Antenna integrated in a package substrate

Patent metadata

Field	Value
Publication number	US-9853359-B2
Application number	US-201314038202-A
Country	US
Kind code	B2
Filing date	Sep 26, 2013
Priority date	Sep 26, 2013
Publication date	Dec 26, 2017
Grant date	Dec 26, 2017

Abstract

An antenna integrated in a package substrate, the antenna comprising an upper antenna element, a lower antenna element and a coupling element disposed between the upper antenna element and the lower antenna element, the coupling element comprising an aperture, and configured to provide a coupling between the upper antenna element and the lower antenna element.

First claim

The invention claimed is:

1. An antenna integrated in a package substrate, the antenna comprising:
a single upper antenna element, which is contiguous;
a lower antenna element; and
an ungrounded coupling element disposed between the upper antenna element and the lower antenna element, the ungrounded coupling element comprising an open slot aperture that splits the ungrounded coupling element into separate components, and configured to provide a coupling between the upper antenna element and the lower antenna element,
wherein outer edges of the ungrounded coupling element are galvanically free from contact with outer edges of the package substrate.

2. The antenna of claim 1 , wherein the ungrounded coupling element is disposed in a layer closest to a midpoint between the upper antenna element and the lower antenna element.

3. The antenna of claim 1 , further comprising a core, wherein the upper antenna element and the ungrounded coupling element are disposed above the core, and the lower antenna element is disposed below the core.

4. The antenna of claim 1 , wherein the ungrounded coupling element comprises a rectangular shape.

5. The antenna of claim 1 , wherein the slot comprises a shape that is substantially rectangular.

6. The antenna of claim 1 , wherein the aperture comprises a length that is equal to about one-half of a wavelength.

7. The antenna of claim 1 , wherein the aperture comprises a length that is a fractional or a rational multiple of a free space wavelength.

8. The antenna of claim 1 , wherein the aperture comprises a curved shape.

9. The antenna of claim 1 , wherein the aperture comprises a shape that is substantially circular.

10. The antenna of claim 1 , wherein the antenna is a patch antenna, wherein the upper antenna element is a coupled patch, and wherein the lower antenna element is a direct fed patch.

11. A computing device comprising the antenna of claim 1 .

12. A wireless handheld device comprising the antenna of claim 1 .

13. A mobile device comprising the antenna of claim 1 .

14. A phased array of antennas, wherein each antenna is the antenna of claim 1 .

15. An antenna integrated in a package substrate, the antenna comprising:
a single upper antenna element, which is contiguous;
a lower antenna element;
an ungrounded coupling element disposed between the upper antenna element and the lower antenna element, the ungrounded coupling element comprising an aperture, and configured to provide a coupling between the upper antenna element and the lower antenna element, wherein outer edges of the ungrounded coupling element are galvanically free from contact with outer edges of the package substrate; and
a plurality of ungrounded coupling elements disposed between the upper antenna element and the lower antenna element, wherein each of the plurality of ungrounded coupling elements comprises at least one aperture and is configured to provide a coupling between the upper antenna element and the lower antenna element, wherein at least two of the respective apertures comprises different widths.

16. An antenna integrated in a package substrate, comprising:
a single upper antenna element, which is contiguous;
a lower antenna element; and
an ungrounded coupling means for providing coupling between the upper antenna element and the lower antenna element, wherein the ungrounded coupling means comprises an open slot aperture that splits the ungrounded coupling element into separate components, and is disposed between the upper antenna element and the lower antenna element,
wherein outer edges of the ungrounded coupling means are galvanically free from contact with outer edges of the package substrate.

17. The antenna of claim 16 , wherein the aperture is a slot.

18. A method of manufacturing an antenna integrated in a package substrate, the method comprising:
forming a lower antenna element;
forming at least one ungrounded coupling element disposed above the lower antenna element; and
forming a single upper antenna element, which is contiguous and disposed above the ungrounded coupling element,
wherein the at least one ungrounded coupling element comprises an open slot aperture that splits the ungrounded coupling element into separate components, and is configured to provide a coupling between the upper antenna element and the lower antenna element, and outer edges of the at least one ungrounded coupling element are galvanically free from contact with outer edges of the package substrate.

19. A method of manufacturing a phased array of antennas integrated in a package substrate, the method comprising:
forming the phased array of antennas by manufacturing each of the antennas of the phased array according to the method of claim 18 .

Assignees

• Elsherbini Adel A
• Kamgaing Telesphor
• Intel Corp

Inventors

• Elsherbini Adel A
• Kamgaing Telesphor

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W44/248

  for antennas · CPC title

• H01Q21/067

  using endfire radiating aerial units transverse to the plane of the array · CPC title

• H01Q21/065

  Patch antenna array · CPC title

• H01Q21/0006

  Particular feeding systems · CPC title