Semiconductor laser device

Patent metadata

Field	Value
Publication number	US-9853415-B2
Application number	US-201515322232-A
Country	US
Kind code	B2
Filing date	Jul 9, 2015
Priority date	Jul 14, 2014
Publication date	Dec 26, 2017
Grant date	Dec 26, 2017

Abstract

A semiconductor laser device of the present disclosure includes a cooling plate, an insulating sheet, a first cooling block, and a first semiconductor laser element. The conductive cooling plate includes a water supply passage and a drain passage. The insulating sheet is provided to the cooling plate, and includes a first through hole connected to the water supply passage and a second through hole connected to the drain passage. A first cooling block is provided to the insulating sheet, includes therein a first tube connected to the first through hole and the second through hole, and is electrically conductive. The first semiconductor laser element is provided to the first cooling block. The first semiconductor laser element includes a first electrode, and a second electrode opposite to the first electrode. The first electrode is electrically connected to the first cooling block, and the cooling plate is at a floating potential.

First claim

The invention claimed is:

1. A semiconductor laser device comprising:
a cooling plate including a water supply passage and a drain passage, which are independent of each other therein, and being electrically conductive, and;
an insulating sheet provided to the cooling plate, and including a first through hole connected to the water supply passage and a second through hole connected to the drain passage;
a first cooling block provided to the insulating sheet, including a first tube connected to the first through hole and the second through hole therein, and being electrically conductive; and
a first semiconductor laser element provided to the first cooling block,
wherein the first semiconductor laser element includes a first electrode and a second electrode opposite to the first electrode,
the first electrode is electrically connected to the first cooling block, and
the cooling plate is at a floating potential.

2. The semiconductor laser device of claim 1 , further comprising a first conductive board provided between the first electrode and the first cooling block and adjusting thermal expansion coefficients of the first electrode and the first cooling block.

3. The semiconductor laser device of claim 1 , wherein the first electrode is a positive electrode, and the second electrode is a negative electrode.

4. The semiconductor laser device of claim 1 , wherein cooling water flows in the water supply passage, the drain passage, and the first tube, and the cooling water is ion-exchanged water having electric conductivity of less than 10 μS/cm.

5. The semiconductor laser device of claim 1 , wherein the water supply passage and the drain passage are connected to each other via a circulation device outside the cooling plate.

6. The semiconductor laser device of claim 1 , wherein main material for the cooling plate is stainless steel.

7. The semiconductor laser device of claim 1 , wherein main material for the first cooling block is copper.

8. The semiconductor laser device of claim 1 , further comprising:
a second cooling block provided to the insulating sheet and being electrically conductive; and
a second semiconductor laser element provided to the second cooling block,
wherein the insulating sheet includes a third through hole connected to the water supply passage and a fourth through hole connected to the drain passage,
the second cooling block includes a second tube connected to the third through hole and the fourth through hole therein,
the second semiconductor laser element includes a third electrode and a fourth electrode opposite to the third electrode,
the third electrode is electrically connected to the second cooling block, and
the second cooling block and the second electrode are electrically connected to each other.

Assignees

• Panasonic Ip Man Co Ltd

Inventors

• Yoshida Takayuki
• Wang jing-bo

Classifications

• H01S5/024

  Arrangements for thermal management · CPC title

• H10W40/47

  by flowing liquids, e.g. forced water cooling · CPC title

• H01S5/02423 Primary

  Liquid cooling, e.g. a liquid cools a mount of the laser · CPC title

• H01S5/4018

  Lasers electrically in series · CPC title

• H01S5/4025

  Array arrangements, e.g. constituted by discrete laser diodes or laser bar (H01S5/42 takes precedence) · CPC title