Unit for semiconductor device

Patent metadata

Field	Value
Publication number	US-9854708-B2
Application number	US-201414525780-A
Country	US
Kind code	B2
Filing date	Oct 28, 2014
Priority date	Jan 5, 2010
Publication date	Dec 26, 2017
Grant date	Dec 26, 2017

Abstract

A semiconductor device has a single unit capable of improving adhesion to a cooling body and a heat dissipation performance, and an aggregate of the single units is capable of configuring any circuit at a low cost. A single unit includes copper blocks, an insulating substrate with a conductive pattern, an IGBT chip, a diode chip, a collector terminal pin, implant pins fixed to the chips by solder, a printed circuit board having the implant pins fixed thereto, an emitter terminal pin, a control terminal pin, a collector terminal pin, and a resin case having the above-mentioned components sealed therein. The copper blocks make it possible to improve adhesion to a cooling body and the heat dissipation performance. A plurality of single units can be combined with an inter-unit wiring board to form any circuit.

First claim

What is claimed is:

1. A unit for a semiconductor device, comprising:
an insulating substrate having a first conductive pattern formed on one surface thereof and a second conductive pattern formed on the other surface which is a side opposite to the one surface across the insulating substrate;
a first conductive block formed on the first conductive pattern;
a second conductive block formed on the second conductive pattern so that the second conductive block is arranged on a side opposite to the first conductive block across the insulating substrate;
a semiconductor chip having one surface fixed to the second conductive block;
a plurality of implant pins fixed to the other surface of the semiconductor chip;
a printed circuit board having a third conductive pattern formed thereon and the implant pins fixed thereon;
a first external lead terminal fixed to the second conductive block;
a second external lead terminal fixed to the third conductive pattern and electrically connected to the implant pins; and
a resin case covering the first conductive block, the second conductive block, and the insulating substrate, and sealing such that the first conductive block is exposed from a first surface of the resin case and ends of the first and second external lead terminals protrude from a second surface at an opposite side of the first surface.

2. The unit for a semiconductor device according to claim 1 , wherein the first external lead terminal has two terminals;
the second external lead terminal has two terminals; and
the resin case seals such that the first conductive block is exposed from the first surface thereof, ends of the terminals of the first external lead terminal protrude from a second surface adjacent to the first surface and a third surface opposite to the second surface, and ends of the terminals of the second external lead terminal protrude from a fourth surface adjacent to the first surface and a fifth surface at an opposite side of the fourth surface.

3. The unit for a semiconductor device according to claim 1 , wherein the semiconductor chip is an IGBT chip, a diode chip, a power MOSFET chip, a power bipolar transistor chip, or a thyristor chip.

4. The unit for a semiconductor device according to claim 1 , wherein the semiconductor chip is an IGBT chip and a diode chip electrically inverse-parallel connected, or an MOSFET chip and a diode chip inverse-parallel connected, through the second conductive block and the third conductive pattern.

5. The unit for a semiconductor device according to claim 1 , wherein the first conductive block protrudes outwardly from the first surface of the resin case covering the first conductive block.

6. The unit for a semiconductor device according to claim 1 , wherein a lower surface of the resin case is located at the lateral sides of the first conductive block, and the surface of the first conductive block opposite to the surface on which the first conducive pattern is fixed is located below the lower surface of the resin case.

7. The unit for a semiconductor device according to claim 1 , wherein the first and second external lead terminals are terminal pins extending outwardly from the unit.

8. The unit for a semiconductor device according to claim 7 , wherein the first external lead terminal fixed on the second conductive block passes through a hole of the printed circuit board and extends outside the resin case.

9. The unit for a semiconductor device according to claim 1 , further comprising a solder formed separately from the first conductive block and the first conductive pattern, and connecting the first conductive block and the first conductive pattern, and
another solder formed separately from the second conductive block and the second conductive pattern, and connecting the second conductive block and the second conductive pattern.

10. The unit for a semiconductor device according to claim 9 , wherein the first conductive block and the second conductive block are copper blocks, respectively.

11. The unit for a semiconductor device according to claim 1 , wherein the first conductive block formed on the first conductive pattern is located at a side opposite to the second conductive block across the first conductive pattern.

12. The unit for a semiconductor device according to claim 11 , wherein the first conductive block located under the second conductive block and the semiconductor chip is exposed from the first surface of the resin case.

Assignees

• Fuji Electric Co Ltd

Inventors

• Yamada Takafumi
• Inaba Tetsuya
• Ikeda Yoshinari
• Yanagawa Katsuhiko
• Takahashi Yoshikazu

Classifications

• H05K7/20509 Primary

  Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures · CPC title

• H05K7/02

  Arrangements of circuit components or wiring on supporting structure · CPC title

• H10W74/114

  by a substrate and the encapsulations · CPC title

• H10W72/00

  Interconnections or connectors in packages · CPC title

• H10W40/611

  Bolts or screws · CPC title