density and a shape to be precisely adjustable may be prepared by a hydrothermal synthesis method by the pulsed laser, thereby facilitating the joining of the nanostructure, and further, the nanosolder is formed between the nanostructures, thereby being usable as a metal oxide structure having functionality.

First claim

What is claimed is:

1. A method of soldering a functionalized metal oxide comprising:
forming two nanostructures on a substrate, wherein the two nanostructures are crossed with respect to one another to form an intersection point;
dipping the substrate on which the nanostructures are formed in a precursor solution for hydrothermal synthesis; and
irradiating at least a portion of the intersection point of the two nanostructures in a precursor solution for hydrothermal synthesis with a pulsed laser having a pulse duty ratio of 5% to 20% and a pulse width controlled in a range of 100 ns to 3000 ns to produce and grow a solder bump, so that the two nanostructures are connected to each other by the grown solder bump.

2. The method of claim 1 , wherein the nanostructures have a light absorption layer for absorbing light energy of the laser, formed on at least a portion thereof.

3. The method of claim 2 , wherein as the light absorption layer, different materials are used depending on a wavelength of the laser.

4. The method of claim 2 , wherein the light absorption layer is one selected from the group consisting of metals and semiconductors.

5. The method of claim 1 , wherein the precursor solution for hydrothermal synthesis is a mixed solution of an aqueous precursor solution and an aqueous amine compound solution.

6. The method of claim 5 , wherein the aqueous precursor solution includes any one of metal precursors and semiconductor precursors.

7. The method of claim 5 , wherein the amine compound is one or more selected from the group consisting of hexamethyleneamine, hexamethylenetetramine (HMT), cyclohexylamine, monoethanolamine, diethanolamine, and triethanolamine.

8. The method of claim 1 , further comprising annealing the solder bump, after the forming of the solder bump.

9. The method of claim 1 , wherein the substrate comprises a silicon substrate on which an oxide film having a thickness of 50 nm and a tungsten absorption layer having a thickness of 40 nm are deposited, and the pulsed laser has a peak power irradiated in a range of 5 mW/μm 2 to 20 mW/μm 2 in atmospheric pressure.

10. The method of claim 1 , further comprising covering the substrate with a transparent substrate, after the dipping of the substrate on which the nanostructures are formed in a precursor solution for hydrothermal synthesis.

Assignees

• Korea Advanced Inst Sci & Tech

Inventors

• Yu Kyoungsik
• Kwon Kyungmook
• Shim Jaeho
• Choi Kyunghan

Classifications

• C23C18/143

  Radiation by light, e.g. photolysis or pyrolysis · CPC title

• C23C18/1216

  Metal oxides (C23C18/1212 takes precedence) · CPC title

• B23K1/0056

  soldering by means of beams, e.g. lasers, electron beams [EB] · CPC title

• B23K1/20 Primary

  Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating · CPC title

• H10W72/07236

  Soldering or alloying · CPC title