Aqueous working fluid

Patent metadata

Field	Value
Publication number	US-9850443-B2
Application number	US-201414768363-A
Country	US
Kind code	B2
Filing date	Mar 5, 2014
Priority date	Mar 6, 2013
Publication date	Dec 26, 2017
Grant date	Dec 26, 2017

Abstract

A water-soluble working fluid of the invention is used for cutting a brittle material using a wire saw. The water-soluble working fluid is provided by blending water, alkylene oxide adduct of acethylene glycol, and glycols. The water-soluble working fluid of the invention is capable of providing favorable cutting accuracy when the brittle material is cut using a wire, and thus is suitable for cutting out a large-diameter wafer. The water-soluble working fluid of the invention is especially suitably applicable to an abrasive-grain-fixed wire saw.

First claim

The invention claimed is:

1. A water-soluble working fluid adapted to be used for cutting a brittle material using a wire saw, the working fluid comprising:
50 mass % or more of water relative to a total amount of the working fluid;
an alkylene oxide adduct of acetylene glycol; and
at least one non-polymeric glycol.

2. The water-soluble working fluid according to claim 1 , wherein a hydrophile-lipophile balance (HLB) of the alkylene oxide adduct of acetylene glycol ranges from 2 to 18.

3. The water-soluble working fluid according to claim 2 , wherein the alkylene oxide adduct of acetylene glycol comprises two alkylene oxide adducts of acetylene glycol of which difference in HLB is 1 or more.

4. The water-soluble working fluid according to claim 1 , wherein a content of the alkylene oxide adduct of acetylene glycol ranges from 0.005 to 10 mass % based on the total amount of the working fluid.

5. The water-soluble working fluid according to claim 1 , wherein a content of the at least one glycol ranges from 0.5 to 30 mass % based on the total amount of the working fluid.

6. The water-soluble working fluid according to claim 1 , wherein a pH of the working fluid ranges from 4 to 8.

7. The water-soluble working fluid according to claim 1 , wherein a viscosity of the working fluid ranges from 0.8 mPa·s to 15 mPa·s.

8. A method, comprising cutting a brittle material with an abrasive-grain-fixed wire saw in contact with the water-soluble working fluid of claim 1 .

9. A method, comprising cutting a brittle material with a wire saw in contact with the water-soluble working fluid of claim 1 , wherein the brittle material is an ingot of silicon, silicon carbide, gallium nitride or sapphire.

Assignees

• Idemitsu Kosan Co

Inventors

• Kitamura Tomohiko

Classifications

• C10M105/08

  containing oxygen · CPC title

• C10M2207/022

  containing at least two hydroxy groups · CPC title

• C10M105/14

  polyhydroxy · CPC title

• C10M145/26

  Polyoxyalkylenes · CPC title

• C10N2030/12

  Inhibition of corrosion, e.g. anti-rust agents or anti-corrosives · CPC title