Thermopile temperature sensor with a reference sensor therein

Patent metadata

Field	Value
Publication number	US-9851258-B2
Application number	US-201514671007-A
Country	US
Kind code	B2
Filing date	Mar 27, 2015
Priority date	Nov 4, 2014
Publication date	Dec 26, 2017
Grant date	Dec 26, 2017

Abstract

A sensor package having a thermopile sensor and a reference thermopile sensor disposed therein. In one or more implementations, the sensor package includes a substrate, a thermopile sensor disposed over the substrate, a reference thermopile sensor disposed over the substrate, and a lid assembly disposed over the thermopile sensor and the reference thermopile sensor. The lid assembly includes a transparent structure that passes electromagnetic radiation occurring in a limited spectrum of wavelengths and an electromagnetic blocker disposed over the lid assembly. The electromagnetic blocker defines an aperture over the thermopile sensor such that at least a portion of the electromagnetic blocker is positioned over the reference thermopile sensor. The electromagnetic blocker is configured to at least substantially block the electromagnetic radiation occurring in a limited spectrum of wavelengths from reaching the reference thermopile sensor.

First claim

What is claimed is:

1. A sensor package comprising:
a substrate;
a thermopile sensor disposed over the substrate;
a reference thermopile sensor disposed over the substrate;
a reference temperature sensor disposed over the substrate;
a lid assembly disposed over the thermopile sensor, the reference thermopile sensor, and the reference temperature sensor, the lid assembly comprising a transparent structure that passes electromagnetic radiation occurring in a limited spectrum of wavelengths and an electromagnetic blocker disposed over the lid assembly, the electromagnetic blocker defining an aperture over the thermopile sensor,
wherein at least a portion of the electromagnetic blocker is positioned over the reference thermopile sensor, the electromagnetic blocker configured to at least substantially block the electromagnetic radiation occurring in a limited spectrum of wavelengths.

2. The sensor package as recited in claim 1 , wherein the electromagnetic blocker comprises at least one of a silicon material, a germanium material, or a metallic material.

3. The sensor package as recited in claim 1 , further comprising a support structure disposed about the substrate for supporting the lid assembly.

4. The sensor package as recited in claim 1 , further comprising a berm structure disposed between the aperture and the reference thermopile sensor to at least substantially prevent transmission of the electromagnetic radiation occurring in a limited spectrum of wavelengths that passes through the aperture to the reference thermopile sensor.

5. The sensor package as recited in claim 1 , wherein the thermopile sensor and the reference thermopile sensor are integrated within the same integrated circuit die.

6. The sensor package as recited in claim 5 , wherein the reference temperature sensor is integrated within the integrated circuit die.

7. The sensor package as recited in claim 1 , further comprising a lens disposed over the aperture, the lens configured to collimate electromagnetic radiation occurring in the limited spectrum of wavelengths incident upon the lens and to transmit the collimated electromagnetic radiation to the thermopile sensor.

8. A system comprising:
a sensor package, the sensor package comprising:
a substrate;
a thermopile sensor disposed over the substrate, the thermopile sensor configured to generate a first electrical signal based upon detected electromagnetic radiation;
a reference thermopile sensor disposed over the substrate, the reference thermopile sensor configured to generate a second electrical signal based upon detected electromagnetic radiation;
a reference temperature sensor disposed over the substrate, the reference temperature sensor configured to generate a signal representing a temperature associated with the thermopile sensor and the reference thermopile sensor;
a lid assembly disposed over the thermopile sensor and the reference thermopile sensor, the lid assembly comprising a transparent structure that passes electromagnetic radiation occurring in a limited spectrum of wavelengths and an electromagnetic blocker disposed over the lid assembly, the electromagnetic blocker defining an aperture over the thermopile sensor,
wherein at least a portion of the electromagnetic blocker is positioned over the reference thermopile sensor, the electromagnetic blocker configured to at least substantially block the electromagnetic radiation occurring in a limited spectrum of wavelengths; and

integrated circuitry in electrical communication with the sensor package, the application-specific integrated circuitry configured to generate an electrical signal corresponding to the detected electromagnetic radiation.

9. The system as recited in claim 8 , wherein the electromagnetic blocker comprises a metallic material.

10. The system as recited in claim 8 , further comprising a support structure disposed about the substrate for supporting the lid assembly.

11. The system as recited in claim 8 , further comprising a heating element disposed over the lid assembly, the heating element configured to generate a known amount of electromagnetic radiation.

12. The system as recited in claim 8 , wherein the electrical signal corresponds to a temperature associated with an object.

13. The system as recited in claim 8 , further comprising a lens disposed over the aperture, the lens configured to collimate electromagnetic radiation occurring in the limited spectrum of wavelengths incident upon the lens and to transmit the collimated electromagnetic radiation to the thermopile sensor.

Assignees

• Maxim Integrated Products

Inventors

• Pei Cheng-Wei
• Easson Craig A
• Emadi Arvin
• Kerness Nicole D
• Barnett Stanley

Classifications

• G01J5/064

  Ambient temperature sensor; Housing temperature sensor; Constructional details thereof · CPC title

• G01J5/045

  Sealings; Vacuum enclosures; Encapsulated packages; Wafer bonding structures; Getter arrangements (getter arrangements per se H10W76/48, H10P36/03) · CPC title

• G01J5/12 Primary

  using thermoelectric elements, e.g. thermocouples · CPC title

• G01J5/06

  Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity (for adjusting of solid angle of collected radiation G01J5/07; means for wavelength selection G01J5/0801) · CPC title

• G01J2005/068

  Physics · mapped topic