Laminate sub-mounts for LED surface mount package

Patent metadata

Field	Value
Publication number	US-9853199-B1
Application number	US-201615042927-A
Country	US
Kind code	B1
Filing date	Feb 12, 2016
Priority date	Oct 3, 2014
Publication date	Dec 26, 2017
Grant date	Dec 26, 2017

Abstract

An LED package is described that acts as a sub-mount between a printed circuit board and a diode. The sub-mount includes a laminate to thermally isolate the diode, for example an LED, from the PCB while providing a thermal heat dissipative sink for the diode.

First claim

What is claimed is:

1. A diode package comprising:
a laminate sub-mount including:
a first segmented planar metal layer defining a bottom portion of said sub-mount and having a thickness between 17 microns and 70 microns;
a first heat dissipating planar dielectric layer having an uppermost top surface and a lower most bottom surface wherein no substantial portion of said first heat dissipating planar dielectric layer extends above said uppermost top surface of said first heat dissipating planar dielectric layer, said first heat dissipating planar dielectric layer positioned above said first segmented planar metal layer;
a second segmented metal layer defining a top portion of said sub-mount, said second segmented metal layer forming at least one conductive pad above said first heat dissipating planar dielectric layer and having a thickness between 17 microns and 1 mm, wherein said first heat dissipating planar dielectric layer isolates said first segmented planar metal layer from said second segmented metal layer;
wherein via are formed through said first heat dissipating planar dielectric layer to electrically interconnect said at least one conductive pad with isolated portions of said first segmented planar metal layer;
a metal core supporting a diode and having a top segment aligned coplanar with the top portion of said sub-mount and a bottom segment aligned coplanar with the bottom portion of said sub-mount;
said diode coupled to the top portion of said sub-mount and electrically coupled to said at least one conductive pad; and
a second heat dissipating planar dielectric layer and a third metal layer sandwiched between said second segmented metal layer and said first heat dissipating planar dielectric layer.

2. The diode package as recited in claim 1 , wherein said first heat dissipating planar dielectric layer has a thickness between 10 microns and 200 microns and is made from a ceramic filled polymer.

3. The diode package as recited in claim 1 , wherein said metal core includes a multi-layer metal composite.

4. A diode package comprising:
a sub-mount capable of mounting a diode to a circuit board, said sub-mount including:
a first metal layer having an uppermost top surface and a lowermost bottom surface, wherein no substantial portion of said first metal layer extends above said uppermost top surface, said bottom surface defining a bottom portion of said sub-mount and said first metal layer having a thickness between 17 microns and 70 microns;
a first heat dissipating planar dielectric layer having a thickness between 10 microns and 200 microns and made from a ceramic filled polymer and positioned above said uppermost top surface of said first metal layer;
a second metal layer having a thickness between 17 microns and 1 mm and having a top portion that defines a top portion of said sub-mount;
a metal core having a top segment aligned coplanar with the top portion of said sub-mount and a bottom segment aligned coplanar with the bottom portion of said sub-mount;
a second heat dissipating planar dielectric layer and a third metal layer sandwiched between said second segmented metal layer and said first heat dissipating planar dielectric layer; and
wherein said second metal layer is segmented to form at least one conductive pad layered above said first dielectric, and wherein a via is formed through said first planar dielectric layer to electrically interconnect said at least one conductive pad with an electrically isolated portion of said first metal layer.

5. The diode package as recited in claim 4 , further including a light emitting diode electrically coupled to said at least one conductive pads.

6. The diode package as recited in claim 4 , wherein said ceramic filled polymer includes a polymer selected from the group consisting of epoxies, polyimides, cyanate esters, silicones, phenolics, BT resins, benzocyclobutene, silicone, polyphenylsulfone, polyester, and PEN.

7. The diode package as recited in claim 4 , wherein said ceramic filled polymer includes a ceramic filler selected from the group consisting of boron nitride, aluminum oxide, aluminum nitride, silicone carbide, silicon nitride, silica, magnesium oxide, zinc oxide, zirconium oxide, and titanium dioxide.

8. The diode package as recited in claim 4 , wherein said metal core supports said diode.

9. The diode package as recited in claim 8 , wherein said metal core includes an insulating layer sandwiched between said top portion and bottom portion of said sub-mount.

10. The diode package as recited in claim 9 , wherein said metal core is not electrically coupled with said diode and said metal core includes a multi-layer metal composite.

Assignees

• Henkel IP & Holding GmbH

Inventors

• Kolbe Justin
• Taylor Steve

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/5363

  the connected ends being wedge-shaped · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H01L33/60

  Electricity · mapped topic

• H01L33/642 Primary

  Electricity · mapped topic