Low cost, connectorless, ruggedized small form factor optical sub-assembly (OSA) and data bus-in-a-box (BiB)

Patent metadata

Field	Value
Publication number	US-9851518-B2
Application number	US-201615061879-A
Country	US
Kind code	B2
Filing date	Mar 4, 2016
Priority date	Nov 5, 2014
Publication date	Dec 26, 2017
Grant date	Dec 26, 2017

Abstract

Systems, methods, and apparatus for an optical sub-assembly (OSA) are disclosed. In one or more embodiments, the disclosed apparatus involves a package body, and a lock nut, where a first end of the lock nut inserted into a first cavity of the package body. The apparatus further involves a transistor outline (TO) can, where a first end of the TO can is inserted into a second cavity of the package body. Also, the apparatus involves an optical fiber, where a portion of the jacket from an end of the optical fiber is stripped off, thereby exposing bare optical fiber at the end of the optical fiber. The end of the optical fiber is inserted into a second end of the lock nut such that the bare optical fiber passes into the package body and at least a portion of the bare optical fiber is inserted into the TO can cavity.

First claim

We claim:

1. A method for manufacturing an optical media converter (OMC) on a mother board, the method comprising:
attaching a transmit (Tx) OMC portion of the OMC to a first side of the mother board, wherein the Tx OMC portion comprises a tilted Tx optical sub-assembly (OSA); and
attaching a receive (Rx) OMC portion of the OMC to a second side of the mother board, wherein the Rx OMC portion comprises a tilted Rx OSA,
wherein the first side and the second side are on opposite sides of the mother board.

2. The method of claim 1 , wherein the mother board is a double-sided printed circuit board (PCB).

3. The method of claim 1 , wherein the mother board has a copper core.

4. The method of claim 1 , wherein the method further comprises:
attaching at least one thermal pin on the Tx OMC portion to at least one thermal via hole on the first side of the mother board; and
attaching at least one thermal pin on the Rx OMC portion to at least one thermal via hole on the second side of the mother board.

5. The method of claim 1 , wherein the method further comprises:
attaching at least one signal pin on the Tx OMC portion to at least one signal via hole on the first side of the mother board; and
attaching at least one signal pin on the Rx OMC portion to at least one signal via hole on the second side of the mother board.

6. The method of claim 1 , wherein the attaching of the Tx OMC portion to the first side of the mother board is at least partially performed by dispensing epoxy between a bottom side of the Tx OMC portion and the first side of the mother board.

7. The method of claim 1 , wherein the attaching of the Rx OMC portion to the second side of the mother board is at least partially performed by dispensing epoxy between a bottom side of the Rx OMC portion and the second side of the mother board.

8. A method for manufacturing an OMC portion, the method comprising:
securing, with at least one screw, a bottom side of an optical sub-assembly (OSA) to a side of a board of the OMC portion by applying the at least one screw through an opening in the board into a mounting screw hole on the side of the OSA, thereby mounting the OSA to the board; and
mounting at least one electronic component to at least one of the sides of board.

9. The method of claim 8 , wherein the OMC portion is a TX OMC portion.

10. The method of claim 9 , wherein the OSA is an optical transmitter.

11. The method of claim 8 , wherein the OMC portion is a Rx OMC portion.

12. The method of claim 11 , wherein the OSA is an optical receiver.

13. The method of claim 8 , wherein the board is double-sided printed circuit board (PCB).

14. The method of claim 8 , wherein the board has a copper core.

15. The method of claim 8 , wherein the method further comprises mounting at least one electromagnetic interference (EMI) protection lid over at least one of the at least one electronic component on the board.

16. The method of claim 8 , wherein the board comprises at least one thermal pin.

17. The method of claim 8 , wherein the board comprises at least one signal pin.

18. A method of manufacturing a data bus-in-a-box (BiB), the method comprising:
inserting a portion of a mother board into a back plane connector, such that a core of the mother board is in connection with a thermal conduction back layer and such that the mother board is in connection with at least one pin of at least one connector,
wherein the back plane connector is located on a back plane of the data BiB,
wherein the back plane of the data BiB comprises the thermal conduction back layer and the at least one connector.

19. The method of claim 18 , wherein, the mother board is in connection with the at least one pin via at least one electrical trace.

20. The method of claim 18 , wherein at least one guide rail on the data BiB is used to guide the mother board into the back plane connector.

Assignees

• Boeing Co

Inventors

• Chan Eric Y
• Truong Tuong K
• Koshinz Dennis G
• Pang Henry B

Classifications

• G02B6/428

  containing printed circuit boards [PCB] · CPC title

• G02B6/4441

  Boxes · CPC title

• G02B6/4239

  Adhesive bonding; Encapsulation with polymer material · CPC title

• G02B6/4253

  by embedding housing components in an adhesive or a polymer material (G02B6/4212 takes precedence) · CPC title

• G02B6/4278

  related to pluggable or demountable opto-electronic or electronic elements · CPC title