Enhanced adhesive composition for re-enforcing joints in gypsum panel construction

US9850407B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9850407-B2
Application numberUS-201615214617-A
CountryUS
Kind codeB2
Filing dateJul 20, 2016
Priority dateSep 8, 2015
Publication dateDec 26, 2017
Grant dateDec 26, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

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This invention provides flexible adhesive compositions which can be used instead of joint reinforcement tape for securing a joint seam between abutting panels. Methods using the compositions are provided as well.

First claim

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What is claimed is: 1. A flexible adhesive composition comprising: fibers with the average length from 0.1 to 3 millimeters and a diameter from 5 microns to 25 microns, wherein the fibers contain polypropylene fibers, polyethylene fibers, rayon fibers, or any combination thereof, wherein the fibers are in the amount from 0.1% to 25% by weight, based on the total composition weight; a binder, wherein the binder is a polymeric resin; water in the amount from about 25% to about 75% by weight, based on the total composition weight; at least one thickener in the amount from about 0.1% to about 2% by weight, based on the total composition weight; and wherein the composition has a viscosity in the range from about 200 to about 600 Brabender units and a pH in the range from about 7.0 to about 12. 2. The composition of claim 1 , wherein the composition further comprises a filler with a particle size in the range from 0.2 microns to 250 microns and selected from the group consisting of calcium carbonate, limestone, gypsum, nepheline syenite, titanium dioxide, lithophone, wollastonite, bismuth oxychloride, talc, clay, and any mixture thereof, and wherein the filler is in the amount from 0.5% to 75% by weight, based on the total composition weight. 3. The composition of claim 1 , wherein the fibers are at least one of the following: high-density polyethylene fibers and rayon denier fibers. 4. The composition of claim 1 , wherein the fibers have the average length from 0.5 to 1.5 millimeters. 5. The composition of claim 1 , wherein the polymeric resin is a film-forming polymer selected from the group consisting of ethylene vinyl acetate, styrene/acrylic polymers, acrylic polymers, polyurethane polymers, vinyl/acrylic polymers, and any mixture thereof. 6. The composition of claim 1 , wherein the binder is a latex resin and wherein the composition further comprises a coalescent solvent. 7. The composition of claim 1 , wherein the thickener is selected from the group consisting of cellulosic thickeners, gelling clays, associative thickeners and any combination thereof; and wherein the associate thickener comprises a hydrophobically modified ethoxylated urethane (HEUR), hydrophobically modified alkali-swellable emulsion (HASE), styrene-maleic anhydride terpolymer (SMAT), acidic acrylate copolymer of ethyl acrylate and methacrylic acid, acrylic terpolymer of ethyl acrylate, methacrylic acid, and/or nonionic urethane surfactant monomer. 8. The composition of claim 1 , wherein the thickener is a combination of a cellulosic thickener in the amount from about 0.01% to about 2% by weight, based on the total composition weight, a gelling clay in the amount from about 0.01% to about 3% by weight, based on the total composition weight, and an associative thickener in the amount from about 0.1% to about 10% by weight, based on the total composition weight. 9. The composition of claim 1 , wherein the composition comprises at least one biocide in the amount from about 0.05% to about 0.2% by weight, based on the total composition weight. 10. The composition of claim 1 , wherein the composition further comprises at least one of the following compound: surfactant, dispersant, humectant. 11. The composition of claim 1 , wherein the binder is in the amount from 1% to 50% resin solids, based on the total composition weight. 12. A wall assembly comprising of two panels which are joined together side-by-side and thereby create a joint seam and the flexible adhesive composition of claim 1 being applied over the joint seam. 13. The wall assembly of claim 12 , wherein the panels are gypsum wallboards, paperless gypsum panels, and gypsum and/or cement based tiles. 14. The wall assembly of claim 12 , wherein the panels are gypsum wallboards. 15. The wall assembly of claim 12 , wherein the assembly does not include joint reinforcement tape. 16. A method for affixing and holding two panels together at a joint seam, the method comprising: creating a joint seam by positioning two panels side-by-side such that the panels abut; and applying the flexible adhesive composition of claim 1 to the joint seam and some panel surface area around the seam. 17. The method of claim 16 , wherein the flexible adhesive composition is allowed to dry and create a polymeric film, and at least one coat of a joint compound is then applied over the polymeric film. 18. The method of claim 16 , wherein the method is performed without joint reinforcement tape. 19. The method of claim 16 , wherein the flexible adhesive composition is spray-applied. 20. The method of claim 16 , wherein the panels are gypsum wallboards.

Assignees

Inventors

Classifications

  • Joint covers (E04B1/6815 takes precedence) · CPC title

  • Homopolymers or copolymers of vinyl acetate · CPC title

  • C09J131/04Primary

    Homopolymers or copolymers of vinyl acetate · CPC title

  • Pointing or jointing materials · CPC title

  • Gypsum (synthetic gypsum C04B18/0445, C04B18/064) · CPC title

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Frequently asked questions

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What does patent US9850407B2 cover?
This invention provides flexible adhesive compositions which can be used instead of joint reinforcement tape for securing a joint seam between abutting panels. Methods using the compositions are provided as well.
Who is the assignee on this patent?
United States Gypsum Co
What technology area does this patent fall under?
Primary CPC classification C09J131/04. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Dec 26 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 5 related publications on this page (citations in our corpus or others sharing the same primary CPC).